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662D

Part # 662D
Description
Category LAMP
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Technical Document


DISCLAIMER: The information provided herein is solely for informational purposes. Customers must be aware of the suitability of this product for their application, and consider that variable factors such as Manufacturer, Product Category, Date Codes, Pictures and Descriptions may differ from available inventory.

GS8662D20/38BD-550/500/450/400/350
GS8662D06/11BD-500/450/400/350
72Mb SigmaQuad-II+
TM
Burst of 4 SRAM
550 MHz–350 MHz
1.8 V V
DD
1.8 V or 1.5 V I/O
165-Bump BGA
Commercial Temp
Industrial Temp
Rev: 1.02c 8/2017 1/33 © 2011, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
Features
• 2.5 Clock Latency
• Simultaneous Read and Write SigmaQuad™ Interface
• JEDEC-standard pinout and package
• Dual Double Data Rate interface
• Byte Write controls sampled at data-in time
• Burst of 4 Read and Write
• On-Die Termination (ODT) on Data (D), Byte Write (
BW),
and Clock (K,
K) intputs
• 1.8 V +100/–100 mV core power supply
• 1.5 V or 1.8 V HSTL Interface
• Pipelined read operation
• Fully coherent read and write pipelines
• ZQ pin for programmable output drive strength
• Data Valid Pin (QVLD) Supp
ort
• IEEE 1149.1 JTAG-compliant Boundary Scan
• 165-bump, 13 mm x 15 mm, 1 mm bump pitch BGA package
• RoHS-compliant 165-bump BGA pa
ckage available
SigmaQuad-II Family Overview
The GS8662D06/11/20/38BD are built in compliance with
the SigmaQuad-II+ SRAM pinout standard for Separate I/O
synchronous SRAMs. They are 75,497,472-bit (72Mb)
SRAMs. The GS8662D06/11/20/38BD SigmaQuad SRAMs
are just one element in a family of low power, low voltage
HSTL I/O SRAMs designed to operate at the speeds needed to
implement economical high performance networking systems.
Clocking and Addressing Schemes
The GS8662D06/11/20/38BD SigmaQuad-II+ SRAMs are
synchronous devices. They employ two input register clock
inputs, K and
K. K and K are independent single-ended clock
inputs, not differential inputs to a single differential clock input
buffer.
Each internal read and write operat
ion in a SigmaQuad-II+ B4
RAM is four times wider than the device I/O bus. An input
data bus de-multiplexer is used to accumulate incoming data
before it is simultaneously written to the memory array. An
output data multiplexer is used to capture the data produced
from a single memory array read and then route it to the
appropriate output drivers as needed. Therefore the address
field of a SigmaQuad-II+ B4 RAM is always two address pins
less than the advertised index depth (e.g., the 8M x 8 has a 2M
