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4 Dual-Core Intel® Xeon® Processor 3000 Series Datasheet

5.2.1 Thermal Monitor .....................................................................................80

5.2.2 Thermal Monitor 2 ..................................................................................81

5.2.3 On-Demand Mode...................................................................................82

5.2.4 PROCHOT# Signal ..................................................................................83

5.2.5 THERMTRIP# Signal................................................................................83

5.3 Platform Environment Control Interface (PECI) ......................................................84

5.3.1 Introduction...........................................................................................84

5.3.1.1 Key Difference with Legacy Diode-Based Thermal Management .......84

5.3.2 PECI Specifications .................................................................................86

5.3.2.1 PECI Device Address..................................................................86

5.3.2.2 PECI Command Support.............................................................86

5.3.2.3 PECI Fault Handling Requirements...............................................86

5.3.2.4 PECI GetTemp0() Error Code Support ..........................................86

6Features..................................................................................................................87

6.1 Power-On Configuration Options ..........................................................................87

6.2 Clock Control and Low Power States.....................................................................87

6.2.1 Normal State .........................................................................................88

6.2.2 HALT and Extended HALT Powerdown States ..............................................88

6.2.2.1 HALT Powerdown State ..............................................................88

6.2.2.2 Extended HALT Powerdown State ................................................89

6.2.3 Stop Grant and Extended Stop Grant States ...............................................89

6.2.3.1 Stop Grant State.......................................................................89

6.2.3.2 Extended Stop Grant State .........................................................90

6.2.4 Extended HALT Snoop State, HALT Snoop State, Extended Stop Grant Snoop

State, and Stop Grant Snoop State ...........................................................90

6.2.4.1 HALT Snoop State, Stop Grant Snoop State ..................................90

6.2.4.2 Extended HALT Snoop State, Extended Stop Grant Snoop State.......90

6.3 Enhanced Intel® SpeedStep® Technology ............................................................90

7 Boxed Processor Specifications................................................................................93

7.1 Mechanical Specifications....................................................................................94

7.1.1 Boxed Processor Cooling Solution Dimensions.............................................94

7.1.2 Boxed Processor Fan Heatsink Weight .......................................................95

7.1.3 Boxed Processor Retention Mechanism and Heatsink Attach Clip Assembly .....95

7.2 Electrical Requirements ......................................................................................95

7.2.1 Fan Heatsink Power Supply ......................................................................95

7.3 Thermal Specifications........................................................................................97

7.3.1 Boxed Processor Cooling Requirements......................................................97

7.3.2 Variable Speed Fan .................................................................................99

8 Debug Tools Specifications ....................................................................................101

8.1 Logic Analyzer Interface (LAI) ...........................................................................101

8.1.1 Mechanical Considerations .....................................................................101

8.1.2 Electrical Considerations ........................................................................101

Dual-Core Intel® Xeon® Processor 3000 Series Datasheet 5

Figures

2-1 V

Static and Transient Tolerance for Processors with 4 MB L2 Cache.......................... 22

2-2 V

Static and Transient Tolerance for Processors with 2 MB L2 Cache.......................... 23

2-3 V

Overshoot Example Waveform .......................................................................... 24

2-4 Differential Clock Waveform.................................................................................... 31

2-5 Differential Clock Crosspoint Specification................................................................. 32

2-6 Differential Measurements...................................................................................... 32

2-7 Differential Clock Crosspoint Specification................................................................. 33

3-1 Processor Package Assembly Sketch ........................................................................ 35

3-2 Processor Package Drawing Sheet 1 of 3 .................................................................. 37

3-3 Processor Package Drawing Sheet 2 of 3 .................................................................. 38

3-4 Processor Package Drawing Sheet 3 of 3 .................................................................. 39

3-5 Processor Top-Side Markings Example for the Dual-Core Intel® Xeon®

Processor 3000 Series with 2MB L2 Cache with 1066 MHz FSB .................................... 41

3-6 Processor Top-Side Markings Example for the Dual-Core Intel® Xeon®

Processor 3000 Series with 4 MB L2 Cache with 1066 MHz FSB ................................... 42

3-7 Processor Top-Side Markings Example for the Dual-Core Intel® Xeon®

Processor 3000 Series with 4 MB L2 Cache with 1333 MHz FSB ................................... 42

3-8 Processor Land Coordinates and Quadrants (Top View)............................................... 43

4-1 land-out Diagram (Top View – Left Side) .................................................................. 46

4-2 land-out Diagram (Top View – Right Side) ................................................................ 47

