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20852-81

Part # 20852-81
Description Electromechanical Relay 12VDC80Ohm 25A DPDT (38.1x34.8x73
Category RELAY
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Technical Document


DISCLAIMER: The information provided herein is solely for informational purposes. Customers must be aware of the suitability of this product for their application, and consider that variable factors such as Manufacturer, Product Category, Date Codes, Pictures and Descriptions may differ from available inventory.

Document Number: 28300 For technical questions, contact: aluminumcaps1@vishay.com
www.vishay.com
Revision: 28-May-08 1
Aluminum Capacitors
SMD (Chip) Standard
085 CS
Vishay BCcomponents
NOT
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W
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FEATURES
Polarized aluminum electrolytic capacitors,
non-solid electrolyte, self healing
SMD-version, rectangular case, insulated
Miniaturized, high CV per unit volume, low height
Flexible terminals, reflow and wave solderable
Charge and discharge proof
Supplied in blister tape on reel
APPLICATIONS
SMD technology, boards with restricted mounting height
General applications, consumer electronics, low profile
and lightweight equipment
Decoupling, smoothing, filtering and buffering
MARKING
The capacitors are marked (where possible) with the
following information:
Rated capacitance (in µF)
Rated voltage code (see Table 1), the U
R
code letter
indicates the position of the decimal point in the
capacitance value
Name of manufacturer
‘-’ sign indicating the cathode. The anode is identified by
bevelled edges
Examples for C
R
; U
R
marking:
H22 represents 0.22 µF; 63 V
2G2 represents 2.2 µF; 40 V
22C represents 22 µF; 6.3 V
Table 1
QUICK REFERENCE DATA
DESCRIPTION VALUE
Nominal case sizes
(L x W x H in mm)
8.8 x 3.7 x 3.9 and
11.9 x 3.7 x 3.9
Rated capacitance range, C
R
0.47 to 22 µF
Tolerance on C
R
- 10 to + 50 % or ± 20 %
Rated voltage range, U
R
6.3to63V
Category temperature range - 40 to + 85 °C
Endurance test at 85 °C 1000 hours
Useful life at 85 °C 1500 hours
Useful life at 40 °C;
1.4 x l
R
applied
40 000 hours
Shelf life at 0 V, 85 °C 500 hours
Resistance to soldering
heat test
immersion in solder:
10 s at 260 °Cor 20 s at 215 °C
Based on sectional
specification
IEC 60384-18/CECC 32300
Climatic category IEC 60068 40/085/56
Fig.1 Component outlines
085 CS
139 CLL
longer
life
RATED VOLTAGE MARKING CODE
U
R
(V)
6.3 10 16 25 40 63
Code letter C D E F G H
SELECTION CHART FOR C
R
, U
R
AND RELEVANT NOMINAL CASE SIZES (L x W x H in mm)
C
R
(µF)
U
R
(V)
6.3 10 16 25 40 63
0.47 - - - - - 8.8 x 3.7 x 3.9
1.0 - - - - - 8.8 x 3.7 x 3.9
2.2 - - - - 8.8 x 3.7 x 3.9 11.9 x 3.7 x 3.9
3.3 - - - 8.8 x 3.7 x 3.9 - 11.9 x 3.7 x 3.9
4.7 - - 8.8 x 3.7 x 3.9 - 11.9 x 3.7 x 3.9 -
6.8 - 8.8 x 3.7 x 3.9 - 11.9 x 3.7 x 3.9 - -
10 8.8 x 3.7 x 3.9 - 11.9 x 3.7 x 3.9 - - -
15 - 11.9 x 3.7 x 3.9 - - - -
22 11.9 x 3.7 x 3.9 - - - - -
085 CS
