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XCF32PFS48C

Part # XCF32PFS48C
Description CONFIGURATION PROM 48-PIN TFBGA - Trays
Category IC
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Technical Document


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DS123 (v2.17) October 26, 2009 www.xilinx.com
Product Specification 1
© Copyright 2003–2009 Xilinx, Inc. XILINX, the Xilinx logo, Virtex, Spartan, ISE, and other designated brands included herein are trademarks of Xilinx in the United States and
other countries. All other trademarks are the property of their respective owners.
Features
In-System Programmable PROMs for Configuration of
Xilinx® FPGAs
Low-Power Advanced CMOS NOR Flash Process
Endurance of 20,000 Program/Erase Cycles
Operation over Full Industrial Temperature Range
(–40°C to +85°C)
IEEE Standard 1149.1/1532 Boundary-Scan (JTAG)
Support for Programming, Prototyping, and Testing
JTAG Command Initiation of Standard FPGA
Configuration
Cascadable for Storing Longer or Multiple Bitstreams
Dedicated Boundary-Scan (JTAG) I/O Power Supply (V
CCJ
)
I/O Pins Compatible with Voltage Levels Ranging From
1.8V to 3.3V
Design Support Using the Xilinx ISE® Alliance and
Foundation™ Software Packages
XCF01S/XCF02S/XCF04S
3.3V Supply Voltage
Serial FPGA Configuration Interface
Available in Small-Footprint VO20 and VOG20
Packages
XCF08P/XCF16P/XCF32P
1.8V Supply Voltage
Serial or Parallel FPGA Configuration Interface
Available in Small-Footprint VO48, VOG48, FS48,
and FSG48 Packages
Design Revision Technology Enables Storing and
Accessing Multiple Design Revisions for
Configuration
Built-In Data Decompressor Compatible with Xilinx
Advanced Compression Technology
Description
Xilinx introduces the Platform Flash series of in-system
programmable configuration PROMs. Available in
1 to 32 Mb densities, these PROMs provide an easy-to-use,
cost-effective, and reprogrammable method for storing large
Xilinx FPGA configuration bitstreams. The Platform Flash
PROM series includes both the 3.3V XCFxxS PROM and
the 1.8V XCFxxP PROM. The XCFxxS version includes
4 Mb, 2 Mb, and 1 Mb PROMs that support Master Serial
and Slave Serial FPGA configuration modes (Figure 1,
page 2). The XCFxxP version includes 32 Mb, 16 Mb, and
8 Mb PROMs that support Master Serial, Slave Serial,
Master SelectMAP, and Slave SelectMAP FPGA
configuration modes (Figure 2, page 2).
When driven from a stable, external clock, the PROMs can
output data at rates up to 33 MHz. Refer to "AC Electrical
Characteristics," page 16 for timing considerations.
A summary of the Platform Flash PROM family members
and supported features is shown in Table 1 .
35
Platform Flash In-System Programmable
Configuration PROMs
DS123 (v2.17) October 26, 2009 Product Specification
R
Table 1: Platform Flash PROM Features
Device
Density
(Mb)
V
CCINT
(V)
V
CCO
Range
(V)
V
CCJ
Range
(V)
Packages
Program In-system
via JTAG
Serial
Config.
Parallel
Config.
Design
Revisioning
Compression
XCF01S 1 3.3 1.8 – 3.3 2.5 – 3.3 VO20/VOG20 33
XCF02S 2 3.3 1.8 – 3.3 2.5 – 3.3 VO20/VOG20 33
XCF04S 4 3.3 1.8 – 3.3 2.5 – 3.3 VO20/VOG20 33
XCF08P 8 1.8 1.8 – 3.3 2.5 – 3.3
VO48/VOG48
FS48/FSG48
3333
(1)
3
XCF16P 16 1.8 1.8 – 3.3 2.5 – 3.3
VO48/VOG48
FS48/FSG48
3333 3
XCF32P 32 1.8 1.8 – 3.3 2.5 – 3.3
VO48/VOG48
FS48/FSG48
3333 3
Notes:
1. XCF08P supports storage of a design revision only when cascaded with another XCFxxP PROM. See "Design Revisioning," page 8 for details.
Platform Flash In-System Programmable Configuration PROMs
DS123 (v2.17) October 26, 2009 www.xilinx.com
Product Specification 2
R
When the FPGA is in Master Serial mode, it generates a
configuration clock that drives the PROM. With CF
High, a
short access time after CE
and OE are enabled, data is
available on the PROM DATA (D0) pin that is connected to
the FPGA DIN pin. New data is available a short access
time after each rising clock edge. The FPGA generates the
appropriate number of clock pulses to complete the
configuration.
When the FPGA is in Slave Serial mode, the PROM and the
FPGA are both clocked by an external clock source, or
optionally, for the XCFxxP PROM only, the PROM can be
used to drive the FPGA’s configuration clock.
The XCFxxP version of the Platform Flash PROM also
supports Master SelectMAP and Slave SelectMAP (or
Slave Parallel) FPGA configuration modes. When the FPGA
is in Master SelectMAP mode, the FPGA generates a
configuration clock that drives the PROM. When the FPGA
is in Slave SelectMAP Mode, either an external oscillator
generates the configuration clock that drives the PROM and
the FPGA, or optionally, the XCFxxP PROM can be used to
drive the FPGA’s configuration clock. With BUSY Low and
CF
High, after CE and OE are enabled, data is available on
the PROMs DATA (D0-D7) pins. New data is available a
short access time after each rising clock edge. The data is
clocked into the FPGA on the following rising edge of the
CCLK. A free-running oscillator can be used in the Slave
Parallel/Slave SelectMAP mode.
