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RJK0330DPB-00-J0

Part # RJK0330DPB-00-J0
Description MOSFET N-CH 30V 45A LFPAK
Category RECTIFIER
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Technical Document


DISCLAIMER: The information provided herein is solely for informational purposes. Customers must be aware of the suitability of this product for their application, and consider that variable factors such as Manufacturer, Product Category, Date Codes, Pictures and Descriptions may differ from available inventory.

REJ03G1639-0400 Rev.4.00 Apr 10, 2008
Page 1 of 6
RJK0330DPB
Silicon N Channel Power MOS FET
Power Switching
REJ03G1639-0400
Rev.4.00
Apr 10, 2008
Features
High speed switching
Capable of 4.5 V gate drive
Low drive current
High density mounting
Low on-resistance
R
DS(on)
= 2.1 m typ. (at V
GS
= 10 V)
Pb-free
Outline
RENESAS Package code: PTZZ0005DA-A
(Package name: LFPAK)
G
D
SSS
4
1
23
5
1, 2, 3 Source
4 Gate
5 Drain
1
2
3
4
5
Absolute Maximum Ratings
(Ta = 25°C)
Item Symbol Ratings Unit
Drain to source voltage V
DSS
30 V
Gate to source voltage V
GSS
±20 V
Drain current I
D
45 A
Drain peak current I
D(pulse)
Note1
180 A
Body-drain diode reverse drain current I
DR
45 A
Avalanche current I
AP
Note 2
22 A
Avalanche energy E
AR
Note 2
48.4 mJ
Channel dissipation Pch
Note3
55 W
Channel to Case Thermal Resistance θch-C 2.27 °C/W
Channel temperature Tch 150 °C
Storage temperature Tstg –55 to +150 °C
Notes: 1. PW 10 µs, duty cycle 1%
2. Value at Tch = 25°C, Rg 50
3. Tc = 25°C
RJK0330DPB
REJ03G1639-0400 Rev.4.00 Apr 10, 2008
Page 2 of 6
Electrical Characteristics
(Ta = 25°C)
Item Symbol Min Typ Max Unit Test Conditions
Drain to source breakdown
voltage
V
(BR)DSS
30 V I
D
= 10 mA, V
GS
= 0
Gate to source leak current I
GSS
±0.1 µA V
GS
= ±20 V, V
DS
= 0
Zero gate voltage drain current I
DSS
1 µA V
DS
= 30 V, V
GS
= 0
Gate to source cutoff voltage V
GS(off)
1.2 — 2.5 V V
DS
= 10 V, I
D
= 1 mA
R
DS(on)
2.1 2.7 m I
D
= 22.5 A, V
GS
= 10 V
Note4
Static drain to source on state
resistance
R
DS(on)
2.8 3.9 m I
D
= 22.5 A, V
GS
= 4.5 V
Note4
Forward transfer admittance |y
fs
| — 90 — S I
D
= 22.5 A, V
DS
= 10 V
Note4
Input capacitance Ciss 4300 pF
Output capacitance Coss 800 pF
Reverse transfer capacitance Crss 245 pF
V
DS
= 10 V, V
GS
= 0,
f = 1 MHz
Gate Resistance Rg — 0.4 —
Total gate charge Qg 27 nC
Gate to source charge Qgs 10.5 nC
Gate to drain charge Qgd 5.8 nC
V
DD
= 10 V, V
GS
= 4.5 V,
I
D
= 45 A
Turn-on delay time t
d(on)
— 6.8 — ns
Rise time t
r
— 3.9 — ns
Turn-off delay time t
d(off)
— 50 — ns
Fall time t
f
— 5.4 — ns
V
GS
= 10 V, I
D
= 22.5 A,
V
DD
10 V, R
L
= 0.44 ,
Rg = 4.7
Body–drain diode forward voltage V
DF
0.78 1.02 V I
F
= 45 A, V
GS
= 0
Note4
Body–drain diode reverse
recovery time
t
rr
— 36 — ns
I
F
= 45 A, V
GS
= 0
di
F
/ dt = 100 A/ µs
Body–drain diode reverse
recovery charge
Q
rr
— 34 — nC
Notes: 4. Pulse test
RJK0330DPB
REJ03G1639-0400 Rev.4.00 Apr 10, 2008
Page 3 of 6
Main Characteristics
Drain to Source Voltage V
DS
(V)
Drain Current I
D
(A)
Typical Output Characteristics
Drain Current I
D
(A)
Gate to Source Voltage V
GS
(V)
Drain to Source Saturation Voltage
V
DS (on)
(mV)
Drain to Source Saturation Voltage vs.
Gate to Source Voltage
Gate to Source Voltage V
GS
(V)
Typical Transfer Characteristics
Drain Current I
D
(A)
Static Drain to Source on State Resistance
vs. Drain Current
50
40
30
20
10
0
246810
50
40
30
20
10
0
12 34
5
Tc = 75°C
25°C
–25°C
V
DS
= 10 V
Pulse Test
V
GS
= 2.6 V
Pulse Test
1
0.3
0.1
30 3001 10 100 1000
3
200
150
100
50
0
4 8 12 16 20
Pulse Test
I
D
= 20 A
10 A
10
3
V
GS
= 4.5 V
10 V
2.8 V
3.0 V
10 V
3.2 V
4.5 V
Pulse Test
5 A
Drain to Source on State Resistance
R
DS (on)
(m)
Channel Dissipation Pch (W)
Case Temperature Tc (°C)
Power vs. Temperature Derating
80
60
40
20
0
50 100 150 200
Drain Current I
D
(A)
Drain to Source Voltage V
DS
(V)
Maximum Safe Operation Area
0.1
1 10 100
10
100
1000
1
0.1
DC Operation
PW = 10 ms
1 ms
10 µs
Operation in
this area is
limited by R
DS(on)
Tc = 25°C
1 shot Pulse
100 µs
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