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TC237B

Part # TC237B
Description Image Sensor B/W CCD 680x500Pixels 12-Pin XCEPT
Category SENSOR
Availability Out of Stock
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Technical Document


DISCLAIMER: The information provided herein is solely for informational purposes. Customers must be aware of the suitability of this product for their application, and consider that variable factors such as Manufacturer, Product Category, Date Codes, Pictures and Descriptions may differ from available inventory.

TC237B
680- × 500-PIXEL CCD IMAGE SENSOR
SOCS063 – APRIL 2001
1
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
D High Resolution, 1/3-in Solid-State Image
Sensor for NTSC Black and White
Applications
D 340,000 Pixels per Field
D Frame Memory
D 658 (H) × 496 (V) Active Elements in Image
Sensing Area Compatible With Electronic
Centering
D Multimode Readout Capability
– Progressive Scan
– Interlaced Scan
– Dual-Line Readout
– Image Area Line Summing
– Smear Subtraction
D Fast Single-Pulse Clear Capability
D Continuous Electronic Exposure Control
From 1/601/50,000 s
D 7.4-µm Square Pixels
D Advanced Lateral Overflow Drain
Antiblooming
D Low Dark Current
D High Photoresponse Uniformity
D High Dynamic Range
D High Sensitivity
D High Blue Response
D Solid-State Reliability With No Image
Burn-In, Residual Imaging, Image
Distortion, Image Lag, or
Microphonics
description
The TC237B is a frame-transfer, charge-coupled device (CCD) image sensor designed for use in single-chip
black and white National Television Standards Committee (NTSC) TV, computer, and special-purpose
applications that require low cost and small size.
The image-sensing area of the TC237B device is configured into 500 lines with 680 elements in each line.
Twenty-two elements are provided in each line for dark reference. The antiblooming feature of the sensor is
based on an advanced lateral overflow drain concept. The sensor can be operated in a true interlace mode as
a 658(H) × 496(V) sensor with a low dark current. An important feature of the TC237B high-resolution sensor
is the ability to capture a full 340,000 pixels per field. The image sensor also provides high-speed image transfer
capability and a continuous electronic exposure control without the loss of sensitivity and resolution inherent
in other technologies. Charge voltage is converted to signal voltage at 13 µV per electron by a high-performance
structure with a reset and a voltage-reference generator. The signal is further buffered by a low-noise,
two-stage, source-follower amplifier to provide high-output drive capability.
The TC237B sensor is built using TI-proprietary advanced virtual-phase (AVP) technology, which provides
devices with high blue response, low dark current, high photoresponse uniformity, and single-phase clocking.
The TC237B sensor is characterized for operation from –10°C to 45°C.
This MOS device contains limited built-in gate protection. During storage or handling, the device leads should be shorted together
or the device should be placed in conductive foam. In a circuit, unused inputs should always be connected to V
SS
. Under no
circumstances should pin voltages exceed absolute maximum ratings. Avoid shorting OUT to V
SS
during operation to prevent
damage to the amplifier. The device can also be damaged if the output terminals are reverse-biased and an excessive current is
allowed to flow. Specific guidelines for handling devices of this type are contained in the publication Guidelines for Handling
Electrostatic-Discharge-Sensitive (ESDS) Devices and Assemblies available from Texas Instruments.
Copyright 2001, Texas Instruments Incorporated
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
DUAL-IN-LINE PACKAGE
(TOP VIEW)
ODB 1
IAG2 2
SUB 3
ADB 4
OUT1 5
OUT2 6
12 IAG1
11 SAG
10 SAG
9 SUB
8 SRG
7 RST
TI is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
TC237B
680- × 500-PIXEL CCD IMAGE SENSOR
SOCS063 APRIL 2001
2
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
functional block diagram
Image Area With
Blooming Protection
Dark Reference Elements
Storage Area
Clearing Drain
3
1
2
4
6
5
SUB
ODB
IAG2
ADB
OUT2
OUT1
Amplifiers
4 Dummy Elements
9
8
7
10
12
11
IAG1
SAG
SAG
SUB
SRG
RST
sensor topology diagram
Single-Phase Storage Area
Two-Phase Image-Sensing Area
422
Optical Black
(OPB)
4 22 658 Active Pixels
Dummy Pixels
658 Active Pixels
4 Dark Lines
22 Dark-Reference Pixels
658 Active Pixels
496 Lines
500 Lines
TC237B
680- × 500-PIXEL CCD IMAGE SENSOR
SOCS063 APRIL 2001
3
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
Terminal Functions
TERMINAL
I/O
DESCRIPTION
NAME NO.
I/O
DESCRIPTION
ADB 4 I Supply voltage for amplifier drain bias
IAG1 12 I Image area gate 1
IAG2 2 I Image area gate 2
ODB 1 I Supply voltage for drain antiblooming bias
OUT1 5 O Output signal 1
OUT2 6 O Output signal 2
RST 7 I Reset gate
SAG 10, 11 I Storage area gate
SRG 8 I Serial register gate
SUB 3, 9 Substrate
detailed description
The TC237B CCD image sensor consists of four basic functional blocks: the image-sensing area, the image
storage area, the serial register gates, and the low-noise signal processing amplifier block with charge detection
nodes and independent resets. The location of each of these blocks is identified in the functional block diagram.
image-sensing and image storage areas
Figure 1 and Figure 2 show cross sections with potential well diagrams and top views of the image-sensing and
storage area elements. As light enters the silicon in the image-sensing area, electrons are generated and
collected in the wells of the sensing elements. Blooming protection is provided by applying a dc bias to the
overflow drain bias pin. To clear the image before beginning a new integration time (for implementation of
electronic fixed shutter or electronic auto-iris), apply a pulse of at least 1 µs to the overflow drain bias. After
integration is complete, charge voltage is transferred into the storage area. The transfer timing depends on
whether the readout mode is interlace or progressive scan. If the progressive-scan readout mode is selected,
the readout may be performed by using one serial register or at high speed by using both serial registers (see
Figure 3 through Figure 5). A line-summing operation, which is useful in off-chip smear subtraction, can be
implemented before the parallel transfer (see Figure 6).
Twenty-two columns at the left edge of the image-sensing area are shielded from incident light; these elements
provide the dark reference used in subsequent video-processing circuits to restore the video black level. In
addition, four dark lines between the image-sensing and the image storage area prevent charge leakage from
the image-sensing area into the image storage area.
advanced lateral overflow drain
The advanced lateral overflow drain structure is shared by two neighboring pixels and provides several unique
features in the sensor. By varying the dc bias of the drain pin, you can control the blooming protection level and
trade it for the well capacity.
To clear charge voltages in the image area, apply a 10-V pulse for a minimum duration of 1 µs above the nominal
dc bias level. This feature permits a precise control of the integration time on a frame-by-frame basis. The
single-pulse clear capability also reduces smear by eliminating accumulated charge from the pixels before the
start of the integration (single-sided smear).
Application of a negative 1-V pulse to the ODB signal during the parallel transfer is recommended to prevent
slight column-to-column pixel well capacity variations in some artifacts.
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