Motorola Corp MTP2P50E

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Item Description: MOSFET P-CH 500V 2A TO-220AB
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Motorola Corp 9802
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Technical Document


DISCLAIMER: The information provided herein is solely for informational purposes. Customers must be aware of the suitability of this product for their application, and consider that variable factors such as Manufacturer, Product Category, Date Codes, Pictures and Descriptions may differ from available inventory.

1
Motorola TMOS Power MOSFET Transistor Device Data
P–Channel Enhancement–Mode Silicon Gate
This high voltage MOSFET uses an advanced termination
scheme to provide enhanced voltage–blocking capability without
degrading performance over time. In addition, this advanced TMOS
E–FET is designed to withstand high energy in the avalanche and
commutation modes. The new energy efficient design also offers a
drain–to–source diode with a fast recovery time. Designed for high
voltage, high speed switching applications in power supplies,
converters and PWM motor controls, these devices are particularly
well suited for bridge circuits where diode speed and commutating
safe operating areas are critical and offer additional safety margin
against unexpected voltage transients.
Robust High Voltage Termination
Avalanche Energy Specified
Source–to–Drain Diode Recovery Time Comparable to a Discrete
Fast Recovery Diode
Diode is Characterized for Use in Bridge Circuits
I
DSS
and V
DS(on)
Specified at Elevated Temperature
MAXIMUM RATINGS
(T
C
= 25°C unless otherwise noted)
Rating
Symbol Value Unit
Drain–Source Voltage V
DSS
500 Vdc
Drain–Gate Voltage (R
GS
= 1.0 M) V
DGR
500 Vdc
Gate–Source Voltage — Continuous
Gate–Source Voltage — Non–Repetitive (t
p
10 ms)
V
GS
V
GSM
± 20
± 40
Vdc
Vpk
Drain Current — Continuous
Drain Current — Continuous @ 100°C
Drain Current — Single Pulse (t
p
10 µs)
I
D
I
D
I
DM
2.0
1.6
6.0
Adc
Apk
Total Power Dissipation
Derate above 25°C
P
D
75
0.6
Watts
W/°C
Operating and Storage Temperature Range T
J
, T
stg
55 to 150 °C
Single Pulse Drain–to–Source Avalanche Energy — Starting T
J
= 25°C
(V
DD
= 100 Vdc, V
GS
= 10 Vdc, I
L
= 4.0 Apk, L = 10 mH, R
G
= 25 )
E
AS
80 mJ
Thermal Resistance — Junction to Case
Thermal Resistance — Junction to Ambient
R
θJC
R
θJA
1.67
62.5
°C/W
Maximum Lead Temperature for Soldering Purposes, 1/8 from case for 10 seconds T
L
260 °C
Designer’s Data for “Worst Case” Conditions — The Designer’s Data Sheet permits the design of most circuits entirely from the information presented. SOA Limit
curves — representing boundaries on device characteristics are given to facilitate “worst case” design.
E–FET and Designer’s are trademarks of Motorola, Inc. TMOS is a registered trademark of Motorola, Inc.
Preferred devices are Motorola recommended choices for future use and best overall value.
REV 1
Order this document
by MTP2P50E/D
SEMICONDUCTOR TECHNICAL DATA
Motorola, Inc. 1995
TMOS POWER FET
2.0 AMPERES
500 VOLTS
R
DS(on)
= 6.0 OHM
Motorola Preferred Device
CASE 221A–06, Style 5
TO–220AB
D
S
G
2
Motorola TMOS Power MOSFET Transistor Device Data
ELECTRICAL CHARACTERISTICS
(T
J
= 25°C unless otherwise noted)
Characteristic
Symbol Min Typ Max Unit
OFF CHARACTERISTICS
Drain–Source Breakdown Voltage
(V
GS
= 0 Vdc, I
D
= 250 µAdc)
Temperature Coefficient (Positive)
V
(BR)DSS
500
564
Vdc
mV/°C
Zero Gate Voltage Drain Current
(V
DS
= 500 Vdc, V
GS
= 0 Vdc)
(V
DS
= 500 Vdc, V
