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TMS320VC5502PGF300

Part # TMS320VC5502PGF300
Description IC, 300MH 176PIN TQFP
Category IC
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Texas Instruments
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Technical Document


DISCLAIMER: The information provided herein is solely for informational purposes. Customers must be aware of the suitability of this product for their application, and consider that variable factors such as Manufacturer, Product Category, Date Codes, Pictures and Descriptions may differ from available inventory.

TMS320VC5502
Fixed-Point Digital Signal Processor
Data Manual
Literature Number: SPRS166H
April 2001 Revised November 2004
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
www.ti.com
Revision History
TMS320VC5502
Fixed-Point Digital Signal Processor
SPRS166H APRIL 2001 REVISED NOVEMBER 2004
This data sheet revision history highlights the technical changes made to the SPRS166G device-specific
data sheet to make it an SPRS166H revision.
Scope: Deleted Section 7.1 (Ball Grid Array Mechanical Data) and Section 7.2 (Low-Profile Quad
Flatpack Mechanical Data). Mechanical drawings of the 201-terminal GZZ, 201-terminal ZZZ, and 176-pin
PGF packages will be appended to this document via an automated process.
Added 201-terminal ZZZ package information/data, added Section 4.1 [Notices Concerning JTAG (IEEE
1149.1) Boundary Scan Test Capability], added Section 6.2 (Packaging Information), etc.
ADDITIONS/CHANGES/DELETIONS
Global:
added 201-terminal ZZZ package information/data
updated title of SPRU146 to " TMS320VC5501/5502/5503/5507/5509 DSP Inter-Integrated Circuit (I2C) Module Reference
Guide"
updated title of SPRU592 to " TMS320VC5501/5502/5503/5507/5509/5510 DSP Multichannel Buffered Serial Port (McBSP)
Reference Guide"
moved "Package Thermal Resistance Characteristics" section to Chapter 6 , Mechanical Data
Section 1.1 , Features:
added 201-terminal ZZZ package to "Packages" feature
Section 2.2.1 :
changed title from "Ball Grid Array (GZZ)" to "Ball Grid Array (GZZ and ZZZ)"
updated "The TMS320VC5502 is offered in ..." paragraph
Figure 2-1 :
changed title from "201-Terminal GZZ Ball Grid Array (Bottom View)" to "201-Terminal GZZ and ZZZ Ball Grid Array (Bottom
View)"
Table 2-1 :
changed title from "201-Terminal GZZ Ball Grid Array Thermal Ball Locations" to "201-Terminal GZZ and ZZZ Ball Grid Array
Thermal Ball Locations"
Table 2-2 :
changed title from "201-Terminal GZZ Ball Grid Array Ball Assignments" to "201-Terminal GZZ and ZZZ Ball Grid Array Ball
Assignments"
Table 2-4 , Signal Descriptions:
updated FUNCTION of HCS, HDS1, HDS2, and HPIENA
Figure 3-2 , TMS320VC5502 Memory Map:
added "Byte Address" above addresses
added footnote about CE space size
Updated Section 3.8 , Host-Port Interface (HPI)
Section 3.10.6 , Reset Sequence:
updated "After all internal delay cycles have expired, ..." bulleted item
Table 3-57 , Peripheral Bus Controller Configuration Registers:
added Time-Out Control Register (TOCR) at 0x9000
Chapter 4 , Support:
added Section 4.1 , Notices Concerning JTAG (IEEE 1149.1) Boundary Scan Test Capability
added Section 4.1.1 , Initialization Requirements for Boundary Scan Test
added Section 4.1.2 , Boundary Scan Description Language (BSDL) Model
Section 4.2 , Documentation Support:
updated title of SPRU146 to " TMS320VC5501/5502/5503/5507/5509 DSP Inter-Integrated Circuit (I2C) Module Reference
Guide"
updated title of SPRU592 to " TMS320VC5501/5502/5503/5507/5509/5510 DSP Multichannel Buffered Serial Port (McBSP)
Reference Guide"
2 Revision History
www.ti.com
TMS320VC5502
Fixed-Point Digital Signal Processor
SPRS166H APRIL 2001 REVISED NOVEMBER 2004
ADDITIONS/CHANGES/DELETIONS (continued)
Table 5-43 , HPI Read and Write Timing Requirements:
H13 [t
w(DSL)
]: deleted "K = 1", "K = 2", and "K = 4" column
H14 [t
w(DSH)
]:
deleted "K = 1", "K = 2", and "K = 4" column
changed MIN value from 3P, P, and 1.75P to 2P (ns)
deleted "K = divider ratio ..." footnote
added "A host must not initiate transfer requests ..." footnote
Table 5-44 , HPI Read and Write Switching Characteristics:
added "A host must not initiate transfer requests ..." footnote
Chapter 6 , Mechanical Data:
deleted 201-terminal GZZ package drawing and 176-pin PGF package drawing
Mechanical drawings of the 201-terminal GZZ, 201-terminal ZZZ, and 176-pin PGF packages will be appended to this
document via an automated process.
Table 6-1 , Thermal Resistance Characteristics (Ambient):
changed "GZZ" to "GZZ , ZZZ"
updated "Adding thermal vias will significantly improve ..." footnote to include ZZZ package
Table 6-2 , Thermal Resistance Characteristics (Case):
changed "GZZ" to "GZZ , ZZZ"
Added Section 6.2 , Packaging Information
Revision History 3
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