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Part # 3000
Description DUP RCPT PORTABLE OUTLET BX
Category LED
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Technical Document


DISCLAIMER: The information provided herein is solely for informational purposes. Customers must be aware of the suitability of this product for their application, and consider that variable factors such as Manufacturer, Product Category, Date Codes, Pictures and Descriptions may differ from available inventory.

Dual-Core Intel® Xeon® Processor 3000 Series Datasheet 99
Boxed Processor Specifications
7.3 Thermal Specifications
This section describes the cooling requirements of the fan heatsink solution used by the
boxed processor.
7.3.1 Boxed Processor Cooling Requirements
The boxed processor may be directly cooled with a fan heatsink. However, meeting the
processor's temperature specification is also a function of the thermal design of the
entire system, and ultimately the responsibility of the system integrator. The processor
temperature specification is listed in Chapter 5. The boxed processor fan heatsink is
able to keep the processor temperature within the specifications (see Table 5-1) in
chassis that provide good thermal management. For the boxed processor fan heatsink
to operate properly, it is critical that the airflow provided to the fan heatsink is
unimpeded. Airflow of the fan heatsink is into the center and out of the sides of the fan
heatsink. Airspace is required around the fan to ensure that the airflow through the fan
heatsink is not blocked. Blocking the airflow to the fan heatsink reduces the cooling
efficiency and decreases fan life. Figure 7-7 and Figure 7-8 illustrate an acceptable
airspace clearance for the fan heatsink. The air temperature entering the fan should be
kept below 38 ºC. Again, meeting the processor's temperature specification is the
responsibility of the system integrator.
Figure 7-6. Baseboard Power Header Placement Relative to Processor Socket
Boxed Proc PwrHeaderPlacement
B
C
R110
[4.33]
Boxed Processor Specifications
100 Dual-Core Intel® Xeon® Processor 3000 Series Datasheet
Figure 7-7. Boxed Processor Fan Heatsink Airspace Keepout Requirements (Side 1 View)
Figure 7-8. Boxed Processor Fan Heatsink Airspace Keepout Requirements (Side 2 View)
Dual-Core Intel® Xeon® Processor 3000 Series Datasheet 101
Boxed Processor Specifications
7.3.2 Variable Speed Fan
If the boxed processor fan heatsink 4-pin connector is connected to a 3-pin
motherboard header it will operate as follows:
The boxed processor fan will operate at different speeds over a short range of internal
chassis temperatures. This allows the processor fan to operate at a lower speed and
noise level, while internal chassis temperatures are low. If internal chassis temperature
increases beyond a lower set point, the fan speed will rise linearly with the internal
temperature until the higher set point is reached. At that point, the fan speed is at its
maximum. As fan speed increases, so does fan noise levels. Systems should be
designed to provide adequate air around the boxed processor fan heatsink that remains
cooler then lower set point. These set points, represented in Figure 7-9 and Table 7-2,
can vary by a few degrees from fan heatsink to fan heatsink. The internal chassis
temperature should be kept below 38 ºC. Meeting the processor's temperature
specification (see Chapter 5) is the responsibility of the system integrator.
The motherboard must supply a constant +12 V to the processor's power header to
ensure proper operation of the variable speed fan for the boxed processor. Refer to
Table 7-1 for the specific requirements.
Figure 7-9. Boxed Processor Fan Heatsink Set Points
Lower Set Point
Lowest Noise Level
Internal Chassis Temperature (Degrees C)
X
YZ
Increasing Fan
Speed & Noise
Higher Set Point
Highest Noise Level
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