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XC4VFX100-11FF1152I

Part # XC4VFX100-11FF1152I
Description FPGA VIRTEX-4 94896 CELLS 90NM 1.2V 1152FCBGA - Trays
Category IC
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Xilinx
Date Code: 1105
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Technical Document


DISCLAIMER: The information provided herein is solely for informational purposes. Customers must be aware of the suitability of this product for their application, and consider that variable factors such as Manufacturer, Product Category, Date Codes, Pictures and Descriptions may differ from available inventory.

Virtex-4 FPGA Data Sheet: DC and Switching Characteristics
DS302 (v3.7) September 9, 2009 www.xilinx.com
Product Specification 49
ChipSync™ Source-Synchronous Switching Characteristics
The parameters in this section provide the necessary values for calculating timing budgets for Virtex-4 FPGA
source-synchronous transmitter and receiver data-valid windows.
Tabl e 59 : Duty Cycle Distortion and Clock-Tree Skew
Symbol Description Device
Speed Grade
Units
-12 -11 -10
T
DCD_CLK
Global Clock Tree Duty Cycle Distortion
(1)
All 150 150 150 ps
T
CKSKEW
Global Clock Tree Skew
(2)
XC4VLX15 50 60 60 ps
XC4VLX25 90 100 110 ps
XC4VLX40 140 160 180 ps
XC4VLX60 140 160 180 ps
XC4VLX80 200 230 260 ps
XC4VLX100 270 310 350 ps
XC4VLX160 270 310 350 ps
XC4VLX200 N/A 310 350 ps
XC4VSX25 50 60 70 ps
XC4VSX35 90 100 120 ps
XC4VSX55 140 170 190 ps
XC4VFX12 50 60 70 ps
XC4VFX20 60 70 70 ps
XC4VFX40 90 110 120 ps
XC4VFX60 140 170 190 ps
XC4VFX100 200 230 260 ps
XC4VFX140 N/A 310 350 ps
T
DCD_BUFIO
I/O clock tree duty cycle distortion All 100 100 100 ps
I/O clock tree skew across one clock region All 50 50 50 ps
T
BUFIOSKEW
I/O clock tree skew across multiple clock regions All 50 50 50 ps
T
DCD_BUFR
Regional clock tree duty cycle distortion All 250 250 250 ps
T
BUFIO_MAX_FREQ
I/O clock tree MAX frequency All 710 710 645 MHz
T
BUFR_MAX_FREQ
Regional clock tree MAX frequency All 300 250 250 MHz
Notes:
1. These parameters represent the worst-case duty cycle distortion observable at the pins of the device using LVDS output buffers. For cases where
other I/O standards are used, IBIS can be used to calculate any additional duty cycle distortion that might be caused by asymmetrical rise/fall times.
2. The T
CKSKEW
value represents the worst-case vertical clock-tree skew observable between sequential I/O elements. Significantly less clock-tree
skew exists for I/O registers that are close to each other and fed by the same or adjacent clock-tree branches. Use the Xilinx FPGA_Editor and Timing
Analyzer tools to evaluate clock skew specific to your application.
Virtex-4 FPGA Data Sheet: DC and Switching Characteristics
DS302 (v3.7) September 9, 2009 www.xilinx.com
Product Specification 50
Tabl e 60 : Package Skew
Symbol Description Device Package Value Units
T
PKGSKEW
Package Skew
(1)
XC4VLX15
SF363 80 ps
FF668 120 ps
XC4VLX25
SF363 90 ps
FF668 110 ps
XC4VLX40
FF668 110 ps
FF1148 150 ps
XC4VLX60
FF668 130 ps
FF1148 140 ps
XC4VLX80 FF1148 155 ps
XC4VLX100
FF1148 140 ps
FF1513 180 ps
XC4VLX160
FF1148 145 ps
FF1513 180 ps
XC4VLX200 FF1513 180 ps
XC4VSX25 FF668 90 ps
XC4VSX35 FF668 100 ps
XC4VSX55 FF1148 145 ps
XC4VFX12
SF363 90 ps
FF668 100 ps
XC4VFX20 FF672 110 ps
XC4VFX40
FF672 120 ps
FF1152 150 ps
XC4VFX60
FF672 110 ps