addressable index).
Parameter Synopsis (x18/x36)
-550 -500 -450 -400 -350
tKHKH 1.81 ns 2.0 ns 2.2 ns 2.5 ns 2.86 ns
tKHQV 0.29ns 0.33 ns 0.37 ns 0.45 ns 0.45 ns
Parameter Synopsis (x8/x9)
-500 -450 -400 -350
tKHKH 2.0 ns 2.2 ns 2.5 ns 2.86 ns
tKHQV 0.33 ns 0.37ns 0.45 ns 0.45 ns
2M x 36 SigmaQuad-II+ SRAM—Top View
1 2 3 4 5 6 7 8 9 10 11
A
CQ
NC/SA
(288Mb)
SA
W BW2 K BW1 R SA
NC/SA
(144Mb)
CQ
B Q27 Q18 D18 SA
BW3 K BW0 SA D17 Q17 Q8
C D27 Q28 D19 V
SS
SA NC SA V
SS
D16 Q7 D8
D D28 D20 Q19 V
SS
V
SS
V
SS
V
SS
V
SS
Q16 D15 D7
E Q29 D29 Q20 V
DDQ
V
SS
V
SS
V
SS
V
DDQ
Q15 D6 Q6
F Q30 Q21 D21 V
DDQ
V
DD
V
SS
V
DD
V
DDQ
D14 Q14 Q5
G D30 D22 Q22 V
DDQ
V
DD
V
SS
V
DD
V
DDQ
Q13 D13 D5
H
Doff V
REF
V
DDQ
V
DDQ
V
DD
V
SS
V
DD
V
DDQ
V
DDQ
V
REF
ZQ
J D31 Q31 D23 V
DDQ
V
DD
V
SS
V
DD
V
DDQ
D12 Q4 D4
K Q32 D32 Q23 V
DDQ
V
DD
V
SS
V
DD
V
DDQ
Q12 D3 Q3
L Q33 Q24 D24 V
DDQ
V
SS
V
SS
V
SS
V
DDQ
D11 Q11 Q2
M D33 Q34 D25 V
SS
V
SS
V
SS
V
SS
V
SS
D10 Q1 D2
N D34 D26 Q25 V
SS
SA SA SA V
SS
Q10 D9 D1
P Q35 D35 Q26 SA SA QVLD SA SA Q9 D0 Q0
R TDO TCK SA SA SA ODT SA SA SA TMS TDI
11 x 15 Bump BGA—13 x 15 mm Bo
dy—1 mm Bump Pitch
Notes:
1.
BW0 controls writes to D0:D8; BW1 controls writes to D9:D17; BW2 controls writes to D18:D26; BW3 controls writes to D27:D35
2. Pins A2 and A10 are the expansion addresses.
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
Rev: 1.02c 8/2017 2/33 © 2011, GSI Technology
GS8662D20/38BD-550/500/450/400/350
GS8662D06/11BD-500/450/400/350
4M x 18 SigmaQuad-II+ SRAM—Top View
1 2 3 4 5 6 7 8 9 10 11
A
CQ
NC/SA
(144Mb)
SA
W BW1 K
NC/SA
(288Mb)
R SA SA CQ
B NC Q9 D9 SA NC K
BW0 SA NC NC Q8
C NC NC D10 V
SS
SA NC SA V
SS
NC Q7 D8
D NC D11 Q10 V
SS
V
SS
V
SS
V
SS
V
SS
NC NC D7
E NC NC Q11 V
DDQ
V
SS
V
SS
V
SS
V
DDQ
NC D6 Q6
F NC Q12 D12 V
DDQ
V
DD
V
SS
V
DD
V
DDQ
NC NC Q5
G NC D13 Q13 V
DDQ
V
DD
V
SS
V
DD
V
DDQ
NC NC D5
H
Doff V
REF
V
DDQ
V
DDQ
V
DD
V
SS
V
DD
V
DDQ
V
DDQ
V
REF
ZQ
J NC NC D14 V
DDQ
V
DD
V
SS
V
DD
V
DDQ
NC Q4 D4
K NC NC Q14 V
DDQ
V
DD
V
SS
V
DD
V
DDQ
NC D3 Q3
L NC Q15 D15 V
DDQ
V
SS
V
SS
V
SS
V
DDQ
NC NC Q2
M NC NC D16 V
SS
V
SS
V
SS
V
SS
V
SS
NC Q1 D2
N NC D17 Q16 V
SS
SA SA SA V
SS
NC NC D1
P NC NC Q17 SA SA QVLD SA SA NC D0 Q0
R TDO TCK SA SA SA ODT SA SA SA TMS TDI
11 x 15 Bump BGA—13 x 15 mm Bo
dy—1 mm Bump Pitch
Notes:
1.
BW0 controls writes to D0:D8. BW1 controls writes to D9:D17.
2. Pins A2 and A7 are the expansion addresses.
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
Rev: 1.02c 8/2017 3/33 © 2011, GSI Technology
GS8662D20/38BD-550/500/450/400/350
GS8662D06/11BD-500/450/400/350
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