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W25X40CLSNIG

Part # W25X40CLSNIG
Description 4MB SERIAL FLASH MEMORY
Category IC
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Technical Document


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W25X40CL
Publication Release Date: October 15, 2012
- 1 - Revision E
2.5/3/3.3 V 4M-BIT
SERIAL FLASH MEMORY WITH
4KB SECTORS AND DUAL I/O SPI
W25X40CL
Publication Release Date: October 15, 2012
- 2 - Revision E
Table of Contents
1. GENERAL DESCRIPTION ......................................................................................................... 4
2. FEATURES ................................................................................................................................. 4
3. PIN CONFIGURATION SOIC 208-MIL, SOIC 150-MIL AND VSOP 150-MIL ............................ 5
4. PAD CONFIGURATION WSON 6X5-MM AND USON 2X3-MM ................................................ 5
5. PIN CONFIGURATION PDIP 300-MIL ....................................................................................... 6
6. PIN DESCRIPTION SOIC, VSOP, WSON, USON AND PDIP ................................................... 6
6.1 Package Types ............................................................................................................... 7
6.2 Chip Select (/CS) ............................................................................................................ 7
6.3 Serial Data Input, Output and IOs (DI, DO, IO0 and IO1) .............................................. 7
6.4 Write Protect (/WP) ......................................................................................................... 7
6.5 HOLD (/HOLD)................................................................................................................ 7
6.6 Serial Clock (CLK) .......................................................................................................... 7
7. BLOCK DIAGRAM ...................................................................................................................... 8
7.1 SPI OPERATIONS ......................................................................................................... 9
7.1.1 Standard SPI Instructions ................................................................................................. 9
7.1.2 Dual SPI Instructions ........................................................................................................ 9
7.1.3 Hold Function ................................................................................................................... 9
7.2 WRITE PROTECTION .................................................................................................. 10
7.2.1 Write Protect Features .................................................................................................... 10
8. CONTROL AND STATUS REGISTERS ................................................................................... 11
8.1 STATUS REGISTER .................................................................................................... 11
8.1.1 BUSY .............................................................................................................................. 11
8.1.2 Write Enable Latch (WEL) .............................................................................................. 11
8.1.3 Block Protect Bits (BP2, BP1, BP0) ................................................................................ 11
8.1.4 Top/Bottom Block Protect (TB) ....................................................................................... 11
8.1.5 Reserved Bits ................................................................................................................. 12
8.1.6 Status Register Protect (SRP) ........................................................................................ 12
8.1.7 Status Register Memory Protection ................................................................................ 13
8.2 INSTRUCTIONS ........................................................................................................... 14
8.2.1 Manufacturer and Device Identification .......................................................................... 14
8.2.2 Instruction Set ............................................................................................................... 15
8.2.3 Write Enable (06h).......................................................................................................... 16
8.2.4 Write Enable for Volatile Status Register (50h) .............................................................. 16
8.2.5 Write Disable (04h) ......................................................................................................... 17
8.2.6 Read Status Register (05h) ............................................................................................ 17
8.2.7 Write Status Register (01h) ............................................................................................ 18
8.2.8 Read Data (03h) ............................................................................................................. 19
8.2.9 Fast Read (0Bh) ............................................................................................................. 20
8.2.10 Fast Read Dual Output (3Bh) ....................................................................................... 21
8.2.11 Fast Read Dual I/O (BBh) ............................................................................................. 22
8.2.12 Continuous Read Mode Bits (M7-0) ............................................................................. 24
8.2.13 Continuous Read Mode Reset (FFFFh) ....................................................................... 24
8.2.14 Page Program (02h) ..................................................................................................... 25
8.2.15 Sector Erase (20h) ....................................................................................................... 26
W25X40CL
Publication Release Date: October 15, 2012
- 3 - Revision E
8.2.16 32KB Block Erase (52h) ............................................................................................... 27
8.2.17 Block Erase (D8h) ........................................................................................................ 28
8.2.18 Chip Erase (C7h or 60h) ............................................................................................... 29
8.2.19 Power-down (B9h) ........................................................................................................ 30
8.2.20 Release Power-down / Device ID (ABh) ....................................................................... 31
8.2.21 Read Manufacturer / Device ID (90h) ........................................................................... 33
8.2.22 Read Manufacturer / Device ID Dual I/O (92h) ............................................................. 34
8.2.23 Read Unique ID Number (4Bh) .................................................................................... 35
8.2.24 JEDEC ID (9Fh)............................................................................................................ 36
9. ELECTRICAL CHARACTERISTICS ......................................................................................... 37
9.1 Absolute Maximum Rating ............................................................................................ 37
9.2 Operating Ranges ......................................................................................................... 37
9.3 Power-up Timing and Write Inhibit Threshold .............................................................. 38
9.4 DC Electrical Characteristics ........................................................................................ 39
9.5 AC Measurement Conditions ........................................................................................ 40
9.6 AC Electrical Characteristics ........................................................................................ 41
AC Electrical Characteristics (cont’d) ........................................................................................ 42
9.7 Serial Output Timing ..................................................................................................... 43
9.8 Serial Input Timing ........................................................................................................ 43
9.9 HOLD Timing ................................................................................................................ 43
9.10 WP Timing .................................................................................................................... 43
10. PACKAGE SPECIFICATION .................................................................................................... 44
10.1 8-Pin SOIC 150-mil (Package Code SN) ...................................................................... 44
10.2 8-Pin VSOP8 150-mil (Package Code SV) ................................................................... 45
10.3 8-Pin SOIC 208-mil (Package Code SS) ...................................................................... 46
10.4 8-Pad 6x5mm WSON (Package Code ZP) .................................................................. 47
10.5 8-Pad WSON 6x5mm Cont’d. ....................................................................................... 48
10.6 8-Pad USON 2x3-mm (Package Code UX) .................................................................. 49
10.7 8-pin PDIP 300-mil (Package Code DA) ...................................................................... 50
11. ORDERING INFORMATION ..................................................................................................... 51
11.1 Valid Part Numbers and Top Side Marking .................................................................. 52
12. REVISION HISTORY ................................................................................................................ 53
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