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TMS320VC5509APGE

Part # TMS320VC5509APGE
Description FIXED POINT DIGITAL SIGNAL PROCESSOR -DSP, 32 BIT, 200MHZ
Category IC
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Technical Document


DISCLAIMER: The information provided herein is solely for informational purposes. Customers must be aware of the suitability of this product for their application, and consider that variable factors such as Manufacturer, Product Category, Date Codes, Pictures and Descriptions may differ from available inventory.

Electrical Specifications
85
November 2002 − Revised January 2005 SPRS205D
5.3.2 Electrical Characteristics Over Recommended Operating Case Temperature
Range for CV
DD
= 1.35 V (144 MHz) (Unless Otherwise Noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
DN and DP
USBV
DD
= 3.0 V−3.6 V,
I
OH
= −300 µA
2.8 USBV
DD
V
OH
High-level output voltage
PU
USBV
DD
= 3.0 V−3.6 V,
I
OH
= −300 µA
0.9 * USBV
DD
USBV
DD
V
All other outputs
DV
DD
= 2.7 V−3.6 V,
I
OH
= MAX
0.75 * DV
DD
SDA & SCL
At 3 mA sink current 0 0.4
V
OL
Low-level output voltage
DN and DP
I
OL
= 3.0 mA 0.3
V
V
OL
Low-level output voltage
All other outputs I
OL
= MAX 0.4
V
I
IZ
Input current for outputs in
high-impedance
Output-only or
I/O pins with bus
keepers (enabled)
DV
DD
= MAX,
V
O
= V
SS
to DV
DD
−300 300
µA
I
IZ
Input current for outputs in
high-impedance
All other output-only
or I/O pins
DV
DD
= MAX
V
O
= V
SS
to DV
DD
−5 5
µ
A
Input pins with
internal pulldown
(enabled)
DV
DD
= MAX,
V
I
= V
SS
to DV
DD
30 300
I
I
Input current
Input pins with
internal pullup
(enabled)
DV
DD
= MAX,
V
I
= V
SS
to DV
DD
−300 −30
µA
I
I
Input current
X2/CLKIN
DV
DD
= MAX,
V
I
= V
SS
to DV
DD
−50 50
µA
All other input-only
pins
DV
DD
= MAX,
V
I
= V
SS
to DV
DD
−5 5
I
DDC
CV
DD
Supply current, CPU + internal memory access
§
CV
DD
= 1.35 V
CPU clock = 144 MHz
T
C
= 25_C
0.51
mA/
MHz
I
DDP
DV
DD
supply current, pins active
DV
DD
= 3.3 V
CPU clock = 144 MHz
T
C
= 25_C
5.5 mA
I
DDC
CV
DD
supply current, standby
#
Oscillator disabled.
All domains in
low-power state
CV
DD
= 1.35 V
T
C
= 25_C
125 µA
I
DDP
DV
DD
supply current, standby
Oscillator disabled.
All domains in
low-power state.
DV
DD
= 3.3 V
No I/O activity
T
C
= 25_C
10 µA
C
i
Input capacitance 3 pF
C
o
Output capacitance 3 pF
USB I/O pins DP and DN can tolerate a short circuit at D+ and D− to 0 V or 5 V, as long as the recommended series resistors (see Figure 5−42)
are connected between the D+ and DP (package), and the D− and DN (package). Do not apply a short circuit to the USB I/O pins DP and
DN in absence of the series resistors.
The I
2
C pins SDA and SCL do not feature fail-safe I/O buffers. These pins could potentially draw current when the device is powered down.
§
CPU executing 75% Dual MAC + 25% ADD with moderate data bus activity (table of sine values). CPU and CLKGEN (DPLL) domain are active.
All other domains are idled. See the TMS320VC5509A Power Consumption Summary Application Report (literature number SPRAA04).
One word of a table of a 16-bit sine value is written to the EMIF every 250 ns (64 Mbps). Each EMIF output pin is connected to a 10-pF load.
#
In CLKGEN domain idle mode, X2/CLKIN becomes output and is driven low to stop external crystals (if used) from oscillating. Standby current
will be higher if an external clock source tries to drive the X2/CLKIN pin during this time.
Electrical Specifications
86
November 2002 − Revised January 2005SPRS205D
5.3.3 Electrical Characteristics Over Recommended Operating Case Temperature
Range for CV
DD
= 1.6 V (200 MHz) (Unless Otherwise Noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
DN and DP
USBV
DD
= 3.0 V−3.6 V,
I
OH
= −300 µA
2.8 USBV
DD
V
OH
High-level output voltage
PU
USBV
DD
= 3.0 V−3.6 V,
I
OH
= −300 µA
0.9 * USBV
DD
USBV
DD
V
All other outputs
DV
DD
= 2.7 V−3.6 V,
I
OH
= MAX
0.75 * DV
DD
SDA & SCL
At 3 mA sink current 0 0.4
V
OL
Low-level output voltage
DN and DP
I
OL
= 3.0 mA 0.3
V
V
OL
Low-level output voltage
All other outputs I
OL
= MAX 0.4
V
I
IZ
Input current for outputs in
high-impedance
Output-only or
I/O pins with bus
keepers (enabled)
DV
DD
