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Dual-Core Intel

Xeon

Processor

3000

Series

Datasheet

on 65 nm Process in the 775-land LGA Package

November 2007

2 Dual-Core Intel® Xeon® Processor 3000 Series Datasheet

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INTENDED FOR USE IN MEDICAL, LIFE SAVING, OR LIFE SUSTAINING APPLICATIONS.

Intel may make changes to specifications and product descriptions at any time, without notice.

Designers must not rely on the absence or characteristics of any features or instructions marked "reserved" or "undefined." Intel reserves these for

future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them.

Intel processor numbers are not a measure of performance. Processor numbers differentiate features within each processor family, not across different

processor families. See http://www.intel.com/products/processor_number for details. Over time processor numbers will increment based on changes in

clock, speed, cache, FSB, or other features, and increments are not intended to represent proportional or quantitative increases in any particular

feature. Current roadmap processor number progression is not necessarily representative of future roadmaps. See www.intel.com/products/

processor_number for details.

Intel

64 requires a computer system with a processor, chipset, BIOS, operating system, device drivers, and applications enabled for Intel 64.

Processor will not operate (including 32-bit operation) without an Intel 64-enabled BIOS. Performance will vary depending on your hardware and

software configurations. See http://www.intel.com/info/em64t for more information including details on which processors support Intel 64, or consult

with your system vendor for more information.

No computer system can provide absolute security under all conditions. Intel® Trusted Execution Technology (Intel® TXT) is a security technology under

development by Intel and requires for operation a computer system with Intel® Virtualization Technology, a Intel Trusted Execution Technology-enabled

Intel processor, chipset, BIOS, Authenticated Code Modules, and an Intel or other Intel Trusted Execution Technology compatible measured virtual

machine monitor. In addition, Intel Trusted Execution Technology requires the system to contain a TPMv1.2 as defined by the Trusted Computing Group

and specific software for some uses.

±Intel

Virtualization Technology requires a computer system with an enabled Intel

processor, BIOS, virtual machine monitor (VMM) and, for some

uses, certain platform software enabled for it. Functionality, performance or other benefits will vary depending on hardware and software configurations

and may require a BIOS update. Software applications may not be compatible with all operating systems. Please check with your application vendor.

Enabling Execute Disable Bit functionality requires a PC with a processor with Execute Disable Bit capability and a supporting operating system. Check

with your PC manufacturer on whether your system delivers Execute Disable Bit functionality.

The Dual-Core Intel

Xeon

processor 3000 series may contain design defects or errors known as errata which may cause the product to deviate from

published specifications.

Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order.

Intel, Pentium, Xeon, Intel Inside, Intel Leap ahead, Intel Trusted Execution Technology, Intel SpeedStep, Intel Virtualization Technology, and the Intel

logo are trademarks or registered trademarks of Intel Corporation or its subsidiaries in the United States and other countries.

*Other names and brands may be claimed as the property of others.

Dual-Core Intel® Xeon® Processor 3000 Series Datasheet 3

Contents

1Introduction............................................................................................................ 11

1.1 Terminology ..................................................................................................... 11

1.1.1 Processor Terminology............................................................................ 12

1.2 References ....................................................................................................... 13

2 Electrical Specifications........................................................................................... 15

2.1 Power and Ground Lands.................................................................................... 15

2.2 Decoupling Guidelines........................................................................................ 15

2.2.1 VCC Decoupling ..................................................................................... 15

2.2.2 Vtt Decoupling ....................................................................................... 15

2.2.3 FSB Decoupling...................................................................................... 16

2.3 Voltage Identification......................................................................................... 16

2.4 Market Segment Identification (MSID) ................................................................. 18

2.5 Reserved, Unused, and TESTHI Signals ................................................................ 18

2.6 ...................................................................................................................... 19

2.7 Voltage and Current Specification ........................................................................ 19

2.7.1 Absolute Maximum and Minimum Ratings .................................................. 19

2.7.2 DC Voltage and Current Specification ........................................................ 20

2.7.3 V

Overshoot ....................................................................................... 24

2.7.4 Die Voltage Validation............................................................................. 24

2.8 Signaling Specifications...................................................................................... 25

2.8.1 FSB Signal Groups.................................................................................. 25

2.8.2 CMOS and Open Drain Signals ................................................................. 27

2.8.3 Processor DC Specifications ..................................................................... 27

2.8.3.1 GTL+ Front Side Bus Specifications ............................................. 29

2.8.4 Clock Specifications ................................................................................ 29

2.8.5 Front Side Bus Clock (BCLK[1:0]) and Processor Clocking............................ 29

2.8.6 FSB Frequency Select Signals (BSEL[2:0])................................................. 30

2.8.7 Phase Lock Loop (PLL) and Filter .............................................................. 30

2.8.8 BCLK[1:0] Specifications (CK505 based Platforms) ..................................... 30

2.8.9 BCLK[1:0] Specifications (CK410 based Platforms) ..................................... 32

2.9 PECI DC Specifications ....................................................................................... 33

3 Package Mechanical Specifications .......................................................................... 35

3.1 Package Mechanical Drawing............................................................................... 36

3.1.1 Processor Component Keep-Out Zones...................................................... 40

3.1.2 Package Loading Specifications ................................................................ 40

3.1.3 Package Handling Guidelines.................................................................... 40

3.1.4 Package Insertion Specifications............................................................... 40

3.1.5 Processor Mass Specification.................................................................... 41

3.1.6 Processor Materials................................................................................. 41

3.2 Processor Markings............................................................................................ 41

3.2.1 Processor Land Coordinates ..................................................................... 43

4 Land Listing and Signal Descriptions ....................................................................... 45

4.1 Processor Land Assignments ............................................................................... 45

4.2 Alphabetical Signals Reference............................................................................ 68

5 Thermal Specifications and Design Considerations .................................................. 75

5.1 Processor Thermal Specifications......................................................................... 75

5.1.1 Thermal Specifications ............................................................................ 75

5.1.2 Thermal Metrology ................................................................................. 80

5.2 Processor Thermal Features................................................................................ 80

Part #	3000
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Category	LED
Availability	Out of Stock
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3000

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