SCES487B − SEPTEMBER 2003 − REVISED FEBRUARY 2004
1
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
D Available in the Texas Instruments
NanoStar and NanoFree Packages
D Supports 5-V V
CC
Operation
D Inputs Accept Voltages to 5.5 V
D Max t
pd
of 4.1 ns at 3.3 V
D Low Power Consumption, 10-µA Max I
CC
D ±24-mA Output Drive at 3.3 V
D I
off
Supports Partial-Power-Down Mode
Operation
D Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
D ESD Protection Exceeds JESD 22
− 2000-V Human-Body Model (A114-A)
− 200-V Machine Model (A115-A)
− 1000-V Charged-Device Model (C101)
description/ordering information
The SN74LVC1G11 performs the Boolean function
Y + A • B • CorY+ A
) B ) C
in positive logic.
NanoStar and NanoFree package technology is a major breakthrough in IC packaging concepts, using the
die as the package.
This device is fully specified for partial-power-down applications using I
off
. The I
off
circuitry disables the outputs,
preventing damaging current backflow through the device when it is powered down.
ORDERING INFORMATION
T
A
PACKAGE
†
ORDERABLE
PART NUMBER
TOP-SIDE
MARKING
‡
NanoStar − WCSP (DSBGA)
0.23-mm Large Bump − YEP
SN74LVC1G11YEPR
−40°C to 85°C
NanoFree − WCSP (DSBGA)
0.23-mm Large Bump − YZP (Pb-free)
Tape and reel
SN74LVC1G11YZPR
_ _ _C3_
SOT (SOT-23) − DBV Tape and reel SN74LVC1G11DBVR C11_
SOT (SC-70) − DCK Tape and reel SN74LVC1G11DCKR C3_
†
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
‡
DBV/DCK: The actual top-side marking has one additional character that designates the assembly/test site.
YEP/YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one
following character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition
(1 = SnPb,
• = Pb-free).
Copyright 2004, Texas Instruments Incorporated
NanoStar and NanoFree are trademarks of Texas Instruments.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
DBV OR DCK PACKAGE
(TOP VIEW)
1
2
3
6
5
4
A
GND
B
C
V
CC
Y
3
2
1
4
5
6
B
GND
A
Y
V
CC
C
YEP OR YZP PACKAGE
(BOTTOM VIEW)
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