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5962-8764701CA

Part # 5962-8764701CA
Description NAND Gate 4-Element 2-IN CMOS14-Pin CDIP Tube
Category Microcircuit
Availability In Stock
Qty 8
Qty Price
1 - 1 $11.76022
2 - 3 $9.35472
4 - 5 $8.82017
6 - 6 $8.19652
7 + $7.30559
Manufacturer Available Qty
TEXAS INSTRUMENTS / HARRIS
Date Code: 9652
  • Shipping Freelance Stock: 8
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Technical Document


DISCLAIMER: The information provided herein is solely for informational purposes. Customers must be aware of the suitability of this product for their application, and consider that variable factors such as Manufacturer, Product Category, Date Codes, Pictures and Descriptions may differ from available inventory.

 
   
  
SCLS077E − MARCH 1984 − REVISED NOVEMBER 2003
4
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
PARAMETER MEASUREMENT INFORMATION
VOLTAGE WAVEFORMS
PROPAGATION DELAY AND OUTPUT TRANSITION TIMES
50%
50%
10%10%
90%
V
CC
V
OH
V
OL
0 V
t
f
Input
In-Phase
Output
50%
t
PLH
t
PHL
50%
10% 10%
90%
V
OH
V
OL
t
f
t
PHL
t
PLH
Out-of-Phase
Output
LOAD CIRCUIT
Test
Point
From Output
Under Test
C
L
= 50 pF
(see Note A)
V
CC
R
L
= 1 kΩ
NOTES: A. C
L
includes probe and test-fixture capacitance.
B. Phase relationships between waveforms were chosen arbitrarily. All input pulses are supplied by generators having the following
characteristics: PRR ≤ 1 MHz, Z
O
= 50 Ω, t
r
= 6 ns, t
f
= 6 ns.
C. The outputs are measured one at a time with one input transition per measurement.
VOLTAGE WAVEFORM
INPUT RISE AND FALL TIMES
50%50%
10%10%
90% 90%
V
CC
0 V
t
r
t
f
Input
Figure 1. Load Circuit and Voltage Waveforms
PACKAGING INFORMATION
Orderable Device Status
(1)
Package
Type
Package
Drawing
Pins Package
Qty
Eco Plan
(2)
Lead/Ball Finish MSL Peak Temp
(3)
5962-87647012A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type
5962-8764701CA ACTIVE CDIP J 14 1 TBD A42 SNPB N / A for Pkg Type
SN54HC03J ACTIVE CDIP J 14 1 TBD A42 SNPB N / A for Pkg Type
SN74HC03D ACTIVE SOIC D 14 50 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN74HC03DE4 ACTIVE SOIC D 14 50 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN74HC03DR ACTIVE SOIC D 14 2500 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN74HC03DRE4 ACTIVE SOIC D 14 2500 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN74HC03DRG4 ACTIVE SOIC D 14 2500 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN74HC03DT ACTIVE SOIC D 14 250 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN74HC03DTE4 ACTIVE SOIC D 14 250 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN74HC03N ACTIVE PDIP N 14 25 Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
SN74HC03N3 OBSOLETE PDIP N 14 TBD Call TI Call TI
SN74HC03NE4 ACTIVE PDIP N 14 25 Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
SN74HC03NSR ACTIVE SO NS 14 2000 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN74HC03NSRE4 ACTIVE SO NS 14 2000 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN74HC03PW ACTIVE TSSOP PW 14 90 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN74HC03PWE4 ACTIVE TSSOP PW 14 90 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN74HC03PWR ACTIVE TSSOP PW 14 2000 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN74HC03PWRE4 ACTIVE TSSOP PW 14 2000 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SNJ54HC03FK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type
SNJ54HC03J ACTIVE CDIP J 14 1 TBD A42 SNPB N / A for Pkg Type
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
PACKAGE OPTION ADDENDUM
www.ti.com
6-Dec-2006
Addendum-Page 1
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
PACKAGE OPTION ADDENDUM
www.ti.com
6-Dec-2006
Addendum-Page 2
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