National Semiconductor Corp 54F244DM

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Technical Document


DISCLAIMER: The information provided herein is solely for informational purposes. Customers must be aware of the suitability of this product for their application, and consider that variable factors such as Manufacturer, Product Category, Date Codes, Pictures and Descriptions may differ from available inventory.

TL/F/9501
54F/74F240
#
54F/74F241
#
54F/74F244
Octal Buffers/Line Drivers with TRI-STATE Outputs
May 1995
54F/74F240
#
54F/74F241
#
54F/74F244
Octal Buffers/Line Drivers with TRI-STATE
É
Outputs
General Description
The ’F240, ’F241 and ’F244 are octal buffers and line driv-
ers designed to be employed as memory and address driv-
ers, clock drivers and bus-oriented transmitters/receivers
which provide improved PC and board density.
Features
Y
TRI-STATE outputs drive bus lines or buffer memory
address registers
Y
Outputs sink 64 mA (48 mA mil)
Y
12 mA source current
Y
Input clamp diodes limit high-speed termination effects
Y
Guaranteed 4000V minimum ESD protection
Commercial Military
Package
Package Description
Number
74F240PC N20A 20-Lead (0.300
×
Wide) Molded Dual-In-Line
54F240DM (Note 2) J20A 20-Lead Ceramic Dual-In-Line
74F240SC (Note 1) M20B 20-Lead (0.300
×
Wide) Molded Small Outline, JEDEC
74F240SJ (Note 1) M20D 20-Lead (0.300
×
Wide) Molded Small Outline, EIAJ
54F240FM (Note 2) W20A 20-Lead Cerpack
54F240LM (Note 2) E20A 20-Lead Ceramic Leadless Chip Carrier, Type C
74F241PC N20A 20-Lead (0.300
×
Wide) Molded Dual-In-Line
54F241DM (Note 2) J20A 20-Lead Ceramic Dual-In-Line
74F241SC (Note 1) M20B 20-Lead (0.300
×
Wide) Molded Small Outline, JEDEC
74F241SJ (Note 1) M20D 20-Lead (0.300
×
Wide) Molded Small Outline, EIAJ
54F241FM (Note 2) W20A 20-Lead Cerpack
54F241LM (Note 2) E20A 20-Lead Ceramic Leadless Chip Carrier, Type C
74F244PC N20A 20-Lead (0.300
×
Wide) Molded Dual-In-Line
54F244DM (Note 2) J20A 20-Lead Ceramic Dual-In-Line
74F244SC (Note 1) M20B 20-Lead (0.300
×
Wide) Molded Small Outline, JEDEC
74F244SJ (Note 1) M20D 20-Lead (0.300
×
Wide) Molded Small Outline, EIAJ
74F244MSA (Note 1) MSA20 20-Lead Molded Shrink Small Outline, EIAJ Type II
54F244FM (Note 2) W20A 20-Lead Cerpack
54F244LM (Note 2) E20A 20-Lead Ceramic Leadless Chip Carrier, Type C
Note 1: Devices also available in 13
×
reel. Use Suffix
e
SCX, SJX and MSAX.
Note 2: Military grade device with environmental and burn-in processing. Use suffix
e
DMQB, FMQB and LMQB.
TRI-STATE
É
is a registered trademark of National Semiconductor Corporation.
C
1995 National Semiconductor Corporation RRD-B30M75/Printed in U. S. A.
Connection Diagrams
Pin Assignment for LCC
’F240
TL/F/95012
’F241
TL/F/95014
’F244
TL/F/95016
Pin Assignment for DIP, SOIC, SSOP and Flatpak
TL/F/95011 TL/F/95013
TL/F/95015
Logic Symbols
IEEE/IEC
’F240
TL/F/95017
IEEE/IEC
’F241
TL/F/95018
IEEE/IEC
’F244
TL/F/95019
2
Unit Loading/Fan Out
54F/74F
Pin Names Description
U.L. Input I
IH
/I
IL
HIGH/LOW Output I
OH
/I
OL
OE
1
,OE
2
TRI-STATE Output Enable Input (Active LOW) 1.0/1.667 20 mA/
b
1mA
OE
2
TRI-STATE Output Enable Input (Active HIGH) 1.0/1.667 20 mA/
b
1mA
I
0
–I
7
Inputs (’F240) 1.0/1.667* 20 mA/
b
1mA
I
0
–I
7
Inputs (’F241, ’F244) 1.0/2.667* 20 mA/
b
1.6 mA
O
0
–O
7
,O
0
–O
7
Outputs 600/106.6 (80)
b
12 mA/64 mA (48 mA)
*Worst-case ’F240 enabled; ’F241, ’F244 disabled
Truth Tables
’F240
OE
1
D
1n
O
1n
OE
2
D
2n
O
2n
HXZHXZ
LHLLHL
LLHLLH
’F241
OE
1
D
1n
O
1n
OE
2
D
2n
O
2n
HXZLXZ
LHHHHH
LLLHLL
’F244
OE
1
D
1n
O
1n
OE
2
D
2n
O
2n
HXZHXZ
LHHLHH
LLLLLL
H
e
HIGH Voltage Level
L
e
LOW Voltage Level
X
e
Immaterial
Z
e
High Impedance
3
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