FF1152 170 ps
XC4VFX100
FF1152 150 ps
FF1517 170 ps
XC4VFX140 FF1517 150 ps
Notes:
1. These values represent the worst-case skew between any two balls of the package: shortest flight time to longest flight time from Pad to Ball
(7.1 ps per mm).
2. Package trace length information is available for these device/package combinations. This information can be used to deskew the package.
Virtex-4 FPGA Data Sheet: DC and Switching Characteristics
DS302 (v3.7) September 9, 2009 www.xilinx.com
Product Specification 51
Production Stepping
The Virtex-4 FPGA stepping identification system denotes
the capability improvement of production released devices.
By definition, devices from one stepping are functional
supersets of previous devices. Bitstreams compiled for a
device with an earlier stepping are guaranteed to operate
correctly in subsequent device steppings.
New device steppings can be shipped in place of earlier
device steppings. Existing production designs are guaran-
teed on new device steppings. To take advantage of the
capabilities of a newer device stepping, customers are able
to order a new stepping version and compile a new bit-
stream.
Production devices are marked with a stepping version, with
the exception of some step 1 devices. Designs should be
compiled with a CONFIG STEPPING parameter set to a
specific stepping version. This parameter is set in the UCF
file:
CONFIG STEPPING = “#”; (where # is the stepping
version)
The default stepping level used by the ISE software is
reported in the PAR report.
Tabl e 6 3 shows the JTAG ID code by step.
Tabl e 61 : Sample Window
Symbol Description Device
Speed Grade
Units
-12 -11 -10
T
SAMP
Sampling Error at Receiver Pins
(1)
All 450 500 550 ps
T
SAMP_BUFIO
Sampling Error at Receiver Pins using BUFIO
(2)
All 350 400 450 ps
Notes:
1. This parameter indicates the total sampling error of Virtex-4 FPGA DDR input registers across voltage, temperature, and process. The
characterization methodology uses the DCM to capture the DDR input registers’ edges of operation. These measurements include:
- CLK0 DCM jitter
- DCM accuracy (phase offset)
- DCM phase shift resolution
These measurements do not include package or clock tree skew.
2. This parameter indicates the total sampling error of Virtex-4 FPGA DDR input registers across voltage, temperature, and process. The
characterization methodology uses the BUFIO clock network and IDELAY to capture the DDR input registers’ edges of operation. These
measurements do not include package or clock tree skew.
Tabl e 62 : ChipSync Pin-to-Pin Setup/Hold and Clock-to-Out
Symbol Description
Speed Grade
Units
-12 -11 -10
Data Input Setup and Hold Times Relative to a Forwarded Clock Input Pin Using BUFIO
T
PSCS
/T
PHCS
Setup/Hold of I/O clock across multiple clock regions
–0.45
0.97
–0.45
1.08
–0.44
1.17
ns
Pin-to-Pin Clock-to-Out Using BUFIO
T
ICKOFCS
Clock-to-Out of I/O clock across multiple clock regions 4.10 4.54 5.02 ns
Table 63: JTAG ID Code by Step
Device Step 0 Step 1 Step 2
XC4VLX15
35
XC4VLX25
9A
XC4VLX40
35
XC4VLX60
2 or 3 4 or 5
XC4VLX80
35
XC4VLX100
2 or 3 4 or 5
XC4VLX160
0 or 3 4 or 5
XC4VLX200
0 or 3 2 or 5
XC4VSX25
24
XC4VSX35
24
XC4VSX55
24
XC4VFX12
0 or 2
XC4VFX20
26
XC4VFX40
0
XC4VFX60
28
XC4VFX100
06
XC4VFX140
04
Notes:
1. Shaded cells represent devices not produced at that stepping.
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