4-324
All Intersil semiconductor products are manufactured, assembled and tested under ISO9000 quality systems certification.
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time without
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate
and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which
may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see web site http://www.intersil.com
Die Characteristics
DIE DIMENSIONS:
138.6 x 155.5 x 19 ± 1mils
METALLIZATION:
Type: Si - Al
Thickness: 11k
Å ± 1kÅ
GLASSIVATION:
Type: SiO
2
Thickness: 8kÅ ± 1kÅ
WORST CASE CURRENT DENSITY:
1.47 x 10
5
A/cm
2
Metallization Mask Layout
82C86H
A2 A1 A0 V
CC
B0 B1
B2
B3
B4
B5
B6B7TGNDOEA7
A6
A5
A4
A3
82C86H82C86H