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SN74AUC1G04DCKR

Part # SN74AUC1G04DCKR
Description Inverter 1-Element CMOS 5-PinSC-70 T/R (Alt: SN74AUC1G04D
Category IC
Availability In Stock
Qty 1430
Qty Price
1 - 300 $0.07853
301 - 600 $0.06246
601 - 900 $0.05890
901 - 1,201 $0.05473
1,202 + $0.04878
Manufacturer Available Qty
Texas Instruments
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Technical Document


DISCLAIMER: The information provided herein is solely for informational purposes. Customers must be aware of the suitability of this product for their application, and consider that variable factors such as Manufacturer, Product Category, Date Codes, Pictures and Descriptions may differ from available inventory.

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  
SCES370L − SEPTEMBER 2001 − REVISED NOVEMBER 2003
1
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
D Available in the Texas Instruments
NanoStarand NanoFreePackages
D Optimized for 1.8-V Operation and Is 3.6-V
I/O Tolerant to Support Mixed-Mode Signal
Operation
D I
off
Supports Partial-Power-Down Mode
Operation
D Sub 1-V Operable
D Max t
pd
of 2.2 ns at 1.8 V
D Low Power Consumption, 10-µA Max I
CC
D ±8-mA Output Drive at 1.8 V
D Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
D ESD Protection Exceeds JESD 22
− 2000-V Human-Body Model (A114-A)
− 200-V Machine Model (A115-A)
− 1000-V Charged-Device Model (C101)
description/ordering information
This single inverter gate is operational at 0.8-V to 2.7-V V
CC
, but is designed specifically for 1.65-V to 1.95-V
V
CC
operation.
The SN74AUC1G04 performs the Boolean function Y = A
.
NanoStar and NanoFree package technology is a major breakthrough in IC packaging concepts, using the
die as the package.
This device is fully specified for partial-power-down applications using I
off
. The I
off
circuitry disables the outputs,
preventing damaging current backflow through the device when it is powered down.
ORDERING INFORMATION
T
A
PACKAGE
ORDERABLE
PART NUMBER
TOP-SIDE
MARKING
NanoStar − WCSP (DSBGA)
0.17-mm Small Bump − YEA
SN74AUC1G04YEAR
NanoFree − WCSP (DSBGA)
0.17-mm Small Bump − YZA (Pb-free)
Tape and reel
SN74AUC1G04YZAR
_ _ _UC_
−40°C to 85°C
NanoStar − WCSP (DSBGA)
0.23-mm Large Bump − YEP
Tape and reel
SN74AUC1G04YEPR
_ _ _UC_
NanoFree − WCSP (DSBGA)
0.23-mm Large Bump − YZP (Pb-free)
SN74AUC1G04YZPR
SOT (SOT-23) − DBV Tape and reel SN74AUC1G04DBVR U04_
SOT (SC-70) − DCK Tape and reel SN74AUC1G04DCKR UC_
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
DBV/DCK: The actual top-side marking has one additional character that designates the assembly/test site.
YEA/YZA, YEP/YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code,
and one following character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition
(1 = SnPb,
= Pb-free).
Copyright 2003, Texas Instruments Incorporated
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
NanoStar and NanoFree are trademarks of Texas Instruments.
       !"# $%
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DBV OR DCK PACKAGE
(TOP VIEW)
1
2
3
5
4
NC
A
GND
V
CC
Y
NC − No internal connection
DNU − Do not use
3
2
1
4
5
GND
A
DNU
Y
V
CC
YEA, YEP, YZA, OR YZP PACKAGE
(BOTTOM VIEW)
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SCES370L − SEPTEMBER 2001 − REVISED NOVEMBER 2003
2
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
description/ordering information (continued)