5-1 Thermal Profile (Dual-Core Intel® Xeon® Processor 3000 Series

with 4 MB L2 Cache).............................................................................................. 77

5-2 Thermal Profile (Dual-Core Intel® Xeon® 3070/3060 Processor

with 4 MB L2 Cache).............................................................................................. 78

5-3 Thermal Profile (Dual-Core Intel® Xeon® Processor 3000 Series

with 2 MB L2 Cache).............................................................................................. 79

5-4 Case Temperature (TC) Measurement Location.......................................................... 80

5-5 Thermal Monitor 2 Frequency and Voltage Ordering ................................................... 82

5-6 Processor PECI Topology ........................................................................................ 86

7 Conceptual Fan Control on PECI-Based Platforms....................................................... 86

8 Conceptual Fan Control on Thermal Diode-Based Platforms......................................... 87

6-1 Processor Low Power State Machine......................................................................... 90

7-1 Mechanical Representation of the Boxed Processor..................................................... 95

7-2 Space Requirements for the Boxed Processor (Side View) ........................................... 96

7-3 Space Requirements for the Boxed Processor (Top View)............................................ 96

7-4 Space Requirements for the Boxed Processor (Overall View) ....................................... 97

7-5 Boxed Processor Fan Heatsink Power Cable Connector Description ............................... 98

7-6 Baseboard Power Header Placement Relative to Processor Socket ................................ 99

7-7 Boxed Processor Fan Heatsink Airspace Keepout Requirements (Side 1 View) .............. 100

7-8 Boxed Processor Fan Heatsink Airspace Keepout Requirements (Side 2 View) .............. 100

7-9 Boxed Processor Fan Heatsink Set Points................................................................ 101

6 Dual-Core Intel® Xeon® Processor 3000 Series Datasheet

Tables

2-1 Voltage Identification Definition ...............................................................................17

2-2 Market Segment Selection Truth Table for MSID[1:0]

1, 2, 3, 4

.......................................18

2-3 Absolute Maximum and Minimum Ratings..................................................................20

2-4 Voltage and Current Specifications ...........................................................................20

2-5 V

Static and Transient Tolerance for Processors with 4 MB L2 Cache..........................21

2-6 V

Static and Transient Tolerance for Processors with 2 MB L2 Cache..........................22

2-7 V

Overshoot Specifications...................................................................................24

2-8 FSB Signal Groups .................................................................................................25

2-9 Signal Characteristics.............................................................................................26

2-10 Signal Reference Voltages.......................................................................................26

2-11 GTL+ Signal Group DC Specifications .......................................................................27

2-12 Open Drain and TAP Output Signal Group DC Specifications.........................................27

2-13 CMOS Signal Group DC Specifications.......................................................................28

2-14 PECI DC Electrical Limits.........................................................................................28

2-15 GTL+ Bus Voltage Definitions ..................................................................................29

2-16 Core Frequency to FSB Multiplier Configuration..........................................................30

2-17 BSEL[2:0] Frequency Table for BCLK[1:0].................................................................30

2-18 Front Side Bus Differential BCLK Specifications ..........................................................31

2-19 Front Side Bus Differential BCLK Specifications ..........................................................32

20 PECI DC Electrical Limits.........................................................................................33

3-1 Processor Loading Specifications..............................................................................40

3-2 Package Handling Guidelines ...................................................................................40

3-3 Processor Materials ................................................................................................41

4-1 Alphabetical Land Assignments................................................................................48

4-2 Numerical Land Assignment ....................................................................................58

4-3 Signal Description..................................................................................................68

5-1 Processor Thermal Specifications .............................................................................76

5-2 Thermal Profile (Dual-Core Intel® Xeon® Processor 3000 Series

with 4 MB L2 Cache) ..............................................................................................77

5-3 Thermal Profile (Dual-Core Intel® Xeon® 3070/3060 Processor

with 4 MB L2 Cache) ..............................................................................................78

5-4 hermal Profile (Dual-Core Intel® Xeon® Processor 3000 Series

with 2 MB L2 Cache) ..............................................................................................79

5-5 Thermal “Diode” Parameters using Diode Model .........................................................84

5-6 Thermal “Diode” Parameters using Transistor Model ...................................................85

7 Thermal Diode Interface .........................................................................................85

8 GetTemp0() Error Codes.........................................................................................88

6-1 Power-On Configuration Option Signals.....................................................................89

7-1 Fan Heatsink Power and Signal Specifications ............................................................98

7-2 Fan Heatsink Power and Signal Specifications ..........................................................102

Part #	3000
Description	DUP RCPT PORTABLE OUTLET BX
Category	LED
Availability	Out of Stock
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3000

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