XC2C64A CoolRunner-II CPLD
DS311 (v2.3) November 19, 2008 www.xilinx.com 13
Product Specification
Device Part Marking
Figure 5: Sample Package with Part Marking
Note: Due to the small size of chip scale and quad flat no lead packages, the complete ordering part number cannot be
included on the package marking. Part marking on chip scale and quad flat no lead packages by line are:
1. X (Xilinx logo) then truncated part number
2. Not related to device part number
3. Not related to device part number
4. Device code, speed, operating temperature, three digits
not related to device part number. Device codes: C3 =
CP56, C4 = CPG56, Q2 = QFG48.
XC2C64A-7VQG44I 0.8mm 46.6 8.2 Very Thin Quad Flat
Pack; Pb-free
10mm x 10mm 33 I
XC2C64A-7CPG56I 0.5mm 65.0 15.0 Chip Scale Package;
Pb-free
6mm x 6mm 45 I
XC2C64A-7VQG100I 0.5mm 53.2 14.6 Very Thin Quad Flat
Pack; Pb-free
14mm x 14mm 64 I
Notes:
1. C = Commercial (T
A
= 0°C to +70°C); I = Industrial (T
A
= –40°C to +85°C).
Device Ordering No.
and Part Marking No.
Pin/Ball
Spacing
θ
JA
(°C/Watt)
θ
JC
({C/Watt) Package Type
Package Body
Dimensions I/O
Comm(C)
Ind. (I)
(1)
Standard Example: XC2C128
Device
Speed Grade
Package Type
Number of Pins
Temperature Range
-4 TQ C144
Pb-
Free Example:
XC2C128 TQ G 144 C
Device
Speed Grade
Package Type
Pb
-Free
Number of Pins
-4
Temperature Range
XC2Cxxx
TQ144
7C
Device Type
Package
Speed
Operating Range
This line not
related to device
part number
R
Part marking for non-chip scale package
DS311_05_102108