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TN0110N3

Part # TN0110N3
Description MOSFET N-CH 100V 350MA TO92-3
Category RECTIFIER
Availability In Stock
Qty 55
Qty Price
1 - 11 $0.85718
12 - 23 $0.68185
24 - 34 $0.64289
35 - 46 $0.59743
47 + $0.53249
Manufacturer Available Qty
MICROCHIP TECH
Date Code: 0545
  • Shipping Freelance Stock: 1
    Ships Immediately
SUPERTEX INC.
Date Code: 0630
  • Shipping Freelance Stock: 54
    Ships Immediately



Technical Document


DISCLAIMER: The information provided herein is solely for informational purposes. Customers must be aware of the suitability of this product for their application, and consider that variable factors such as Manufacturer, Product Category, Date Codes, Pictures and Descriptions may differ from available inventory.

7-35
7
Low Threshold
TN0106
TN0110
N-Channel Enhancement-Mode
Vertical DMOS FETs
BV
DSS
/R
DS(ON)
I
D(ON)
V
GS(th)
BV
DGS
(max) (min) (max) TO-92 Die
60V 3.0 2A 2.0V TN0106N3
100V 3.0 2A 2.0V TN0110N3 TN0110ND
MIL visual screening available
Order Number / Package
Low Threshold DMOS Technology
These low threshold enhancement-mode (normally-off) transis-
tors utilize a vertical DMOS structure and Supertex’s well-proven
silicon-gate manufacturing process. This combination produces
devices with the power handling capabilities of bipolar transistors
and with the high input impedance and positive temperature
coefficient inherent in MOS devices. Characteristic of all MOS
structures, these devices are free from thermal runaway and
thermally-induced secondary breakdown.
Supertex’s vertical DMOS FETs are ideally suited to a wide range
of switching and amplifying applications where very low threshold
voltage, high breakdown voltage, high input impedance, low input
capacitance, and fast switching speeds are desired.
Package Options
Features
Low threshold — 2.0V max.
High input impedance
Low input capacitance — 50pF typical
Fast switching speeds
Low on resistance
Free from secondary breakdown
Low input and output leakage
Complementary N- and P-channel devices
Applications
Logic level interfaces – ideal for TTL and CMOS
Solid state relays
Battery operated systems
Photo voltaic drives
Analog switches
General purpose line drivers
Telecom switches
Note: See Package Outline section for dimensions.
Ordering Information
Absolute Maximum Ratings
Drain-to-Source Voltage BV
DSS
Drain-to-Gate Voltage BV
DGS
Gate-to-Source Voltage ± 20V
Operating and Storage Temperature -55°C to +150°C
Soldering Temperature* 300°C
*
Distance of 1.6 mm from case for 10 seconds.
TO-92
S G D
7-36
Package I
D
(continuous)* I
D
(pulsed) Power Dissipation
θ
jc
θ
ja
I
DR
*I
DRM
@ T
C
= 25°C °C/W °C/W
TO-92 0.5A 2.0A 1.0W 125 170 0.5A 2.0A
*
I
D
(continuous) is limited by max rated T
j
.
TN0106/TN0110
Thermal Characteristics
Switching Waveforms and Test Circuit
90%
10%
90%
90%
10%
10%
PULSE
GENERATOR
V
DD
R
L
OUTPUT
D.U.T.
t
(ON)
t
d(ON)
t
(OFF)
t
d(OFF)
t
F
t
r
INPUT
INPUT
OUTPUT
10V
V
DD
R
gen
0V
0V
Symbol Parameter Min Typ Max Unit Conditions
BV
DSS
TN0110 100
TN0106 60
V
GS(th)
Gate Threshold Voltage 0.6 2.0 V V
GS
= V
DS
, I
D
= 0.5mA
V
GS(th)
Change in V
GS(th)
with Temperature -3.2 -5.0 mV/°CV
GS
= V
DS
, I
D
= 1.0mA
I
GSS
Gate Body Leakage 100 nA V
GS
= ±20V, V
DS
= 0V
I
DSS
Zero Gate Voltage Drain Current 10 V
GS
= 0V, V
DS
= Max Rating
500 µAV
GS
= 0V, V
DS
= 0.8 Max Rating
T
A
= 125°C
I
D(ON)
ON-State Drain Current 0.75 1.4 V
GS
= 5V, V
DS
= 25V
2.0 3.4 V
GS
= 10V, V
DS
= 25V
R
DS(ON)
2.0 4.5 V
GS
= 4.5V, I
D
= 250mA
1.6 3.0 V
GS
= 10V, I
D
= 500mA
R
DS(ON)
Change in R
DS(ON)
with Temperature 0.6 1.1 %/°CI
D
= 0.5A, V
GS
= 10V
G
FS
Forward Transconductance 225 400 m V
DS
= 25V, I
D
= 500mA
C
ISS
Input Capacitance 50 60
C
OSS
Common Source Output Capacitance 25 35 pF
C
RSS
Reverse Transfer Capacitance 4.0 8.0
t
d(ON)
Turn-ON Delay Time 2.0 5.0
t
r
Rise Time 3.0 5.0
t
d(OFF)
Turn-OFF Delay Time 6.0 7.0
t
f
Fall Time 3.0 6.0
V
SD
Diode Forward Voltage Drop 1.0 1.5 V I
SD
= 0.5A, V
GS
= 0V
t
rr
Reverse Recovery Time 400 ns I
SD
= 0.5A, V
GS
= 0V
Notes:
1. All D.C. parameters 100% tested at 25°C unless otherwise stated. (Pulse test: 300µs pulse, 2% duty cycle.)
2. All A.C. parameters sample tested.
A
VI
D
= 1mA, V
GS
= 0V
Drain-to-Source
Breakdown Voltage
V
GS
= 0V, V
DS
= 25V
f = 1 MHz
Static Drain-to-Source
ON-State Resistance
V
DD
= 25V
ns I
D
= 1.0A
R
GEN
= 25
Electrical Characteristics (@ 25°C unless otherwise specified)
7-37
7
Typical Performance Curves
TN0106/TN0110
Output Characteristics
5
4
3
2
1
0102030 5040
V
DS
(volts)
I
(amperes)
D
Saturation Characteristics
5
4
3
2
1
0246 108
V
DS
(volts)
I
(amperes)
D
Maximum Rated Safe Operating Area
1 100010010
0.1
1.0
10
0.01
V
DS
(volts)
I
(amperes)
D
Thermal Response Characteristics
Thermal Resistance (normalized)
1.0
0.8
0.6
0.4
0.2
0.001 100.01 0.1 1
t
p
(seconds)
Transconductance vs. Drain Current
0.5
0.4
0.3
0.2
0.1
0
0
3.0
.6 1.2 1.8
G
FS
(siemens)
I
D
(amperes)
Power Dissipation vs. Case Temperature
0 15010050
10
8
6
4
2
1257525
T
C
C)°(
D
P (watts)
V
DS
= 25V
8V
6V
4V
2V
TO-92
TO-92
T
C
= 25°C
P
D
= 1W
TO-92 (DC)
TO-92 (pulsed)
8V
6V
4V
2V
2.4
0
0
0 0
T
A
= -55°C
V
GS
= 10V
V
GS
= 10V
T
A
= 25°C
T
A
= 150°C
T
C
= 25°C
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