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TMS320VC5509APGE

Part # TMS320VC5509APGE
Description FIXED POINT DIGITAL SIGNAL PROCESSOR -DSP, 32 BIT, 200MHZ
Category IC
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Technical Document


DISCLAIMER: The information provided herein is solely for informational purposes. Customers must be aware of the suitability of this product for their application, and consider that variable factors such as Manufacturer, Product Category, Date Codes, Pictures and Descriptions may differ from available inventory.

Electrical Specifications
106
November 2002 − Revised January 2005SPRS205D
5.8.3 Warm Reset
Table 5−14 and Table 5−15 assume testing over recommended operating conditions (see Figure 5−17).
Table 5−14. Reset Timing Requirements
NO.
CV
DD
= 1.2 V
CV
DD
= 1.35 V
CV
DD
= 1.6 V
UNIT
NO.
MIN MAX MIN MAX
UNIT
R4 t
w(RSL)
Pulse width, reset low 3P
3P
ns
P = 1/CPU clock frequency in ns. For example, when running parts at 200 MHz, use P = 5 ns.
Table 5−15. Reset Switching Characteristics
NO.
PARAMETER
CV
DD
= 1.2 V
CV
DD
= 1.35 V
CV
DD
= 1.6 V
UNIT
NO.
PARAMETER
MIN MAX MIN MAX
UNIT
R5 t
d(RSTH-BKV)
Delay time, reset high to BK group valid
38P + 15 38P + 15 ns
R6 t
d(RSTH-HIGHV)
Delay time, reset high to High group valid
§
38P + 15 38P + 15 ns
R7 t
d(RSTL-ZIV)
Delay time, reset low to Z group invalid
1P + 15 1P + 15 ns
R8 t
d(RSTH-ZV)
Delay time, reset high to Z group valid
38P + 15 38P + 15 ns
P = 1/CPU clock frequency in ns. For example, when CPU is running at 200 MHz, P = 5 ns.
BK group: Pins with bus keepers, holds previous state during reset. Following low-to-high transition of RESET, these pins go to their post-reset
logic state.
BK group pins: A’[0], A[15:0], D[15:0], C[14:2], C0, GPIO5, S13, and S23
§
High group: Following low-to-high transition of RESET, these pins go to logic-high state.
High group pins: C1[HPI.HINT], XF
Z group: Bidirectional pins which become input or output pins. Following low-to-high transition of RESET, these pins go to high-impedance state.
Z group pins: C1[EMIF.AOE], GPIO[7:6, 4:0], TIN/TOUT0, SDA, SCL, CLKR0, FSRX0, CLKX0, DX0, FSX0, S[25:24, 22:20, 15:14, 12:10],
A[20:16]
RESET
BK Group
H
igh Group
Z Group
§
R5
R7
R6
R8
BK group pins: A’[0], A[15:0], D[15:0], C[14:2], C0, GPIO5, S13, and S23
High group pins: C1[HPI.HINT], XF
§
Z group pins: C1[EMIF.AOE], GPIO[7:6, 4:0], TIN/TOUT0, SDA, SCL, CLKR0, FSRX0, CLKX0, DX0, FSX0, S[25:24, 22:20, 15:14, 12:10]
,
A[20:16]
Figure 5−17. Reset Timings
Electrical Specifications
107
November 2002 − Revised January 2005 SPRS205D
5.9 External Interrupt Timings
Table 5−16 assumes testing over recommended operating conditions (see Figure 5−18).
Table 5−16. External Interrupt Timing Requirements
NO.
CV
DD
= 1.2 V
CV
DD
= 1.35 V
CV
DD
= 1.6 V
UNIT
NO.
MIN MAX MIN MAX
UNIT
I1 t
w(INTL)A
Pulse width, interrupt low, CPU active 3P 3P ns
I2 t
w(INTH)A
Pulse width, interrupt high, CPU active 2P 2P ns
P = 1/CPU clock frequency in ns. For example, when running parts at 200 MHz, use P = 5 ns.
I1
I2
INTn
Figure 5−18. External Interrupt Timings
5.10 Wake-Up From IDLE
Table 5−17 assumes testing over recommended operating conditions (see Figure 5−19).
Table 5−17. Wake-Up From IDLE Switching Characteristics
NO.
PARAMETER
CV
DD
= 1.2 V
CV
DD
= 1.35 V
CV
DD
= 1.6 V
UNIT
NO.
PARAMETER
MIN TYP MAX MIN TYP MAX
UNIT
ID1 t
d(WKPEVTL-CLKGEN)
Delay time, wake-up event low to clock
generation enable
(CPU and clock domain idle)
1.25
1.25
ms
ID2 t
h(CLKGEN-WKPEVTL)
Hold time, clock generation enable to
wake-up event low
(CPU and clock domain in idle)
3P
§
3P
§
ns
ID3 t
w(WKPEVTL)
Pulse width, wake-up event low
(for CPU idle only)
3P 3P ns
P = 1/CPU clock frequency in ns. For example, when running parts at 200 MHz, use P = 5 ns.
Estimated data based on 12-MHz crystal used with on-chip oscillator at 25°C. This number will vary based on the actual crystal characteristics
operating condition and the PC board layout and the parasitics.
§
Following the clock generation domain idle, the INTx becomes level-sensitive and stays that way until the low-to-high transition of INTx following
the CPU wake-up. Holding the INTx low longer than minimum requirement will send more than one interrupt to the CPU. The number of interrupts
sent to the CPU depends on the INTx-low time following the CPU wake-up from IDLE.
ID1
ID2
ID3
X1
RESET,
INTx
Figure 5−19. Wake-Up From IDLE Timings
Electrical Specifications
108
November 2002 − Revised January 2005SPRS205D
5.11 XF Timings
Table 5−18 assumes testing over recommended operating conditions (see Figure 5−20).
Table 5−18. XF Switching Characteristics
NO.
PARAMETER
CV
DD
= 1.2 V
CV
DD
= 1.35 V
CV
DD
= 1.6 V
UNIT
NO.
PARAMETER
MIN MAX MIN MAX
UNIT
X1
t
d(XF)
Delay time, CLKOUT high to XF high −1 3 −1 3
ns
X1
t
d(XF)
Delay time, CLKOUT high to XF low −1 3 −1 3
ns
X1
CLKOUT
XF
CLKOUT reflects the CPU clock.
Figure 5−20. XF Timings
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