For more information about AUC Little Logic devices, please refer to the TI application report, Applications of
Texas Instruments AUC Sub-1-V Little Logic Devices, literature number SCEA027.
FUNCTION TABLE
INPUT
A
OUTPUT
Y
H L
L H
logic diagram (positive logic)
AY
24
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)
Supply voltage range, V
CC
−0.5 V to 3.6 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Input voltage range, V
I
(see Note 1) −0.5 V to 3.6 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Voltage range applied to any output in the high-impedance or power-off state, V
O
(see Note 1) −0.5 V to 3.6 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Output voltage range, V
O
(see Note 1) −0.5 V to V
CC
+ 0.5 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Input clamp current, I
IK
(V
I
< 0) −50 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Output clamp current, I
OK
(V
O
< 0) −50 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Continuous output current, I
O
±20 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Continuous current through V
CC
or GND ±100 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Package thermal impedance, θ
JA
(see Note 2): DBV package 206°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
DCK package 252°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
YEA/YZA package 154°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . .
YEP/YZP package 132°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . .
Storage temperature range, T
stg
−65°C to 150°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. The input negative-voltage and output voltage ratings may be exceeded if the input and output current ratings are observed.
2. The package thermal impedance is calculated in accordance with JESD 51-7.
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SCES370L − SEPTEMBER 2001 − REVISED NOVEMBER 2003
3
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
recommended operating conditions (see Note 3)
MIN MAX UNIT
V
CC
Supply voltage 0.8 2.7 V
V
CC
= 0.8 V V
CC
V
IH
High-level input voltage
V
CC
= 1.1 V to 1.95 V
0.65 × V
CC
V
V
IH
High-level input voltage
V
CC
= 2.3 V to 2.7 V 1.7
V
V
CC
= 0.8 V 0
V
IL
Low-level input voltage
V
CC
= 1.1 V to 1.95 V
0.35 × V
CC
V
V
IL
Low-level input voltage
V
CC
= 2.3 V to 2.7 V 0.7
V
V
I
Input voltage 0 3.6 V
V
O
Output voltage 0 V
CC
V
V
CC
= 0.8 V −0.7
V
CC
= 1.1 V −3
I
OH
High-level output current
V
CC
= 1.4 V
−5
mA
I
OH
High-level output current
V
CC
= 1.65 V −8
mA
V
CC
= 2.3 V −9
V
CC
= 0.8 V 0.7
V
CC
= 1.1 V 3
I
OL
Low-level output current
V
CC
= 1.4 V
5
mA
I
OL
Low-level output current
V
CC
= 1.65 V 8
mA
V
CC
= 2.3 V 9
t/v Input transition rise or fall rate 20 ns/V
T
A
Operating free-air temperature −40 85 °C
NOTE 3: All unused inputs of the device must be held at V
CC
or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
PARAMETER TEST CONDITIONS
V
CC
MIN TYP
MAX UNIT
I
OH
= −100 µA 0.8 V to 2.7 V V
CC
−0.1
I
OH
= −0.7 mA 0.8 V 0.55
V
OH
I
OH
= −3 mA 1.1 V 0.8
V
V
OH
I
OH
= −5 mA 1.4 V 1
V
I
OH
= −8 mA 1.65 V 1.2
I
OH
= −9 mA 2.3 V 1.8
I
OL
= 100 µA 0.8 V to 2.7 V 0.2
I
OL
= 0.7 mA 0.8 V 0.25
V
OL
I
OL
= 3 mA 1.1 V 0.3
V
V
OL
I
OL
= 5 mA 1.4 V 0.4
V
I
OL
= 8 mA 1.65 V 0.45
I
OL
= 9 mA 2.3 V 0.6
I
I
A input V
I
= V
CC
or GND 0 to 2.7 V ±5 µA
I
off
V
I
or V
O
= 2.7 V 0 ±10 µA
I
CC
V
I
= V
CC
or GND, I
O
= 0 0.8 V to 2.7 V 10 µA
C
i
V
I
= V
CC
or GND 2.5 V 3 pF
All typical values are at T
A
= 25°C.
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