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XC95108-10PQ100I

Part # XC95108-10PQ100I
Description IC CPLD 108MC 10NS 100QFP
Category IC
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Xilinx
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Technical Document


DISCLAIMER: The information provided herein is solely for informational purposes. Customers must be aware of the suitability of this product for their application, and consider that variable factors such as Manufacturer, Product Category, Date Codes, Pictures and Descriptions may differ from available inventory.

DS066 (v5.0) May 17, 2013 www.xilinx.com 1
Product Specification
© 1998, 2003–2006, 2013 Xilinx, Inc. All rights reserved. All Xilinx trademarks, registered trademarks, patents, and disclaimers are as listed at http://www.xilinx.com/legal.htm.
All other trademarks and registered trademarks are the property of their respective owners. All specifications are subject to change without notice.
– PRODUCT OBSOLETE / UNDER OBSOLESCENCE –
Features
7.5 ns pin-to-pin logic delays on all pins
•f
CNT
to 125 MHz
108 macrocells with 2,400 usable gates
Up to 108 user I/O pins
5V in-system programmable
- Endurance of 10,000 program/erase cycles
- Program/erase over full commercial voltage and
temperature range
Enhanced pin-locking architecture
Flexible 36V18 Function Block
- 90 product terms drive any or all of 18 macrocells
within Function Block
- Global and product term clocks, output enables,
set and reset signals
Extensive IEEE Std 1149.1 boundary-scan (JTAG)
support
Programmable power reduction mode in each
macrocell
Slew rate control on individual outputs
User programmable ground pin capability
Extended pattern security features for design
protection
High-drive 24 mA outputs
3.3V or 5V I/O capability
Advanced CMOS 5V FastFLASH™ technology
Supports parallel programming of more than one
XC9500 concurrently
Available in 84-pin PLCC, 100-pin PQFP, 100-pin
TQFP, and 160-pin PQFP packages
Description
The XC95108 is a high-performance CPLD providing
advanced in-system programming and test capabilities for
general purpose logic integration. It is comprised of eight
36V18 Function Blocks, providing 2,400 usable gates with
propagation delays of 7.5 ns. See Figure 2 for the architec-
ture overview.
Power Management
Power dissipation can be reduced in the XC95108 by con-
figuring macrocells to standard or low-power modes of
operation. Unused macrocells are turned off to minimize
power dissipation.
Operating current for each design can be approximated for
specific operating conditions using the following equation:
I
CC
(mA) = MC
HP
(1.7) + MC
LP
(0.9) + MC (0.006 mA/MHz) f
Where:
MC
HP
= Macrocells in high-performance mode
MC
LP
= Macrocells in low-power mode
MC = Total number of macrocells used
f = Clock frequency (MHz)
Figure 1 shows a typical calculation for the XC95108
device.
0
XC95108 In-System
Programmable CPLD
DS066 (v5.0) May 17, 2013
05
Product Specification
R
Figure 1: Typical I
CC
vs. Frequency for XC95108
Clock Frequency (MHz)
Typical I
CC
(mA)
050
100
(180)
(250)
(170)
200
300
100
High Performance
Low Power
DS066_01_110501
XC95108 In-System Programmable CPLD
2 www.xilinx.com DS066 (v5.0) May 17, 2013
Product Specification
R
– PRODUCT OBSOLETE / UNDER OBSOLESCENCE –
Figure 2: XC95108 Architecture
Function block outputs (indicated by the bold line) drive the I/O blocks directly.
In-System Programming Controller
JTAG
Controller
I/O
Blocks
Function
Block 1
Macrocells
1 to 18
Macrocells
1 to 18
JTAG Port
3
36
I/O/GTS
I/O/GSR
I/O/GCK
I/O
I/O
I/O
I/O
2
1
I/O
I/O
I/O
I/O
3
DS066_02_110101
1
Function
Block 2
36
18
18
Function
Block 3
Macrocells
1 to 18
Macrocells
1 to 18
36
Function
Block 6
36
18
18
Function
Block 4
Macrocells
1 to 18
36
18
Function
Block 5
Macrocells
1 to 18
36
18
Fast CONNECT II Switch Matrix
XC95108 In-System Programmable CPLD
DS066 (v5.0) May 17, 2013 www.xilinx.com 3
Product Specification
R
– PRODUCT OBSOLETE / UNDER OBSOLESCENCE –
Absolute Maximum Ratings
Recommended Operation Conditions
Quality and Reliability Characteristics
DC Characteristic Over Recommended Operating Conditions
Symbol Description Value Units
V
CC
Supply voltage relative to GND –0.5 to 7.0 V
V
IN
Input voltage relative to GND –0.5 to V
CC
+ 0.5 V
V
TS
Voltage applied to 3-state output –0.5 to V
CC
+ 0.5 V
T
STG
Storage temperature (ambient) –65 to +150
o
C
T
J
Junction temperature +150
o
C
Notes:
1. Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress
ratings only, and functional operation of the device at these or any other conditions beyond those listed under Operating Conditions
is not implied. Exposure to Absolute Maximum Ratings conditions for extended periods of time may affect device reliability.
Symbol Parameter Min Max Units
V
CCINT
Supply voltage for internal logic
and input buffers
Commercial T
A
= 0
o
C to 70
o
C 4.75 5.25 V
Industrial T
A
= –40
o
C to +85
o
C4.5 5.5
V
CCIO
Supply voltage for output drivers
for 5V operation
Commercial T
A
= 0
o
C to 70
o
C 4.75 5.25 V
Industrial T
A
= –40
o
C to +85
o
C4.5 5.5
Supply voltage for output drivers for 3.3V operation 3.0 3.6
V
IL
Low-level input voltage 0 0.80 V
V
IH
High-level input voltage 2.0 V
CCINT
+ 0.5 V
V
O
Output voltage 0 V
CCIO
V
Symbol Parameter Min Max Units
T
DR
Data Retention 20 - Years
N
PE
Program/Erase Cycles (Endurance) 10,000 - Cycles
Symbol Parameter Test Conditions Min Max Units
V
OH
Output high voltage for 5V outputs I
OH
= –4.0 mA, V
CC
= Min 2.4 - V
Output high voltage for 3.3V outputs I
OH
= –3.2 mA, V
CC
= Min 2.4 - V
V
OL
Output low voltage for 5V outputs I
OL
= 24 mA, V
CC
= Min - 0.5 V
Output low voltage for 3.3V outputs I
OL
= 10 mA, V
CC
= Min - 0.4 V
I
IL
Input leakage current V
CC
= Max
V
IN
= GND or V
CC
10μA
I
IH
I/O high-Z leakage current V
CC
= Max
V
IN
= GND or V
CC
10μA
C
IN
I/O capacitance V
IN
= GND
f = 1.0 MHz
-10pF
I
CC
Operating supply current
(low power mode, active)
V
I
= GND, No load
f = 1.0 MHz
100 (Typical) mA
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