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UCC2915DP

Part # UCC2915DP
Description 15V PROG HOT SWAP PWR MANAGER- Rail/Tube
Category IC
Availability In Stock
Qty 10
Qty Price
1 - 2 $9.28557
3 - 4 $7.38625
5 - 6 $6.96417
7 - 8 $6.47176
9 + $5.76831
Manufacturer Available Qty
Texas Instruments
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Technical Document


DISCLAIMER: The information provided herein is solely for informational purposes. Customers must be aware of the suitability of this product for their application, and consider that variable factors such as Manufacturer, Product Category, Date Codes, Pictures and Descriptions may differ from available inventory.

 
     
SLUS198C FEBUARY 2000 - REVISED - JUNE 2001
7
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
APPLICATION INFORMATION
For worst-case constant-current load of value just less than the trip limit; C
OUT(max)
can be estimated from:
C
OUT(max)
[
ǒ
I
MAX
* I
LOAD
Ǔ
ǒ
16.1 10
3
C
T
V
OUT
Ǔ
Where V
OUT
is the output voltage.
For a resistive load of value R
L
, the value of C
OUT(max)
can be estimated from:
C
OUT(max)
[
ȧ
ȧ
ȧ
ȧ
ȧ
ȧ
ȧ
ȧ
ȧ
ȧ
ȧ
ȡ
Ȣ
16.1 10
3
C
T
R
L
ȏn
ȧ
ȧ
ȧ
ȱ
Ȳ
1
1*
V
OUT
I
MAX
R
L
ȧ
ȧ
ȧ
ȳ
ȴ
ȧ
ȧ
ȧ
ȧ
ȧ
ȧ
ȧ
ȧ
ȧ
ȧ
ȧ
ȣ
Ȥ
Long C
T
times must consider the maximum temperature. Thermal shutdown protection may be the limiting fault
time.
safety recommendations
Although the UCC3915 is designed to provide system protection for all fault conditions, all integrated circuits
can ultimately fail short. For this reason, if the UCC3915 is intended for use in safety-critical applications where
UL or some other safety rating is required, a redundant safety device such as a fuse should be placed in series
with the device. The UCC3915 will prevent the fuse from blowing for virtually all fault conditions, increasing
system reliability and reducing maintenance cost, in addition to providing the hot-swap benefits of the device.
PACKAGE OPTION ADDENDUM
www.ti.com
21-Mar-2013
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status
(1)
Package Type Package
Drawing
Pins Package Qty Eco Plan
(2)
Lead/Ball Finish MSL Peak Temp
(3)
Op Temp (°C) Top-Side Markings
(4)
Samples
UCC2915DP ACTIVE SOIC D 16 40 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-2-260C-1 YEAR -40 to 85 UCC2915DP
UCC2915DPG4 ACTIVE SOIC D 16 40 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-2-260C-1 YEAR -40 to 85 UCC2915DP
UCC2915DPTR OBSOLETE SOIC D 16 TBD Call TI Call TI -40 to 85 UCC2915DP
UCC2915DPTRG4 OBSOLETE SOIC D 16 TBD Call TI Call TI -40 to 85
UCC3915DP ACTIVE SOIC D 16 40 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-2-260C-1 YEAR 0 to 70 UCC3915DP
UCC3915DPG4 ACTIVE SOIC D 16 40 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-2-260C-1 YEAR 0 to 70 UCC3915DP
UCC3915DPTR ACTIVE SOIC D 16 2500 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-2-260C-1 YEAR 0 to 70 UCC3915DP
UCC3915DPTRG4 ACTIVE SOIC D 16 2500 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-2-260C-1 YEAR 0 to 70 UCC3915DP
UCC3915N OBSOLETE PDIP N 16 TBD Call TI Call TI 0 to 70 UCC3915N
UCC3915NG4 OBSOLETE PDIP N 16 TBD Call TI Call TI 0 to 70
UCC3915PWP ACTIVE TSSOP PW 24 60 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-2-260C-1 YEAR 0 to 70 UCC3915PWP
UCC3915PWPG4 ACTIVE TSSOP PW 24 60 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-2-260C-1 YEAR 0 to 70 UCC3915PWP
UCC3915PWPTR ACTIVE TSSOP PW 24 2000 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-2-260C-1 YEAR 0 to 70 UCC3915PWP
UCC3915PWPTRG4 ACTIVE TSSOP PW 24 2000 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-2-260C-1 YEAR 0 to 70 UCC3915PWP
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
PACKAGE OPTION ADDENDUM
www.ti.com
21-Mar-2013
Addendum-Page 2
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
Only one of markings shown within the brackets will appear on the physical device.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
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