Orderable Device Status
(1)
Package
Type
Package
Drawing
Pins Package
Qty
Eco Plan
(2)
Lead/Ball Finish MSL Peak Temp
(3)
78ST133VC NRND SIP MOD
ULE
EFD 3 25 Pb-Free
(RoHS)
Call TI N / A for Pkg Type
78ST136HC NRND SIP MOD
ULE
EFA 3 25 Pb-Free
(RoHS)
Call TI N / A for Pkg Type
78ST136SC OBSOLETE SIP MOD
ULE
EFC 3 TBD Call TI Call TI
78ST136SCT OBSOLETE SIP MOD
ULE
EFC 3 TBD Call TI Call TI
78ST136VC OBSOLETE SIP MOD
ULE
EFD 3 TBD Call TI Call TI
78ST151HC OBSOLETE SIP MOD
ULE
EFA 3 TBD Call TI Call TI
78ST151SC OBSOLETE SIP MOD
ULE
EFC 3 TBD Call TI Call TI
78ST151SCT OBSOLETE SIP MOD
ULE
EFC 3 TBD Call TI Call TI
78ST151VC OBSOLETE SIP MOD
ULE
EFD 3 TBD Call TI Call TI
78ST165HC NRND SIP MOD
ULE
EFA 3 25 Pb-Free
(RoHS)
Call TI N / A for Pkg Type
78ST165SC NRND SIP MOD
ULE
EFC 3 25 Pb-Free
(RoHS)
Call TI Level-1-215C-UNLIM
78ST165SCT OBSOLETE SIP MOD
ULE
EFC 3 TBD Call TI Call TI
78ST165VC NRND SIP MOD
ULE
EFD 3 TBD Call TI Call TI
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
PACKAGE OPTION ADDENDUM
www.ti.com
6-Dec-2006
Addendum-Page 2
