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Part # 3000
Description DUP RCPT PORTABLE OUTLET BX
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Technical Document


DISCLAIMER: The information provided herein is solely for informational purposes. Customers must be aware of the suitability of this product for their application, and consider that variable factors such as Manufacturer, Product Category, Date Codes, Pictures and Descriptions may differ from available inventory.

Dual-Core Intel® Xeon® Processor 3000 Series Datasheet 93
Features
6.3 Enhanced Intel
®
SpeedStep
®
Technology
The processor supports Enhanced Intel SpeedStep
®
Technology. This technology
enables the processor to switch between multiple frequency and voltage points, which
results in platform power savings. Enhanced Intel SpeedStep
Technology requires
support for dynamic VID transitions in the platform. Switching between voltage/
frequency states is software controlled.
Note: Not all processors are capable of supporting Enhanced Intel SpeedStep
®
Technology.
More details on which processor frequencies support this feature is provided in the
Dual-Core Intel
®
Xeon
®
Processor 3000 Series Specification Update.
Enhanced Intel SpeedStep
®
Technology creates processor performance states
(P-states) or voltage/frequency operating points. P-states are lower power capability
states within the Normal state as shown in Figure 6-1. Enhanced Intel SpeedStep
®
Technology enables real-time dynamic switching between frequency and voltage
points. It alters the performance of the processor by changing the bus to core
frequency ratio and voltage. This allows the processor to run at different core
frequencies and voltages to best serve the performance and power requirements of the
processor and system. The processor has hardware logic that coordinates the
requested voltage (VID) between the processor cores. The highest voltage that is
requested for either of the processor cores is selected for that processor package. Note
that the front side bus is not altered; only the internal core frequency is changed. To
run at reduced power consumption, the voltage is altered in step with the bus ratio.
Features
94 Dual-Core Intel® Xeon® Processor 3000 Series Datasheet
The following are key features of Enhanced Intel SpeedStep
®
Technology:
Multiple voltage/frequency operating points provide optimal performance at
reduced power consumption.
Voltage/frequency selection is software controlled by writing to processor MSRs
(Model Specific Registers), thus eliminating chipset dependency.
If the target frequency is higher than the current frequency, V
CC
is incremented
in steps (+12.5 mV) by placing a new value on the VID signals and the
processor shifts to the new frequency. Note that the top frequency for the
processor can not be exceeded.
If the target frequency is lower than the current frequency, the processor shifts
to the new frequency and V
CC
is then decremented in steps (-12.5 mV) by
changing the target VID through the VID signals.
§
Dual-Core Intel® Xeon® Processor 3000 Series Datasheet 95
Boxed Processor Specifications
7 Boxed Processor Specifications
The processor is also offered as an Intel boxed processor. Intel boxed processors are
intended for system integrators who build systems from baseboards and standard
components. The boxed processor will be supplied with a cooling solution. This chapter
documents baseboard and system requirements for the cooling solution that will be
supplied with the boxed processor. This chapter is particularly important for OEMs that
manufacture baseboards for system integrators. Figure 7-1 shows a mechanical
representation of a boxed processor.
Note: Unless otherwise noted, all figures in this chapter are dimensioned in millimeters and
inches [in brackets].
Note: Drawings in this section reflect only the specifications on the Intel boxed processor
product. These dimensions should not be used as a generic keep-out zone for all
cooling solutions. It is the system designers’ responsibility to consider their proprietary
cooling solution when designing to the required keep-out zone on their system
platforms and chassis. Refer to the Dual-Core Intel
®
Xeon
®
Processor 3000 Series
Thermal and Mechanical Design Guidelines for further guidance.
Note: The airflow of the fan heatsink is into the center and out of the sides of the fan heatsink.
Figure 7-1. Mechanical Representation of the Boxed Processor
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