16
LT1764A Series
1764afb
all sources of thermal resistance from junction to ambient.
Additional heat sources mounted nearby must also be
considered.
For surface mount devices, heat sinking is accomplished
by using the heat spreading capabilities of the PC board
and its copper traces. Surface mount heatsinks and plated
through-holes can also be used to spread the heat gener-
ated by power devices.
The following table lists thermal resistance for several dif-
ferent board sizes and copper areas. All measurements were
taken in still air on 1/16" FR-4 board with one ounce copper.
Table 3. Q Package, 5-Lead DD
COPPER AREA
THERMAL RESISTANCE
TOPSIDE* BACKSIDE BOARD AREA (JUNCTION-TO-AMBIENT)
2500mm
2
2500mm
2
2500mm
2
23°C/W
1000mm
2
2500mm
2
2500mm
2
25°C/W
125mm
2
2500mm
2
2500mm
2
33°C/W
*Device is mounted on topside.
T Package, 5-Lead TO-220
Thermal Resistance (Junction-to-Case) = 2.5°C/W
Calculating Junction Temperature
Example: Given an output voltage of 3.3V, an input voltage
range of 4V to 6V, an output current range of 0mA to
500mA and a maximum ambient temperature of 50°C,
what will the maximum junction temperature be?
The power dissipated by the device will be equal to:
I
OUT(MAX)
(V
IN(MAX)
– V
OUT
) + I
GND
(V
IN(MAX)
)
where,
I
OUT(MAX)
= 500mA
V
IN(MAX)
= 6V
I
GND
at (I
OUT
= 500mA, V
IN
= 6V) = 10mA
So,
P = 500mA(6V – 3.3V) + 10mA(6V) = 1.41W
Using a DD package, the thermal resistance will be in the
range of 23°C/W to 33°C/W depending on the copper
area. So the junction temperature rise above ambient will
be approximately equal to:
1.41W(28°C/W) = 39.5°C
The maximum junction temperature will then be equal to
the maximum junction temperature rise above ambient
plus the maximum ambient temperature or:
T
JMAX
= 50°C + 39.5°C = 89.5°C
Protection Features
The LT1764A regulators incorporate several protection
features which make them ideal for use in battery-powered
circuits. In addition to the normal protection features
associated with monolithic regulators, such as current
limiting and thermal limiting, the devices are protected
against reverse input voltages, reverse output voltages
and reverse voltages from output to input.
Current limit protection and thermal overload protection
are intended to protect the device against current overload
conditions at the output of the device. For normal opera-
tion, the junction temperature should not exceed 125°C.
The input of the device will withstand reverse voltages
of 20V. Current flow into the device will be limited to
less than 1mA and no negative voltage will appear at the
output. The device will protect both itself and the load.
This provides protection against batteries which can be
plugged in backward.
The output of the LT1764A-X can be pulled below ground
without damaging the device. If the input is left open circuit
or grounded, the output can be pulled below ground by
20V. For fixed voltage versions, the output will act like a
large resistor, typically 5k or higher, limiting current flow
to typically less than 600µA. For adjustable versions, the
output will act like an open circuit; no current will flow out
of the pin. If the input is powered by a voltage source, the
output will source the short-circuit current of the device
and will protect itself by thermal limiting. In this case,
grounding the SHDN pin will turn off the device and stop
the output from sourcing the short-circuit current.
The ADJ pin of the adjustable device can be pulled above
or below ground by as much as 7V without damaging the
device. If the input is left open circuit or grounded, the ADJ
pin will act like an open circuit when pulled below ground
and like a large resistor (typically 5k) in series with a diode
when pulled above ground.
APPLICATIONS INFORMATION
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