Name: TPS51200DRCT
SKU: TPS51200DRCT
Price: 5.29345 USD
Availability: OutOfStock

FEATURES APPLICATIONS

DESCRIPTION

STANDARD DDR APPLICATION

TPS51200

REFIN

VLDOIN

PGND

VOSNS

VIN

PGOOD

GND

REFOUT

3.3 V

PGOOD

SLP_S3

0.1 mF

VTTREF

VLDOIN

VTT

VDDQ

UDG-08025

TPS51200

SLUS812 – FEBRUARY 2008

www.ti.com

SINK/SOURCE DDR TERMINATION REGULATOR

• Memory Termination Regulator for DDR,

• Input Voltage: Supports 2.5-V Rail and 3.3-V

DDR2, DDR3, and Low Power DDR3/DDR4

Rail

• Notebook/Desktop/Server

• VLDOIN Voltage Range: 1.1 V to 3.5 V

• Telecom/Datacom, GSM Base Station,

• Sink/Source Termination Regulator Includes

LCD-TV/PDP-TV, Copier/Printer, Set-Top Box

Droop Compensation

• Requires Minimum Output Capacitance of

20- µ F (typically 3 × 10- µ F MLCCs) for Memory

The TPS51200 is a sink/source Double Data Rate

Termination Applications (DDR)

(DDR) termination regulator specifically designed for

• PGOOD to Monitor Output Regulation

low input voltage, low-cost, low-noise systems where

• EN Input

space is a key consideration.

• REFIN Input Allows for Flexible Input Tracking

The TPS51200 maintains a fast transient response

Either Directly or Through Resistor Divider

and only requires a minimum output capacitance of

• Remote Sensing (VOSNS) 20 µ F. The TPS51200 supports a remote sensing

function and all power requirements for DDR, DDR2,

• ± 10-mA Buffered Reference (REFOUT)

DDR3, and Low Power DDR3/DDR4 VTT bus

• Built-in Soft Start, UVLO and OCL

termination.

• Thermal Shutdown

In addition, the TPS51200 provides an open-drain

• Meets DDR, DDR2 JEDEC Specifications;

PGOOD signal to monitor the output regulation and

Supports DDR3 and Low-Power DDR3/DDR4

an EN signal that can be used to discharge VTT

VTT Applications

during S3 (suspend to RAM) for DDR applications.

• SON-10 PowerPAD™Package

The TPS51200 is available in the thermally-efficient

SON-10 PowerPAD package, and is rated both

Green and Pb-free. It is specified from -40 ° C to

+85 ° C.

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of

Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

2 PowerPAD is a trademark of Texas Instruments.

PRODUCTION DATA information is current as of publication date.

Products conform to specifications per the terms of the Texas

Instruments standard warranty. Production processing does not

necessarily include testing of all parameters.

www.ti.com

ABSOLUTE MAXIMUM RATINGS

(1)

DISSIPATION RATINGS TABLE

(1)

RECOMMENDED OPERATING CONDITIONS

TPS51200

SLUS812 – FEBRUARY 2008

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam

during storage or handling to prevent electrostatic damage to the MOS gates.

ORDERING INFORMATION

PACKAGE DEVICE NUMBER PINS MEDIUM MINIMUM

QUANTITY

TPS51200DRCT 250

– 40 ° C to 85 ° C DRC Plastic Small Outline 10 Tape and Reel

TPS51200DRCR 3000

Over operating free-air temperature range, unless otherwise noted.

VALUE UNIT

VIN, VLDOIN, VOSNS, REFIN – 0.3 to 3.6

Input voltage range

(2)

EN – 0.3 to 6.5 V

PGND to GND – 0.3 to 0.3

VO, REFOUT – 0.3 to 3.6

Output voltage range

(2)

PGOOD – 0.3 to 6.5

stg

Storage temperature – 55 to 150 ° C

(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings

only and functional operation of the device at these or any other conditions beyond those indicated under recommended operating

conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2) All voltage values are with respect to the network ground terminal unless otherwise noted.

DERATING FACTOR T

= 85 ° C

= 25 ° C

PACKAGE POWER RATING ABOVE T

= 25 ° C POWER RATING

10-Pin SON 1.92 W 19 mW/ ° C 0.79 W

(1) PowerPAD size: 3.0 × 1.9 mm, 4 standard thermal vias. Based on the above environment, junction to thermal pad resistance θ

10.24 ° C/W. Junction to ambient thermal resistance θ

is 52.06 ° C/W.