Vishay BCcomponents
Aluminum Capacitors
SMD (Chip) Standard
www.vishay.com For technical questions, contact: aluminumcaps1@vishay.com
Document Number: 28300
2 Revision: 28-May-08
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DIMENSIONS in millimeters
PACKAGING
Tape on reel packaging: 2000 per reel
Detailed tape dimensions see section ‘PACKAGING’
MOUNTING
The capacitors are designed for automatic placement on
printed-circuit boards or hybrid circuits.
Optimum dimensions of soldering pads depend upon
soldering method, mounting accuracy, print lay-out and/or
adjacent components.
For recommended pad dimensions, refer to Fig. 3
andTable2.
Table 2
2 max. 2 max. 2 max.
9 max.
a.
12.2 max.
b.
2 max.
3.9
max.
3.9
max.
3.9
max.
2.7
max.
2.7
max.
2.7
max.
2.7
max.
4.1
max.
4.1
max.
3.9
max.
7.5 10.8
a. Case size 8.8 x 3.7 x 3.9 mm b. Case size 11.9 x 3.7 x 3.9 mm
Fig.2 Dimensional outlines
RECOMMENDED SOLDERING PAD DIMENSIONS in millimeters (placement accuracy ± 0.25 mm)
NOMINAL CASE SIZE
L x W x H
FOR REFLOW SOLDERING FOR WAVE SOLDERING
ABCDEFGABCDEFG
8.8 x 3.7 x 3.9 9.7 3.5 2.9 2.5 3.0 10.1 4.4 13.5 4.1 4.7 3.7 2.9 14.0 8.4
11.9 x 3.7 x 3.9 12.9 6.5 2.9 2.5 6.0 13.3 4.4 16.8 7.4 4.7 3.7 6.1 17.3 8.4
solder land/
solder paste
pattern
solder resist
pattern
occupied
area
tracks or
dummy tracks
E
D
G
C
B
A
F
E
D
G
C
B
A
F
reflow soldering wave soldering
Fig.3 Recommended pad dimensions for reflow and wave soldering
Document Number: 28300 For technical questions, contact: aluminumcaps1@vishay.com
www.vishay.com
Revision: 28-May-08 3
085 CS
Aluminum Capacitors
SMD (Chip) Standard
Vishay BCcomponents
NOT
F
OR
N
E
W
D
E
S
I
G
N
S
SOLDERING
Soldering conditions are defined by the curve, temperature
versus time. The temperature is that measured on the
soldering pad during processing.
For maximum conditions of different soldering methods see
Figs 5, 6 and 7.
Any temperature/time curve which does not exceed the
specified maximum curves may be applied.
AS A GENERAL PRINCIPLE, TEMPERATURE AND
DURATION SHALL BE THE MINIMUM NECESSARY
REQUIRED TO ENSURE GOOD SOLDERING
CONNECTIONS.
Table 3
Table4
b
a
d
c
flow-direction of solder
For dimensions a, b, c and d, refer to Table 3
Flow direction of solder preferably onto side-walls or plus-side of the capacitors
Fig.4 Minimum ditances between 085 CS capacitors on a printed-circuit board for wave soldering
MINIMUM DISTANCES BETWEEN CAPACITORS in millimeters
NOMINAL CASE SIZE
L x W x H
CASE
CODE
a
min.
b
min.
c
min.
d
min.
8.8 x 3.7 x 3.9 1a 12 12 6.8 6.8
11.9 x 3.7 x 3.9 1 15 15 6.8 6.8
CURING CONDITIONS FOR SMD-GLUE
MAX. T
amb
(°C)
MAX. EXPOSURE TIME
(minutes)
125 10
140 3
150 1
160 0.5
280
260
240
220
200
180
160
140
120
100
80
0 50 100 150 200 250
T
Pad
(°C)
Fig.5 Maximum temperature load during infrared reflow soldering
f(s)
280
260
240
220
200
180
160
140
120
100
80
0 50 100 150 200 250
T
Pad
(°C)
Fig.6 Maximum temperature load during vapor phase reflow soldering
f(s)
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