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XC3S200-4FTG256I

Part # XC3S200-4FTG256I
Description FPGA SPARTAN-3 200K GATES 4320 CELLS 630MHZ 1.2V 256FTBGA
Category IC
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Technical Document


DISCLAIMER: The information provided herein is solely for informational purposes. Customers must be aware of the suitability of this product for their application, and consider that variable factors such as Manufacturer, Product Category, Date Codes, Pictures and Descriptions may differ from available inventory.

DS099 October 29, 2012 www.xilinx.com
Product Specification 1
© Copyright 2003–2012 Xilinx, Inc. XILINX, the Xilinx logo, Virtex, Spartan, ISE, Artix, Kintex, Zynq, Vivado, and other designated brands included herein are trademarks of Xilinx
in the United States and other countries. PCI and PCI-X are trademarks of PCI-SIG and used under license. All other trademarks are the property of their respective owners.
PRODUCT NOT RECOMMENDED FOR NEW DESIGNS
Module 1:
Introduction and Ordering Information
DS099 (v3.0) October 29, 2012
Introduction
•Features
Architectural Overview
Array Sizes and Resources
User I/O Chart
Ordering Information
Module 2: Functional Description
DS099 (v3.0) October 29, 2012
Input/Output Blocks (IOBs)
IOB Overview
SelectIO™ Interface I/O Standards
Configurable Logic Blocks (CLBs)
Block RAM
Dedicated Multipliers
Digital Clock Manager (DCM)
Clock Network
Configuration
Module 3:
DC and Switching Characteristics
DS099 (v3.0) October 29, 2012
DC Electrical Characteristics
Absolute Maximum Ratings
Supply Voltage Specifications
Recommended Operating Conditions
DC Characteristics
Switching Characteristics
I/O Timing
Internal Logic Timing
DCM Timing
Configuration and JTAG Timing
Module 4: Pinout Descriptions
DS099 (v3.0) October 29, 2012
Pin Descriptions
Pin Behavior During Configuration
Package Overview
•Pinout Tables
•Footprints
1
Spartan-3 FPGA Family
Data Sheet
DS099 October 29, 2012 Product Specification
DS099 (v3.0) October 29, 2012 www.xilinx.com
Product Specification 2
© Copyright 2003–2012 Xilinx, Inc. XILINX, the Xilinx logo, Virtex, Spartan, ISE, Artix, Kintex, Zynq, Vivado, and other designated brands included herein are trademarks of Xilinx
in the United States and other countries. PCI and PCI-X are trademarks of PCI-SIG and used under license. All other trademarks are the property of their respective owners.
PRODUCT NOT RECOMMENDED FOR NEW DESIGNS
Introduction
The Spartan®-3 family of Field-Programmable Gate Arrays
is specifically designed to meet the needs of high volume,
cost-sensitive consumer electronic applications. The
eight-member family offers densities ranging from 50,000 to
5,000,000 system gates, as shown in Ta ble 1 .
The Spartan-3 family builds on the success of the earlier
Spartan-IIE family by increasing the amount of logic
resources, the capacity of internal RAM, the total number of
I/Os, and the overall level of performance as well as by
improving clock management functions. Numerous
enhancements derive from the Virtex®-II platform
technology. These Spartan-3 FPGA enhancements,
combined with advanced process technology, deliver more
functionality and bandwidth per dollar than was previously
possible, setting new standards in the programmable logic
industry.
Because of their exceptionally low cost, Spartan-3 FPGAs
are ideally suited to a wide range of consumer electronics
applications, including broadband access, home
networking, display/projection and digital television
equipment.
The Spartan-3 family is a superior alternative to mask
programmed ASICs. FPGAs avoid the high initial cost, the
lengthy development cycles, and the inherent inflexibility of
conventional ASICs. Also, FPGA programmability permits
design upgrades in the field with no hardware replacement
necessary, an impossibility with ASICs.
Features
Low-cost, high-performance logic solution for high-volume,
consumer-oriented applications
Densities up to 74,880 logic cells
SelectIO™ interface signaling
Up to 633 I/O pins
622+ Mb/s data transfer rate per I/O
18 single-ended signal standards
8 differential I/O standards including LVDS, RSDS
Termination by Digitally Controlled Impedance
Signal swing ranging from 1.14V to 3.465V
Double Data Rate (DDR) support
DDR, DDR2 SDRAM support
up to 333 Mb/s
Logic resources
Abundant logic cells with shift register capability
Wide, fast multiplexers
Fast look-ahead carry logic
