PACKAGING INFORMATION
Orderable Device Status
(1)
Package
Type
Package
Drawing
Pins Package
Qty
Eco Plan
(2)
Lead/Ball Finish MSL Peak Temp
(3)
UCC1895J ACTIVE CDIP J 20 1 None A42 SNPB Level-NC-NC-NC
UCC1895L ACTIVE LCCC FK 20 1 None POST-PLATE Level-NC-NC-NC
UCC2895DW ACTIVE SOIC DW 20 25 None CU SNPB Level-2-220C-1 YEAR
UCC2895DWTR ACTIVE SOIC DW 20 2000 None CU SNPB Level-2-220C-1 YEAR
UCC2895N ACTIVE PDIP N 20 20 None CU SNPB Level-NA-NA-NA
UCC2895PW ACTIVE TSSOP PW 20 70 None CU NIPDAU Level-2-220C-1 YEAR
UCC2895PWTR ACTIVE TSSOP PW 20 2000 None CU NIPDAU Level-2-220C-1 YEAR
UCC2895PWTRG4 PREVIEW TSSOP PW 20 2000 None Call TI Call TI
UCC2895Q ACTIVE PLCC FN 20 46 None CU SNPB Level-2-220C-1 YEAR
UCC2895QTR ACTIVE PLCC FN 20 1000 None CU SNPB Level-2-220C-1 YEAR
UCC3895DW ACTIVE SOIC DW 20 25 None CU SNPB Level-2-220C-1 YEAR
UCC3895DWTR ACTIVE SOIC DW 20 2000 None CU SNPB Level-2-220C-1 YEAR
UCC3895DWTRG4 ACTIVE SOIC DW 20 2000 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
UCC3895N ACTIVE PDIP N 20 20 None CU SNPB Level-NA-NA-NA
UCC3895PW ACTIVE TSSOP PW 20 70 None CU NIPDAU Level-2-220C-1 YEAR
UCC3895PWTR ACTIVE TSSOP PW 20 2000 None CU NIPDAU Level-2-220C-1 YEAR
UCC3895PWTRG4 ACTIVE TSSOP PW 20 2000 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-2-260C-1 YEAR
UCC3895Q ACTIVE PLCC FN 20 46 None CU SNPB Level-2-220C-1 YEAR
UCC3895QTR ACTIVE PLCC FN 20 1000 None CU SNPB Level-2-220C-1 YEAR
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - May not be currently available - please check http://www.ti.com/productcontent for the latest availability information and additional
product content details.
None: Not yet available Lead (Pb-Free).
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Green (RoHS & no Sb/Br): TI defines "Green" to mean "Pb-Free" and in addition, uses package materials that do not contain halogens,
including bromine (Br) or antimony (Sb) above 0.1% of total product weight.
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDECindustry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
PACKAGE OPTION ADDENDUM
www.ti.com
25-Feb-2005
Addendum-Page 1
