5
Absolute Maximum Ratings
Storage Temperature Range, T
S
.................................. -65°C to +150°C
Operating Temperature, T
A
......................................... -55°C to +125°C
Case Temperature, T
C
................................................................ +170°C
Junction Temperature, T
J
..........................................................+175°C
Lead Solder Temperature .............................................. 260°C for 10 s
Average Forward Curre, I
F AVG
(each channel) ............................. 8 mA
Peak Input Current, I
F PK
(each channel) ............................... 20 mA
[1]
Reverse Input Voltage, V
R
(each channel) ....................................... 3 V
Supply Voltage ,V
CC
.............................................. 0.0 V min., 20 V max.
Average Output Current, I
O
(each channel) ................................. 15 mA
Output Voltage, V
O
(each channel) .................... –0.3 V min., 20 V max.
Package Power Dissipation, P
d
(each channel) ......................... 200 mW
Single Channel Product Only
Tri-State Enable Voltage, V
E
............................... –0.3 V min., 20 V max.
8 Pin Ceramic DIP Single Channel Schematic
Recommended Operating Conditions
Parameter Symbol Min. Max. Units
Power Supply Voltage V
CC
4.5 20 V
Input Current, High Level, I
FH
28 mA
Each Channel
Input Voltage, Low Level, V
FL
0 0.8 V
Each Channel
Fan Out (TTL Load) N 4
Each Channel
Single Channel Product Only
High Level Enable Voltage V
EH
2.0 20 V
Low Level Enable Voltage V
EL
0 0.8 V
Note enable pin 6. An external 0.01 µF to 0.1 µF bypass capacitor is recommended
between V
CC
and ground for each package type.
ESD Classification
(MIL-STD-883, Method 3015)
HCPL-5200/01/0K, HCPL-6230/31/3K ................................(∆), Class 1
HCPL-5230/31/3K, HCPL-6250/51/5K ............................ (Dot), Class 3
ANODE
CATHODE