GS
= 0 Vdc, T
J
= 125°C)
I
DSS
10
100
µAdc
Gate–Body Leakage Current (V
GS
= ±20 Vdc, V
DS
= 0) I
GSS
100 nAdc
ON CHARACTERISTICS (1)
Gate Threshold Voltage
(V
DS
= V
GS
, I
D
= 250 µAdc)
Temperature Coefficient (Negative)
V
GS(th)
2.0
3.0
4.0
4.0
Vdc
mV/°C
Static Drain–Source On–Resistance (V
GS
= 10 Vdc, I
D
= 1.0 Adc) R
DS(on)
4.5 6.0 Ohm
Drain–Source On–Voltage (V
GS
= 10 Vdc)
(I
D
= 2.0 Adc)
(I
D
= 1.0 Adc, T
J
= 125°C)
V
DS(on)
9.5
14.4
12.6
Vdc
Forward Transconductance (V
DS
= 15 Vdc, I
D
= 1.0 Adc) g
FS
1.5 2.9 mhos
DYNAMIC CHARACTERISTICS
Input Capacitance
(V
DS
= 25 Vdc, V
GS
= 0 Vdc,
f = 1.0 MHz)
C
iss
845 1183 pF
Output Capacitance
(V
DS
= 25 Vdc, V
GS
= 0 Vdc,
f = 1.0 MHz)
C
oss
100 140
Reverse Transfer Capacitance
f = 1.0 MHz)
C
rss
26 52
SWITCHING CHARACTERISTICS (2)
Turn–On Delay Time
(V
DD
= 250 Vdc, I
D
= 2.0 Adc,
V
GS
= 10 Vdc,
R
G
= 9.1 )
t
d(on)
12 24 ns
Rise Time
(V
DD
= 250 Vdc, I
D
= 2.0 Adc,
V
GS
= 10 Vdc,
R
G
= 9.1 )
t
r
14 28
Turn–Off Delay Time
V
GS
= 10 Vdc,
R
G
= 9.1 )
t
d(off)
21 42
Fall Time
G
= 9.1 )
t
f
19 38
Gate Charge
(See Figure 8)
(V
DS
= 400 Vdc, I
D
= 2.0 Adc,
V
GS
= 10 Vdc)
Q
T
19 27 nC
(See Figure 8)
(V
DS
= 400 Vdc, I
D
= 2.0 Adc,
V
GS
= 10 Vdc)
Q
1
3.7
(V
DS
= 400 Vdc, I
D
= 2.0 Adc,
V
GS
= 10 Vdc)
Q
2
7.9
Q
3
9.9
SOURCE–DRAIN DIODE CHARACTERISTICS
Forward On–Voltage (1)
(I
S
= 2.0 Adc, V
GS
= 0 Vdc)
(I
S
= 2.0 Adc, V
GS
= 0 Vdc, T
J
= 125°C)
V
SD
2.3
1.85
3.5
Vdc
Reverse Recovery Time
(See Figure 14)
(I
S
= 2.0 Adc, V
GS
= 0 Vdc,
dI
S
/dt = 100 A/µs)
t
rr
223
ns
(See Figure 14)
(I
S
= 2.0 Adc, V
GS
= 0 Vdc,
dI
S
/dt = 100 A/µs)
t
a
161
(I
S
= 2.0 Adc, V
GS
= 0 Vdc,
dI
S
/dt = 100 A/µs)
t
b
62
Reverse Recovery Stored Charge Q
RR
1.92 µC
INTERNAL PACKAGE INDUCTANCE
Internal Drain Inductance
(Measured from contact screw on tab to center of die)
(Measured from the drain lead 0.25 from package to center of die)
L
D
3.5
4.5
nH
Internal Source Inductance
(Measured from the source lead 0.25 from package to source bond pad)
L
S
7.5 nH
(1) Pulse Test: Pulse Width 300 µs, Duty Cycle 2%.
(2) Switching characteristics are independent of operating junction temperature.
3
Motorola TMOS Power MOSFET Transistor Device Data
TYPICAL ELECTRICAL CHARACTERISTICS
0 4 8 28
0
1
2
3
4
V
DS
, DRAIN–TO–SOURCE VOLTAGE (VOLTS)
Figure 1. On–Region Characteristics
I
D
, DRAIN CURRENT (AMPS)
2 3 4 5 6 7
0
1
2
3
4
I
D
, DRAIN CURRENT (AMPS)
V
GS
, GATE–TO–SOURCE VOLTAGE (VOLTS)
Figure 2. Transfer Characteristics
0 1 2 2.5 3.5 4
0
2
6
10
R
DS(on)
, DRAIN-TO-SOURCE RESISTANCE (OHMS)
0 1 2 3 4
4
4.5
5
5.5
6
I
D
, DRAIN CURRENT (AMPS)
Figure 3. On–Resistance versus Drain Current
and Temperature
I
D
, DRAIN CURRENT (AMPS)
Figure 4. On–Resistance versus Drain Current
and Gate Voltage
0.5
1
1.5
2
R
DS(on)
1
10
100
1000
T
J
, JUNCTION TEMPERATURE (
°
C)
Figure 5. On–Resistance Variation with
Temperature
V
DS
, DRAIN–TO–SOURCE VOLTAGE (VOLTS)
Figure 6. Drain–To–Source Leakage
Current versus Voltage
, DRAIN-TO-SOURCE RESISTANCE (OHMS)
, DRAIN-TO-SOURCE RESISTANCE
(NORMALIZED)
I
DSS
, LEAKAGE (nA)
T
J
= 25
°
C V
DS
10 V
T
J
= –55
°
C
25
°
C
100
°
C
T
J
= 100
°
C
T
J
= 25
°
C
V
GS
= 0 V
V
GS
= 10 V
V
GS
= 10 V
V
GS
= 10 V
I
D
= 1 A
12 16
6 V
5 V
3.5
2.5
1.5
0.5
2.5 3.5 4.5 5.5 6.5
4
8
31.50.5
25
°
C
55
°
C
V
GS
= 10 V
15 V
50 25 0 25 50 75 100 125 150 0 10050 150 200 250 500300 350 400 450
T
J
= 125
°
C
100
°
C
25
°
C
0.5 1.5 2.5 3.5
3.5
2.5
1.5
0.5
20 24
4 V
8 V
7 V
5.75
5.25
4.75
4.25
R
DS(on)
123NEXT

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