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3000

Part # 3000
Description DUP RCPT PORTABLE OUTLET BX
Category LED
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Technical Document


DISCLAIMER: The information provided herein is solely for informational purposes. Customers must be aware of the suitability of this product for their application, and consider that variable factors such as Manufacturer, Product Category, Date Codes, Pictures and Descriptions may differ from available inventory.

Boxed Processor Specifications
96 Dual-Core Intel® Xeon® Processor 3000 Series Datasheet
7.1 Mechanical Specifications
7.1.1 Boxed Processor Cooling Solution Dimensions
This section documents the mechanical specifications of the boxed processor. The
boxed processor will be shipped with an unattached fan heatsink. Figure 7-1 shows a
mechanical representation of the boxed processor.
Clearance is required around the fan heatsink to ensure unimpeded airflow for proper
cooling. The physical space requirements and dimensions for the boxed processor with
assembled fan heatsink are shown in Figure 7-2 (Side View), and Figure 7-3 (Top
View). The airspace requirements for the boxed processor fan heatsink must also be
incorporated into new baseboard and system designs. Airspace requirements are
shown in Figure 7-7 and Figure 7-8. Note that some figures have centerlines shown
(marked with alphabetic designations) to clarify relative dimensioning.
Notes:
1. Diagram does not show the attached hardware for the clip design and is provided only as a mechanical
representation.
Figure 7-2. Space Requirements for the Boxed Processor (Side View)
Figure 7-3. Space Requirements for the Boxed Processor (Top View)
95.0
[3.74]
10.0
[0.39]
25.0
[0.98]
81.3
[3.2]
Dual-Core Intel® Xeon® Processor 3000 Series Datasheet 97
Boxed Processor Specifications
7.1.2 Boxed Processor Fan Heatsink Weight
The boxed processor fan heatsink will not weigh more than 550 grams. See Chapter 5
and the Dual-Core Intel
®
Xeon
®
Processor 3000 Series Thermal and Mechanical Design
Guidelines for details on the processor weight and heatsink requirements.
7.1.3 Boxed Processor Retention Mechanism and Heatsink
Attach Clip Assembly
The boxed processor thermal solution requires a heatsink attach clip assembly, to
secure the processor and fan heatsink in the baseboard socket. The boxed processor
will ship with the heatsink attach clip assembly.
7.2 Electrical Requirements
7.2.1 Fan Heatsink Power Supply
The boxed processor's fan heatsink requires a +12 V power supply. A fan power cable
will be shipped with the boxed processor to draw power from a power header on the
baseboard. The power cable connector and pinout are shown in Figure 7-5. Baseboards
must provide a matched power header to support the boxed processor. Table 7-1
contains specifications for the input and output signals at the fan heatsink connector.
The fan heatsink outputs a SENSE signal that is an open- collector output that pulses at
a rate of 2 pulses per fan revolution. A baseboard pull-up resistor provides V
OH
to
match the system board-mounted fan speed monitor requirements, if applicable. Use of
the SENSE signal is optional. If the SENSE signal is not used, pin 3 of the connector
should be tied to GND.
The fan heatsink receives a PWM signal from the motherboard from the 4th pin of the
connector labeled as CONTROL.
Figure 7-4. Space Requirements for the Boxed Processor (Overall View)
Boxed Proc OverallView
Boxed Processor Specifications
98 Dual-Core Intel® Xeon® Processor 3000 Series Datasheet
The boxed processor's fanheat sink requires a constant +12 V supplied to pin 2 and
does not support variable voltage control or 3-pin PWM control.
The power header on the baseboard must be positioned to allow the fan heatsink power
cable to reach it. The power header identification and location should be documented in
the platform documentation, or on the system board itself. Figure 7-6 shows the
location of the fan power connector relative to the processor socket. The baseboard
power header should be positioned within 110 mm [4.33 inches] from the center of the
processor socket.
Figure 7-5. Boxed Processor Fan Heatsink Power Cable Connector Description
Table 7-1. Fan Heatsink Power and Signal Specifications
Description Min Typ Max Unit Notes
+12 V: 12 volt fan power supply 11.4 12 12.6 V -
IC:
Peak fan steady-state current draw
Average fan steady-state current draw
Max fan start-up current draw
Fan start-up current draw maximum duration
3.0
2.0
3.0
1.0
A
A
A
Second
-
SENSE: SENSE frequency 2 pulses per fan
revolution
1
Notes:
1. Baseboard should pull this pin up to 5 V with a resistor.
CONTROL 21 25 28 Hz
2, 3
2. Open drain type, pulse width modulated.
3. The fan will have a pull-up resistor for this signal, maximum of 5.25 V.
C
Pin
Signal
12
34
1
2
3
4
GND
+12 V
SENSE
CONTROL
Straight square pin, 4-pin terminal housing with
polarizing ribs and friction locking ramp.
0.100" pitch, 0.025" square pin width.
Match with straight pin, friction lock header on
mainboard.
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