PACKAGE OPTION ADDENDUM
www.ti.com
26-Jul-2016
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status
(1)
Package Type Package
Drawing
Pins Package
Qty
Eco Plan
(2)
Lead/Ball Finish
(6)
MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
5962-8759402XA ACTIVE TO NDU 2 20 TBD Call TI Call TI -55 to 125 8759402XA Q
5962-8759402YA ACTIVE CFP NAC 10 54 TBD Call TI Call TI -55 to 125 LM185WG-
2.5/883 Q
5962-87594
02YA ACO
02YA >T
5962-8759406VXA ACTIVE TO NDU 2 20 TBD Call TI Call TI -55 to 125 8759406VXA Q
LM185-2.5 MD8 ACTIVE DIESALE Y 0 100 Green (RoHS
& no Sb/Br)
Call TI Level-1-NA-UNLIM -55 to 125
LM185BYH2.5-QV ACTIVE TO NDU 2 20 TBD Call TI Call TI -55 to 125 8759406VXA Q
LM185BYH2.5/883 ACTIVE TO NDU 2 20 TBD Call TI Call TI -55 to 125 LM185BY2.5 Q
LM185H-2.5-SMD ACTIVE TO NDU 2 20 TBD Call TI Call TI -55 to 125 8759402XA Q
LM185H-2.5/883 ACTIVE TO NDU 2 20 TBD Call TI Call TI -55 to 125 LM185-2.5 Q
LM185WG-2.5/883 ACTIVE CFP NAC 10 54 TBD Call TI Call TI -55 to 125 LM185WG-
2.5/883 Q
5962-87594
02YA ACO
02YA >T
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
