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WS1102-TR1

Part # WS1102-TR1
Description MODULE PA CDMA/AMPS 824-849MHZ
Category IC
Availability In Stock
Qty 51
Qty Price
1 - 10 $15.24600
11 - 21 $12.12750
22 - 32 $11.43450
33 - 42 $10.62600
43 + $9.47100
Manufacturer Available Qty
Agilent technologies Inc
Date Code: 0624
  • Shipping Freelance Stock: 51
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Technical Document


DISCLAIMER: The information provided herein is solely for informational purposes. Customers must be aware of the suitability of this product for their application, and consider that variable factors such as Manufacturer, Product Category, Date Codes, Pictures and Descriptions may differ from available inventory.

13
Handling and Storage
ESD (Electrostatic Discharge)
Electrostatic discharge occurs naturally in the
environment. With the increase in voltage potential, the
outlet of neutralization or discharge will be sought. If the
acquired discharge route is through a semiconductor
device, destructive damage will result.
ESD countermeasure methods should be developed
and used to control potential ESD damage
during handling in a factory environment at each
manufacturing site.
MSL (Moisture Sensitivity Level)
Plastic encapsulated surface mount package is sensitive to
damage induced by absorbed moisture and temperature.
Avago Technologies follows JEDEC Standard J-STD 020B.
Each component and package type is classied for
moisture sensitivity by soaking a known dry package at
various temperatures and relative humidity, and times.
After soak, the components are subjected to three
consecutive simulated reows.
Table 5. ESD Classication
Pin# Name Description HBM MM Classication
1 Vcc1 Supply Voltage ± 2000V ± 200V Class 2
2 RF In RF Input ± 2000V ± 200V Class 2
3 Vcont Control Voltage ± 2000V ± 200V Class 2
4 Vref Reference Voltage ± 2000V ± 200V Class 2
5 GND Ground ± 2000V ± 200V Class 2
6 GND Ground ± 2000V ± 200V Class 2
7 RF Out RF Output ± 2000V ± 200V Class 2
8 Vcc2 Supply Voltage ± 2000V ± 200V Class 2
Note:
1. Module products should be considered extremely ESD sensitive.
The out of bag exposure time maximum limits are
determined by the classication test described above
which corresponds to a MSL classication level 6 to 1
according to the JEDEC standard IPC/JEDEC J-STD-020B
and J-STD-033.
WS1102 is MSL3. Thus, according to the J-STD-033 p.11
the maximum Manufacturers Exposure Time (MET) for
this part is 168 hours. After this time period, the part
would need to be removed from the reel, de-taped and
then re-baked.
MSL classication reow temperature for the WS1102 is
targeted at 250°C +0/-5°C. Figure 19 and Table 7 show
typical SMT prole for maximum temperature of 250°C
+0/-5°C.
Table 6. Moisture Classication Level and Floor Life
MSL Level Floor Life (out of bag) at factory ambient ≤ 30°C/60% RH or as stated
1 Unlimited at ≤ 30
o
C/85% RH
2 1 year
2a 4 weeks
3 168 hours
4 72 hours
5 48 hours
5a 24 hours
6 Mandatory bake before use. After bake, must be reowed within the time limit specied on the label
Note:
1. The MSL Level is marked on the MSL Label on each shipping bag.
14
Figure 19. Typical SMT Reow Prole for Maximum Temperature = 250+0/-5°C.
Table 7. Typical SMT Reow Prole for Maximum Temperature = 250+0/-5°C
Prole Feature Sn-Pb Solder Pb-Free Solder
Average ramp-up rate (T
L
to T
P
) 3°C/sec max 3°C/sec max
Preheat
- Temperature Min (Tsmin) 100°C 150°C
- Temperature Max (Tsmax) 150°C 200°C
- Time (min to max) (ts) 60120 sec 60–180 sec
Tsmax to T
L
- Ramp-up Rate 3°C/sec max
Time maintained above:
- Temperature (T
L
) 183°C 217°C
- Time (T
L
) 60–150 sec 60–150 sec
Peak Temperature (T
p
) 240 +0/-5°C 250 +0/-5°C
Time within 5°C of actual Peak Temperature (tp) 10–30 sec 20–40 sec
Ramp-down Rate 6°C/sec max 6°C/sec max
Time 25°C to Peak Temperature 6 min max. 8 min max.
Handling and Storage, continued
15
