LP3961
,
LP3964
SNVS056J –MAY 2000–REVISED JUNE 2015
www.ti.com
Table of Contents
7.4 Device Functional Modes........................................ 13
1 Features.................................................................. 1
8 Application and Implementation ........................ 14
2 Applications ........................................................... 1
8.1 Application Information .......................................... 14
3 Description ............................................................. 1
8.2 Typical Applications ................................................ 14
4 Revision History..................................................... 2
9 Power Supply Recommendations...................... 19
5 Pin Configurations and Functions....................... 3
10 Layout................................................................... 19
6 Specifications......................................................... 4
10.1 Layout Guidelines ................................................. 19
6.1 Absolute Maximum Ratings ...................................... 4
10.2 Layout Example .................................................... 19
6.2 ESD Ratings.............................................................. 4
10.3 Heatsinking TO-220 Packages ............................. 20
6.3 Recommended Operating Conditions....................... 4
11 Device and Documentation Support ................. 21
6.4 Thermal Information.................................................. 4
11.1 Related Links ........................................................ 21
6.5 Electrical Characteristics........................................... 5
11.2 Community Resources.......................................... 21
6.6 Typical Characteristics ............................................. 7
11.3 Trademarks........................................................... 21
7 Detailed Description............................................ 10
11.4 Electrostatic Discharge Caution............................ 21
7.1 Overview ................................................................. 10
11.5 Glossary................................................................ 21
7.2 Functional Block Diagram....................................... 10
12 Mechanical, Packaging, and Orderable
7.3 Feature Description................................................. 11
Information ........................................................... 21
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision I (December 2014) to Revision J Page
• Changed pin names to conform to TI nomenclature (V
OUT
to OUT, V
IN
to IN)....................................................................... 1
• Changed "I" to "O" to correct I/O type for ERROR flag ......................................................................................................... 3
• Deleted Lead temperature row - info in POA ........................................................................................................................ 4
• Deleted heatsinking sections re TO-263 and SOT-223 packages; not consistent with updated thermal metrics .............. 20
Changes from Revision H (April 2013) to Revision I Page
• Added Pin Configuration and Functions section, Handling Rating table, Feature Description section, Device
Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout
section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information
section ................................................................................................................................................................................... 1
Changes from Revision G (April 2013) to Revision H Page
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