Freelance Electronics Components Distributor
Closed Dec 25th-26th
800-300-1968
We Stock Hard to Find Parts

3000

Part # 3000
Description DUP RCPT PORTABLE OUTLET BX
Category LED
Availability Out of Stock
Qty 0
Qty Price
1 + $0.15000



Technical Document


DISCLAIMER: The information provided herein is solely for informational purposes. Customers must be aware of the suitability of this product for their application, and consider that variable factors such as Manufacturer, Product Category, Date Codes, Pictures and Descriptions may differ from available inventory.

Dual-Core Intel® Xeon® Processor 3000 Series Datasheet 33
Electrical Specifications
2.8 PECI DC Specifications
PECI is an Intel proprietary one-wire interface that provides a communication channel
between Intel processors (may also include chipset components in the future) and
external thermal monitoring devices. The processor contains Digital Thermal Sensors
(DTS) distributed throughout die. These sensors are implemented as analog-to-digital
converters calibrated at the factory for reasonable accuracy to provide a digital
representation of relative processor temperature. PECI provides an interface to relay
the highest DTS temperature within a die to external management devices for
thermal/fan speed control. More detailed information is available in the Platform
Environment Control Interface (PECI) Specification.
Notes:
1. Unless otherwise noted, all specifications in this table apply to all processor frequencies.
2. Crossing voltage is defined as the instantaneous voltage value when the rising edge of BCLK0 equals the falling edge of BCLK1.
3. The crossing point must meet the absolute and relative crossing point specifications simultaneously.
4. V
Havg
is the statistical average of the V
H
measured by the oscilloscope.
5. V
Havg
can be measured directly using “Vtop” on Agilent* oscilloscopes and “High” on Tektronix* oscilloscopes.
6. Overshoot is defined as the absolute value of the maximum voltage.
7. Undershoot is defined as the absolute value of the minimum voltage.
8. Ringback Margin is defined as the absolute voltage difference between the maximum Rising Edge Ringback and the maximum
Falling Edge Ringback.
9. Threshold Region is defined as a region entered around the crossing point voltage in which the differential receiver switches. It
includes input threshold hysteresis.
Figure 2-7. Differential Clock Crosspoint Specification
660 670 680 690 700 710 720 730 740 750 760 770 780 790 800 810 820 830 840 850
200
250
300
350
400
450
500
550
600
650
VHavg (mV)
Crossing Point (mV)
550 mV
250 mV
250 + 0.5 (VHavg - 700)
550 + 0.5 (VHavg - 700)
Table 20. PECI DC Electrical Limits
Symbol Definition and Conditions Min Max Units Notes
1
V
in
Input Voltage Range -0.15 V
TT
V
V
hysteresis
Hysteresis 0.1 * V
TT
—V
2
V
n
Negative-edge threshold voltage 0.275 * V
TT
0.500 * V
TT
V
V
p
Positive-edge threshold voltage 0.550 * V
TT
0.725 * V
TT
V
I
source
High level output source
(V
OH
= 0.75 * V
TT)
-6.0 N/A mA
I
sink
Low level output sink
(V
OL
= 0.25 * V
TT
)
0.5 1.0 mA
I
leak+
High impedance state leakage to V
TT
N/A 50 µA
3
Electrical Specifications
34 Dual-Core Intel® Xeon® Processor 3000 Series Datasheet
I
leak-
High impedance leakage to GND N/A 10 µA
3
C
bus
Bus capacitance per node N/A 10 pF
4
V
noise
Signal noise immunity above 300 MHz 0.1 * V
TT
—V
p-p
Notes:
1.
V
TT
supplies the PECI interface. PECI behavior does not affect V
TT
min/max specifications. Refer
to
Table 2-3 for V
TT
specifications.
2. The input buffers use a Schmitt-triggered input design for improved noise immunity.
3. The leakage specification applies to powered devices on the PECI bus.
4. One node is counted for each client and one node for the system host. Extended trace lengths
might appear as additional nodes.
Table 20. PECI DC Electrical Limits
Symbol Definition and Conditions Min Max Units Notes
1
Dual-Core Intel® Xeon® Processor 3000 Series Datasheet 35
Package Mechanical Specifications
3 Package Mechanical
Specifications
The processor is packaged in a Flip-Chip Land Grid Array (FC-LGA6) package that
interfaces with the motherboard via an LGA775 socket. The package consists of a
processor core mounted on a substrate land-carrier. An integrated heat spreader (IHS)
is attached to the package substrate and core and serves as the mating surface for
processor component thermal solutions, such as a heatsink. Figure 3-1 shows a sketch
of the processor package components and how they are assembled together. Refer to
the LGA775 Socket Mechanical Design Guide for complete details on the LGA775
socket.
The package components shown in Figure 3-1 include the following:
Integrated Heat Spreader (IHS)
Thermal Interface Material (TIM)
Processor core (die)
Package substrate
Capacitors
Note:
1. Socket and System Board are included for reference and are not part of processor package.
Figure 3-1. Processor Package Assembly Sketch
System Board
LGA775 Socket
Capacitors
TIM
Core (die)
IHS
Substrate
PREVIOUS4567891011121314151617NEXT