The XCFxxP version of the Platform Flash PROM provides
additional advanced features. A built-in data decompressor
supports utilizing compressed PROM files, and design
revisioning allows multiple design revisions to be stored on
a single PROM or stored across several PROMs. For design
revisioning, external pins or internal control bits are used to
select the active design revision.
Multiple Platform Flash PROM devices can be cascaded to
support the larger configuration files required when
targeting larger FPGA devices or targeting multiple FPGAs
daisy chained together. When utilizing the advanced
features for the XCFxxP Platform Flash PROM, such as
design revisioning, programming files which span cascaded
PROM devices can only be created for cascaded chains
containing only XCFxxP PROMs. If the advanced XCFxxP
features are not enabled, then the cascaded chain can
include both XCFxxP and XCFxxS PROMs.
X-Ref Target - Figure 1
Figure 1: XCFxxS Platform Flash PROM Block Diagram
X-Ref Target - Figure 2FI
Figure 2: XCFxxP Platform Flash PROM Block Diagram
Control
and
JTAG
Interface
Memory
Serial
Interface
DATA (D0)
Serial Mode
Data
Address
CLK CE
TCK
TMS
TDI
TDO
OE/RESET
CEO
Data
ds123_01_30603
CF
CLKOUT
CEO
DATA (D0)
(Serial/Parallel Mode)
D[1:7]
(Parallel Mode)
TCK
TMS
TDI
TDO
CLK CE EN_EXT_SEL OE/RESET BUSY
Data
Data
Address
REV_SEL [1:0]
CF
Control
and
JTAG
Interface
Memory
OSC
Serial
or
Parallel
Interface
Decompressor
DS123_19_031908
Platform Flash In-System Programmable Configuration PROMs
DS123 (v2.17) October 26, 2009 www.xilinx.com
Product Specification 3
R
See UG161, Platform Flash PROM User Guide, for detailed
guidelines on PROM-to-FPGA configuration hardware
connections, for software usage, for a reference list of Xilinx
FPGAs, and for the respective compatible Platform Flash
PROMs. Ta ble 2 lists the Platform Flash PROMs and their
capacities.
Programming
The Platform Flash PROM is a reprogrammable NOR flash
device (refer "Quality and Reliability Characteristics,"
page 14 for the program/erase specifications).
Reprogramming requires an erase followed by a program
operation. A verify operation is recommended after the
program operation to validate the correct transfer of data
from the programmer source to the Platform Flash PROM.
Several programming solutions are available.
In-System Programming
In-System Programmable PROMs can be programmed
individually, or two or more can be daisy-chained together
and programmed in-system via the standard 4-pin JTAG
protocol as shown in Figure 3.
In-system programming offers quick and efficient design
iterations and eliminates unnecessary package handling or
socketing of devices. The programming data sequence is
delivered to the device using either Xilinx iMPACT software
and a Xilinx download cable, a third-party JTAG
development system, a JTAG-compatible board tester, or a
simple microprocessor interface that emulates the JTAG
instruction sequence. The iMPACT software also outputs
serial vector format (SVF) files for use with any tools that
accept SVF format, including automatic test equipment.
During in-system programming, the CEO
output is driven
High. All other outputs are held in a high-impedance state or
held at clamp levels during in-system programming. All
non-JTAG input pins are ignored during in-system
programming, including CLK, CE, CF, OE/RESET, BUSY,
EN_EXT_SEL, and REV_SEL[1:0]. In-system programming
is fully supported across the recommended operating
voltage and temperature ranges.
Embedded, in-system programming reference designs,
such as X
APP058, Xilinx In-System Programming Using an
Embedded Microcontroller, are available on the Xilinx web
page for P
ROM Programming and Data Storage Application
Notes. See UG161, Platform Flash PROM User Guide, for
an advanced update methodology that uses the Design
Revisioning feature in the Platform Flash XCFxxP PROMs.
OE/RESET
The 1/2/4 Mb XCFxxS Platform Flash PROMs in-system
programming algorithm results in issuance of an internal
device reset that causes OE/RESET
to pulse Low.
External Programming
In traditional manufacturing environments, third-party
device programmers can program Platform Flash PROMs
with an initial memory image before the PROMs are
assembled onto boards. Contact a preferred third-party
programmer vendor for Platform Flash PROM support
information. A sample list of third-party programmer
vendors with Platform Flash PROM support is available on
the Xilinx web page for T
hird-Party Programmer Device
Support. See UG161, Platform Flash PROM User Guide,
for the PROM data file format required for programmers.
Pre-programmed PROMs can be assembled onto boards
using the typical soldering process guidelines in UG112
,
Device Package User Guide. A pre-programmed PROM’s
memory image can be updated after board assembly using
an in-system programming solution.
Reliability and Endurance
Xilinx in-system programmable products provide a
guaranteed endurance level of 20,000 in-system
program-erase cycles and a minimum data retention of 20
years. Each device meets all functional, performance, and
data retention specifications within this endurance limit.
See UG116
, Xilinx Device Reliability Report, for device
quality, reliability, and process node information.
Table 2: Platform Flash PROM Capacity
Platform
Flash PROM
Configuration
Bits
Platform
Flash PROM
Configuration
Bits
XCF01S 1,048,576 XCF08P 8,388,608
XCF02S 2,097,152 XCF16P 16,777,216
XCF04S 4,194,304 XCF32P 33,554,432
X-Ref Target - Figure 3
Figure 3: JTAG In-System Programming Operation
(a)SolderDevicetoPCB
(b) Program Using Download Cable
DS123_33_031908
GND
V
CC
(a) (b)
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