PARAMETER MIN TYP MAX UNIT

Supply voltages VIN 2.375 3.500

EN, VLDOIN, VOSNS – 0.1 3.5

REFIN 0.5 1.8

Voltage range VO, PGOOD – 0.1 3.5

REFOUT – 0.1 1.8

PGND – 0.1 0.1

Operating free-air temperature, T

– 40 85 ° C

Product Folder Link(s): TPS51200

www.ti.com

ELECTRICAL CHARACTERISTICS

TPS51200

SLUS812 – FEBRUARY 2008

Over recommended free-air temperature range, V

VIN

= 3.3 V,V

VLDOIN

= 1.8 V, V

REFIN

= 0.9 V, V

VOSNS

= 0.9 V, V

= V

VIN

, C

OUT

= 3 × 10 µ F and circuit shown in Section 1 . (unless otherwise noted)

PARAMETER TEST CONDITIONS MIN TYP MAX UNIT

SUPPLY CURRENT

Supply current T

= 25 ° C, V

= 3.3 V, No Load 0.7 1 mA

= 25 ° C, V

= 0 V, V

REFIN

= 0, No Load 65 80

IN(SDN)

Shutdown current µ A

= 25 ° C, V

= 0 V, V

REFIN

> 0.4 V, No Load 200 400

LDOIN

Supply current ofVLDOIN T

= 25 ° C, V

= 3.3 V, No Load 1 50 µ A

LDOIN(SDN)

Shutdown current of VLDOIN T

= 25 ° C, V

= 0 V, No Load 0.1 50 µ A

INPUT CURRENT

REFIN

Input current, REFIN V

= 3.3 V 1 µ A

VO OUTPUT

1.25 V

REFOUT

= 1.25 V (DDR1), I

= 0 A

– 15 15 mV

0.9 V

VOSNS

Output DC voltage, VO V

REFOUT

= 0.9 V (DDR2), I

= 0 A

– 15 15 mV

0.75 V

LDOIN

= 1.5 V, V

REFOUT

= 0.75 V (DDR3), I

= 0 A

– 15 15 mV

Output voltage tolerance to

VOTOL

– 2A < I

< 2A – 25 25 mV

REFOUT

VOSRCL

VO source vurrent Limit With reference to REFOUT, V

OSNS

= 90% × V

REFOUT

3 4.5 A

VOSNCL

VO sink current Limit With reference to REFOUT, V

OSNS

= 110% × V

REFOUT

3.5 5.5 A

DSCHRG

Discharge current, VO V

REFIN

= 0 V, V

= 0.3 V, V

= 0 V, T

= 25 ° C 18 25 Ω

POWERGOOD COMPARATOR

PGOOD window lower threshold with respect to REFOUT – 23.5% – 20% – 17.5%

TH(PG)

VO PGOOD threshold PGOOD window upper threshold with respect to REFOUT 17.5% 20% 23.5%

PGOOD hysteresis 5%

PGSTUPDLY

PGOOD startup delay Startup rising edge, VOSNS within 15% of REFOUT 2 ms

PGOODLOW

Output low voltage I

SINK

= 4 mA 0.4 V

PBADDLY

PGOOD bad delay VOSNS is outside of the ± 20% PGOOD window 10 µ s

OSNS

= V

REFIN

(PGOOD high impedance),

PGOODLK

Leakage current

(1)

1 µ A

PGOOD = V

+ 0.2 V

REFIN AND REFOUT

REFIN

REFIN voltage range 0.5 1.8 V

REFINUVLO

REFIN undervoltage lockout REFIN rising 360 390 420 mV

REFIN undervoltage lockout

REFINUVHYS

20 mV

hysteresis

REFOUT

REFOUT voltage REFIN V

– 10 mA < I

REFOUT

< 10 mA, V

REFIN

= 1.25 V – 15 15

– 10 mA < I

REFOUT

< 10 mA, V

VREFIN

= 0.9 V – 15 15 mV

REFOUT voltage tolerance to

REFOUTTOL

REFIN

– 10 mA < I

REFOUT

< 10 mA, V

REFIN

= 0.75V – 15 15

– 10 mA < I

REFOUT

< 10 mA, V

REFIN

= 0.6 V – 15 15

REFOUTSRCL

REFOUT source current limit V

REFOUT

= 0 V 10 40 mA

REFOUTSNCL

REFOUT sink current limit V

REFOUT

= 0 V 10 40 mA

(1) Ensured by design. Not production tested.

Product Folder Link(s): TPS51200

Part #	TPS51200DRCT
Description	IC, DC/DC CONTROLLER3.5V 10-Pin VSON
Category	IC
Availability	Out of Stock
Qty	0

TPS51200DRCT

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