W25X10, W25X20, W25X40, W25X80
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Table of Contents-
1. GENERAL DESCRIPTION ......................................................................................................... 4
2. FEATURES................................................................................................................................. 4
3. PIN CONFIGURATION SOIC 150-MIL....................................................................................... 5
4. PIN CONFIGURATION SOIC 208-MIL....................................................................................... 5
5. PIN CONFIGURATION PDIP 300-MIL ....................................................................................... 5
6. PIN CONFIGURATION WSON 6X5-MM.................................................................................... 6
7. PIN DESCRIPTION..................................................................................................................... 6
7.1 Package Types............................................................................................................... 7
7.2 Chip Select (/CS)............................................................................................................ 7
7.3 Serial Data Output (DO) ................................................................................................. 7
7.4 Write Protect (/WP)......................................................................................................... 7
7.5 HOLD (/HOLD) ............................................................................................................... 7
7.6 Serial Clock (CLK) .......................................................................................................... 7
7.7 Serial Data Input / Output (DIO) ..................................................................................... 7
8. BLOCK DIAGRAM ...................................................................................................................... 8
9. FUNCTIONAL DESCRIPTION ................................................................................................... 9
9.1 SPI OPERATIONS ......................................................................................................... 9
9.1.1 SPI Modes........................................................................................................................9
9.1.2 Dual Output SPI................................................................................................................9
9.1.3 Hold Function ...................................................................................................................9
9.2 WRITE PROTECTION.................................................................................................. 10
9.2.1 Write Protect Features....................................................................................................10
10. CONTROL AND STATUS REGISTERS................................................................................... 11
10.1 STATUS REGISTER .................................................................................................... 11
10.1.1 BUSY............................................................................................................................11
10.1.2 Write Enable Latch (WEL) ............................................................................................11
10.1.3 Block Protect Bits (BP2, BP1, BP0)..............................................................................11
10.1.4 Top/Bottom Block Protect (TB).....................................................................................11
10.1.5 Reserved Bits ...............................................................................................................11
10.1.6 Status Register Protect (SRP)......................................................................................12
10.1.7 Status Register Memory Protection..............................................................................13
10.2 INSTRUCTIONS........................................................................................................... 14
10.2.1 Manufacturer and Device Identification.........................................................................14
10.2.2 Instruction Set
(1)
...........................................................................................................15
10.2.3 Write Ensable (06h)......................................................................................................16
10.2.4 Write Disable (04h).......................................................................................................16