Dedicated 18 x 18 multipliers
JTAG logic compatible with IEEE 1149.1/1532
SelectRAM™ hierarchical memory
Up to 1,872 Kbits of total block RAM
Up to 520 Kbits of total distributed RAM
Digital Clock Manager (up to four DCMs)
Clock skew elimination
Frequency synthesis
High resolution phase shifting
Eight global clock lines and abundant routing
Fully supported by Xilinx ISE
® and WebPACK™ software
development systems
MicroBlaze™ and PicoBlaze™ processor, PCI®,
PCI Express® PIPE Endpoint
, and other IP cores
Pb-free packaging options
Automotive Spartan-3 XA Family
variant
8
Spartan-3 FPGA Family:
Introduction and Ordering Information
DS099 (v3.0) October 29, 2012 Product Specification
Tabl e 1 : Summary of Spartan-3 FPGA Attributes
Device
System
Gates
Equivalent
Logic Cells
(1)
CLB Array
(One CLB = Four Slices)
Distributed
RAM Bits
(K=1024)
Block
RAM Bits
(K=1024)
Dedicated
Multipliers
DCMs
Max.
User I/O
Maximum
Differential
I/O Pairs
Rows Columns
Total
CLBs
XC3S50
(2)
50K 1,728 16 12 192 12K 72K 4 2 124 56
XC3S200
(2)
200K 4,320 24 20 480 30K 216K 12 4 173 76
XC3S400
(2)
400K 8,064 32 28 896 56K 288K 16 4 264 116
XC3S1000
(2)
1M 17,280 48 40 1,920 120K 432K 24 4 391 175
XC3S1500 1.5M 29,952 64 52 3,328 208K 576K 32 4 487 221
XC3S2000 2M 46,080 80 64 5,120 320K 720K 40 4 565 270
XC3S4000 4M 62,208 96 72 6,912 432K 1,728K 96 4 633 300
XC3S5000 5M 74,880 104 80 8,320 520K 1,872K 104 4 633 300
Notes:
1. Logic Cell = 4-input Look-Up Table (LUT) plus a ‘D’ flip-flop. "Equivalent Logic Cells" equals "Total CLBs" x 8 Logic Cells/CLB x 1.125 effectiveness.
2. These devices are available in Xilinx Automotive versions as described in DS314
: Spartan-3 Automotive XA FPGA Family.
Spartan-3 FPGA Family: Introduction and Ordering Information
DS099 (v3.0) October 29, 2012 www.xilinx.com
Product Specification 3
PRODUCT NOT RECOMMENDED FOR NEW DESIGNS
Architectural Overview
The Spartan-3 family architecture consists of five fundamental programmable functional elements:
Configurable Logic Blocks (CLBs) contain RAM-based Look-Up Tables (LUTs) to implement logic and storage
elements that can be used as flip-flops or latches. CLBs can be programmed to perform a wide variety of logical
functions as well as to store data.
Input/Output Blocks (IOBs) control the flow of data between the I/O pins and the internal logic of the device. Each IOB
supports bidirectional data flow plus 3-state operation. Twenty-six different signal standards, including eight
high-performance differential standards, are available as shown in Tabl e 2 . Double Data-Rate (DDR) registers are
included. The Digitally Controlled Impedance (DCI) feature provides automatic on-chip terminations, simplifying board
designs.
Block RAM provides data storage in the form of 18-Kbit dual-port blocks.
Multiplier blocks accept two 18-bit binary numbers as inputs and calculate the product.
Digital Clock Manager (DCM) blocks provide self-calibrating, fully digital solutions for distributing, delaying, multiplying,
dividing, and phase shifting clock signals.
These elements are organized as shown in Figure 1. A ring of IOBs surrounds a regular array of CLBs. The XC3S50 has a
single column of block RAM embedded in the array. Those devices ranging from the XC3S200 to the XC3S2000 have two
columns of block RAM. The XC3S4000 and XC3S5000 devices have four RAM columns. Each column is made up of several
18-Kbit RAM blocks; each block is associated with a dedicated multiplier. The DCMs are positioned at the ends of the outer
block RAM columns.
The Spartan-3 family features a rich network of traces and switches that interconnect all five functional elements,
transmitting signals among them. Each functional element has an associated switch matrix that permits multiple connections
to the routing.
Configuration
Spartan-3 FPGAs are programmed by loading configuration data into robust reprogrammable static CMOS configuration
latches (CCLs) that collectively control all functional elements and routing resources. Before powering on the FPGA,
configuration data is stored externally in a PROM or some other nonvolatile medium either on or off the board. After applying
X-Ref Target - Figure 1
Figure 1: Spartan-3 Family Architecture
DS099-1_01_032703
Notes:
1. The two additional block RAM columns of the XC3S4000 and XC3S5000 devices
are shown with dashed lines. The XC3S50 has only the block RAM column on the
far left.
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