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Technical Document


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Dual-Core Intel® Xeon® Processor 3000 Series Datasheet 7
Revision History
Revision
Number
Description Date
-001 Initial release September 2006
-002
Updated Features Page
Updated Table 2-4, 2-15
Added Section 2.8, “PECI DC Specifications”
Updated Figure 3-5, 3-6, 3-7
Updated Section 5.4, “Platform Environment Control Interface (PECI)“
Updated Figure 6, 6-1
Added specificaitons for Dual-Core Intel Xeon 3065, 3075, 3085 processors
Added specifications for 1333 MHz FSB
Added support for Extended Stop Grant State, Extended Stop Grant Snoop States
Added new thermal profile table and figure
November 2007
8 Dual-Core Intel® Xeon® Processor 3000 Series Datasheet
Dual-Core Intel
®
Xeon
®
Processor
3000 Series Features
The Dual-Core Intel
®
Xeon
®
processor 3000 series deliver Intel's advanced, powerful processors for
unit processor servers. The processor is designed to deliver performance across applications and
usages where end-users can truly appreciate and experience the performance.
Intel
®
64
Φ
enables the processor to execute operating systems and applications written to take
advantage of the Intel 64. The processor supporting Enhanced Intel Speedstep
®
technology allows
tradeoffs to be made between performance and power consumption.
The Dual-Core Intel
®
Xeon
®
processor 3000 series also include the Execute Disable Bit capability.
This feature, combined with a supported operating system, allows memory to be marked as
executable or non-executable.
The Dual-Core Intel
®
Xeon
®
processor 3000 series support Intel
®
Virtualization Technology.
Virtualization Technology provides silicon-based functionality that works together with compatible
Virtual Machine Monitor (VMM) software to improve on software-only solutions.
The Dual-Core Intel® Xeon® processor 3000 series support Intel® Trusted Execution Technology
(Intel® TXT). Intel® Trusted Execution Technology (Intel® TXT) is a security technology.
Available at 2.66 GHz, 2.40 GHz, 2.13 GHz,
and 1.86 GHz (Dual-Core Intel
®
Xeon
®
processors 3070, 3060, 3050, and 3040
only)
Available at 3.00 GHz, 2.66 GHz, 2.40 GHz,
and 2.33 GHz (Dual-Core Intel® Xeon®
processors 3085, 3075, 3070, 3065, and
3060 only)
Enhanced Intel Speedstep® Technology
•Supports Intel® 64
Φ
Supports Intel® Virtualization Technology
Supports Intel® Trusted Execution
Technology (Intel® TXT)
•Supports Intel
®
Virtualization Technology
(Dual-Core Intel
®
Xeon
®
processor 3000
series)
Supports Execute Disable Bit capability
Binary compatible with applications running
on previous members of the Intel
microprocessor line
FSB frequency at 1066, 1333 MHz
Advance Dynamic Execution
Very deep out-of-order execution
Enhanced branch prediction
Optimized for 32-bit applications running on
advanced 32-bit operating systems
Two 16-KB Level 1 data caches
4 MB Advanced Smart Cache (Dual-Core
Intel
®
Xeon
®
processors 3070 and 3060
only)
2 MB Advanced Smart Cache (Dual-Core
Intel
®
Xeon
®
processors 3050 and 3040
only)
Advanced Digital Media Boost
Enhanced floating point and multimedia unit
for enhanced video, audio, encryption, and
3D performance
Power Management capabilities
System Management mode
Multiple low-power states
8-way cache associativity provides improved
cache hit rate on load/store operations
775-land Package
Dual-Core Intel® Xeon® Processor 3000 Series Datasheet 11
Introduction
1 Introduction
The Dual-Core Intel
®
Xeon
®
processor 3000 series combines the performance of
previous generation products with the power efficiencies of a low-power
microarchitecture to enable smaller, quieter systems. These processors are 64-bit
processors that maintain compatibility with IA-32 software.
The Dual-Core Intel
®
Xeon
®
processor 3000 series uses Flip-Chip Land Grid Array
(FC-LGA6) package technology, and plugs into a 775-land surface mount, Land Grid
Array (LGA) socket, referred to as the LGA775 socket.
Note: In this document unless otherwise specified, the Dual-Core Intel Xeon processor 3000
series refers to Dual-Core Intel Xeon processors 3085, 3075, 3070, 3065, 3060, 3050,
and 3040. Unless otherwise specified the Dual-Core Intel Xeon processor 3000 series is
referred to as “processor.
The processors support several Advanced Technologies including the Execute Disable
Bit, Intel
®
64, and Enhanced Intel SpeedStep
®
Technology. In addition, the Dual-Core
Intel
®
Xeon
®
processor 3000 series supports Intel
®
Virtualization Technology
(Intel
®
VT) and Intel
®
Trusted Execution Technology (Intel
®
TXT).
The processor's front side bus (FSB) uses a split-transaction, deferred reply protocol
like the Intel
®
Pentium
®
4 processor. The FSB uses Source-Synchronous Transfer (SST)
of address and data to improve performance by transferring data four times per bus
clock (4X data transfer rate, as in AGP 4X). Along with the 4X data bus, the address
bus can deliver addresses two times per bus clock and is referred to as a "double-
clocked" or 2X address bus. Working together, the 4X data bus and 2X address bus
provide a data bus bandwidth of up to 8.5
10.7 GB/s.
Intel has enabled support components for the processor including heatsink, heatsink
retention mechanism, and socket. Manufacturability is a high priority; hence,
mechanical assembly may be completed from the top of the baseboard and should not
require any special tooling.
The processor includes an address bus power-down capability which removes power
from the address and data signals when the FSB is not in use. This feature is always
enabled on the processor.
1.1 Terminology
A ‘#’ symbol after a signal name refers to an active low signal, indicating a signal is in
the active state when driven to a low level. For example, when RESET# is low, a reset
has been requested. Conversely, when NMI is high, a nonmaskable interrupt has
occurred. In the case of signals where the name does not imply an active state but
describes part of a binary series (such as address or data), the ‘#’ symbol implies that
the signal is inverted. For example, D[3:0] = ‘HLHL’ refers to a hex ‘A, and D[3:0]# =
‘LHLH’ also refers to a hex ‘A’ (H= High logic level, L= Low logic level).
The phrase “Front Side Bus” refers to the interface between the processor and system
core logic (a.k.a. the chipset components). The FSB is a multiprocessing interface to
processors, memory, and I/O.
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