Handling and Storage, continued
Storage Conditions
Packages described in this document must be stored in
sealed moisture barrier, anti-static bags. Shelf life in a
sealed moisture barrier bag is 12 months at <40
o
C and
90% relative humidity (RH) J-STD-033 p.7.
Out-of-Bag Time Duration
After unpacking the device must be soldered to the PCB
within 168 hours as listed in the J-STD-020B p.11 with
factory conditions <30
o
C and 60% RH.
Baking
It is not necessary to re-bake the part if both
conditions (storage conditions and out-of-bag
conditions) have been satised. Baking must be
done if at least one of the conditions above have
not been satised. The baking conditions are 125
o
C for
12 hours J-STD-033 p.8.
CAUTION: Tape and reel materials typically cannot
be baked at the temperature described above.
If out-of-bag exposure time is exceeded, parts must be
baked for a longer time at low temperatures, or the parts
must be de-reeled, de-taped, re-baked and then put
back on tape and reel. (See moisture sensitive warning
label on each shipping bag for information of baking).
Board Rework
Component Removal, Rework and Remount
If a component is to be removed from the board, it is
recommended that localized heating be used and the
maximum body temperatures of any surface mount
component on the board not exceed 200°C. This method
will minimize moisture related component damage. If
any component temperature exceeds 200°C, the board
must be baked dry per “Baking of Populated Boards”
below prior to rework and/or component removal.
Component temperatures shall be measured at the top
center of the package body. Any SMD packages that
have not exceeded their oor life can be exposed to a
maximum body temperature as high as their specied
maximum reow temperature.
Removal for Failure Analysis
Not following the requirements may cause moisture/
reow damage that could hinder or completely prevent
the determination of the original failure mechanism.
Baking of Populated Boards
Some SMD packages and board materials are not able
to withstand long duration bakes at 125°C. Examples of
this are some FR-4 materials, which cannot withstand a
24 hr bake at 125°C. Batteries and electrolytic capacitors
are also temperature sensitive. With component and
board temperature restrictions in mind, choose a bake
temperature from Table 4-1 in J-STD 033; then determine
the appropriate bake duration based on the component
to be removed. For additional considerations see IPC-
7711 and IPC-7721.
Derating due to Factory Environmental Conditions
Factory oor life exposures for SMD packages removed
from the dry bags will be a function of the ambient
environmental conditions. A safe, yet conservative,
handling approach is to expose the SMD packages only up
to the maximum time limits for each moisture sensitivity
level as shown in Table 6. This approach, however, does not
work if the factory humidity or temperature are greater
than the testing conditions of 30°C/60% RH. A solution
for addressing this problem is to derate the exposure
times based on the knowledge of moisture diusion in
the component packaging materials (ref. JESD22-A120).
Recommended equivalent total oor life exposures can
be estimated for a range of humidities and temperatures
based on the nominal plastic thickness for each device.
Table 8 lists equivalent derated oor lives for humidities
ranging from 20-90% RH for three temperatures, 20°C,
25°C, and 30°C. This table is applicable to SMDs molded
with novolac, biphenyl or multifunctional epoxy mold
compounds. The following assumptions were used in
calculating Table 8:
1. Activation Energy for diusion = 0.35eV (smallest
known value).
2. For ≤60% RH, use Diusivity = 0.121exp (- 0.35eV/kT)
mm2/s (this uses smallest known Diusivity @ 30°C).
3. For >60% RH, use Diusivity = 1.320exp (- 0.35eV/kT)
mm2/s (this uses largest known Diusivity @ 30°C).
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