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2012 ROHM Co., Ltd. All rights reserved.
2012.11 - Rev.C
Data Sheet MCR series - Low Ohmic - < General Purpose >
Derating Curve
When the ambient temperature exceeds 70°C, power dissipation must be adjusted according to the derating curves below.
0
20
40
60
80
100
−55 0 70 100 125
AMBIENT TEMPERATURE (°C)
PERCENT RATED POWER (%)
MCR006 / 100
Characteristics
Guaranteed Value
± (2.0%+0.005Ω)
± (1.0%+0.005Ω)
± (3.0%+0.005Ω)
20
°C
No remarkable abnormality on the appearance.
A new uniform coating of minimum of
95% of the surface being immersed
and no soldering damage.
Without Open.
Compliance Standard(s) : IEC60115−
JISC 5201−
Measurement : +20 / −55 / +20 / +125°C
Soldering condition : 260±5
°C
Duration of immersion : 10±1s
40°C, 93%RH (Relative Humidity)
Test time : 1,000h to 1,048h
± (3.0%+0.005Ω)
± (3.0%+0.005Ω)
± (1.0%+0.005Ω) ※MCR006 only
± (0.5%+0.005Ω)
± (1.0%+0.005Ω)
70°C
Rated voltage (current)
1.5h : ON − 0.5h : OFF
Test time : 1,000h to 1,048h
125°C (MCR006 / 100)
155°C (MCR01 / 03 / 10 / 18 / 25 / 50)
Test time : 1,000h to 1,048h
23±5
°C
, Immersion cleaning, 5±0.5min
Solvent : 2−propanol
−
Test temp.
−55
°C
to +125
°C
100cycle (MCR006)
−55
°C
to +125
°C
5cycle
(MCR01 / 03 / 10 / 18 / 25 / 50 / 100
Rosin·Ethanol : 25% (weight)
Soldering condition : 235±5
°C
Duration of immersion : 2.0±0.5s
Rated voltage (current) ×2.5, 2s.
Maximum overload voltage
See "Products List"
See "Products List"
Test Items
Resistance
Variation of resistance
with temperature
Solderability
Damp heat, steady state
Endurance at 70°C
Endurance
Rapid change of
temperature
Bend strength of
the end face plating
Resistance to solvent
Resistance to
soldering heat
Overload
Test Conditions
Chip weight (typical value)
Parameter Unit
MCR006
YRT
MCR01
MRT
MCR03
ERT
MCR10
EZH
MCR18
EZH
MCR25
JZH
MCR50
JZH
MCR100
JZH
mg/pc 0.150 0.565 2.03 5.00 9.78 16.5 25.8 42.0
Weight
MCR01 / 03 / 10 / 18 / 25 / 50
0
20
40
60
80
100
−55 0 70 100 155
AMBIENT TEMPERATURE (
°
C)
PERCENT RATED POWER (%)