= MAX,
V
O
= V
SS
to DV
DD
−300 300
µA
I
IZ
Input current for outputs in
high-impedance
All other output-only
or I/O pins
DV
DD
= MAX
V
O
= V
SS
to DV
DD
−5 5
µ
A
Input pins with
internal pulldown
(enabled)
DV
DD
= MAX,
V
I
= V
SS
to DV
DD
30 300
I
I
Input current
Input pins with
internal pullup
(enabled)
DV
DD
= MAX,
V
I
= V
SS
to DV
DD
−300 −30
µA
I
I
Input current
X2/CLKIN
DV
DD
= MAX,
V
I
= V
SS
to DV
DD
−50 50
µA
All other input-only
pins
DV
DD
= MAX,
V
I
= V
SS
to DV
DD
−5 5
I
DDC
CV
DD
Supply current, CPU + internal memory access
§
CV
DD
= 1.6 V
CPU clock = 200 MHz
T
C
= 25_C
0.60
mA/
MHz
I
DDP
DV
DD
supply current, pins active
DV
DD
= 3.3 V
CPU clock = 200 MHz
T
C
= 25_C
5.5 mA
I
DDC
CV
DD
supply current, standby
#
Oscillator disabled.
All domains in
low-power state
CV
DD
= 1.6 V
T
C
= 25_C
150 µA
I
DDP
DV
DD
supply current, standby
Oscillator disabled.
All domains in
low-power state.
DV
DD
= 3.3 V
No I/O activity
T
C
= 25_C
10 µA
C
i
Input capacitance 3 pF
C
o
Output capacitance 3 pF
USB I/O pins DP and DN can tolerate a short circuit at D+ and D− to 0 V or 5 V, as long as the recommended series resistors (see Figure 5−42)
are connected between the D+ and DP (package), and the D− and DN (package). Do not apply a short circuit to the USB I/O pins DP and
DN in absence of the series resistors.
The I
2
C pins SDA and SCL do not feature fail-safe I/O buffers. These pins could potentially draw current when the device is powered down.
§
CPU executing 75% Dual MAC + 25% ADD with moderate data bus activity (table of sine values). CPU and CLKGEN (DPLL) domain are active.
All other domains are idled. See the TMS320VC5509A Power Consumption Summary Application Report (literature number SPRAA04).
One word of a table of a 16-bit sine value is written to the EMIF every 250 ns (64 Mbps). Each EMIF output pin is connected to a 10-pF load.
#
In CLKGEN domain idle mode, X2/CLKIN becomes output and is driven low to stop external crystals (if used) from oscillating. Standby current
will be higher if an external clock source tries to drive the X2/CLKIN pin during this time.
Electrical Specifications
87
November 2002 − Revised January 2005 SPRS205D
Transmission Line
4.0 pF 1.85 pF
Z0 = 50
(see note)
Tester Pin Electronics
Data Manual Timing Reference Point
Output
Under
Test
NOTE: The data manual provides timing at the device pin. For output timing analysis, the tester pin electronics and its transmission line effects
must be taken into account. A transmission line with a delay of 2 ns or longer can be used to produce the desired transmission line effect.
The transmission line is intended as a load only. It is not necessary to add or subtract the transmission line delay (2 ns or longer) from
the data manual timings.
42 3.5 nH
Device Pin
(see note)
Input requirements in this data manual are tested with an input slew rate of < 4 Volts per nanosecond (4 V/ns) at the device
pin.
Figure 5−1. 3.3-V Test Load Circuit
5.4 ESD Performance
ESD stress levels were performed in compliance with the following JEDEC standards with the results indicated
below:
Charged Device Model (CDM), based on JEDEC Specification JESD22-C101, passed at ±500 V
Human Body Model (HBM), based on JEDEC Specification JESD22-A114, passed at ±1500 V
NOTE:
According to industry research publications, ESD-CDM testing results show better correlation
to manufacturing line and field failure rates than ESD-HBM testing. 500-V CDM is commonly
considered as a safe passing level.
5.5 Timing Parameter Symbology
Timing parameter symbols used in the timing requirements and switching characteristics tables are created
in accordance with JEDEC Standard 100. To shorten the symbols, some of the pin names and other related
terminology have been abbreviated as follows:
Lowercase subscripts and their meanings: Letters and symbols and their meanings:
a access time H High
c cycle time (period) L Low
d delay time V Valid
dis disable time Z High-impedance
en enable time
f fall time
h hold time
r rise time
su setup time
t transition time
v valid time
w pulse duration (width)
X Unknown, changing, or don’t care level
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