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TLV2462AID

Part # TLV2462AID
Description DUAL OPAMP LOW POWER RAIL TORAIL I/O - Rail/Tube
Category IC
Availability In Stock
Qty 6
Qty Price
1 + $1.39153
Manufacturer Available Qty
Texas Instruments
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Technical Document


DISCLAIMER: The information provided herein is solely for informational purposes. Customers must be aware of the suitability of this product for their application, and consider that variable factors such as Manufacturer, Product Category, Date Codes, Pictures and Descriptions may differ from available inventory.

      
    
   
SLOS220J − JULY 1998 − REVISED FEBRUARY 2004
1
WWW.TI.COM
D Rail-to-Rail Output Swing
D Gain Bandwidth Product . . . 6.4 MHz
D ±80 mA Output Drive Capability
D Supply Current . . . 500 µA/channel
D Input Offset Voltage . . . 100 µV
D Input Noise Voltage ...11 nV/Hz
D Slew Rate . . . 1.6 V/µs
D Micropower Shutdown Mode
(TLV2460/3/5) . . . 0.3 µA/Channel
D Universal Operational Amplifier EVM
D Available in Q-Temp Automotive
HighRel Automotive Applications
Configuration Control/Print Support
Qualification to Automotive Standards
description
The TLV246x is a family of low-power rail-to-rail input/output operational amplifiers specifically designed for
portable applications. The input common-mode voltage range extends beyond the supply rails for maximum
dynamic range in low-voltage systems. The amplifier output has rail-to-rail performance with high-output-drive
capability, solving one of the limitations of older rail-to-rail input/output operational amplifiers. This rail-to-rail
dynamic range and high output drive make the TLV246x ideal for buffering analog-to-digital converters.
The operational amplifier has 6.4 MHz of bandwidth and 1.6 V/µs of slew rate with only 500 µA of supply current,
providing good ac performance with low power consumption. Three members of the family offer a shutdown
terminal, which places the amplifier in an ultralow supply current mode (I
DD
= 0.3 µA/ch). While in shutdown,
the operational-amplifier output is placed in a high-impedance state. DC applications are also well served with
an input noise voltage of 11 nV/Hz and input offset voltage of 100 µV.
This family is available in the low-profile SOT23, MSOP, and TSSOP packages. The TLV2460 is the first
rail-to-rail input/output operational amplifier with shutdown available in the 6-pin SOT23, making it perfect for
high-density circuits. The family is specified over an expanded temperature range (T
A
= −40°C to 125°C) for
use in industrial control and automotive systems, and over the military temperature range
(T
A
= −55°C to 125°C) for use in military systems.
SELECTION GUIDE
DEVICE
V
DD
[V]
V
IO
[µV]
I
DD
/ch
[µA]
I
IB
[pA]
GBW
[MHz]
SLEW RATE
[V/µs]
V
n,
1
kHz
[nV/Hz
]
I
O
[mA]
SHUTDOWN RAIL-RAIL
TLV246x(A) 2.7−6 150 550 1300 6.4 1.6 11 25 Y I/O
TLV277x(A) 2.5−5.5 360 1000 2 5.1 10.5 17 6 Y O
TLV247x(A) 2.7−6 250 600 2.5 2.8 1.5 15 20 Y I/O
TLV245x(A) 2.7−6 20 23 500 0.22 0.11 52 10 Y I/O
TLV225x(A) 2.7−8 200 35 1 0.2 0.12 19 3
TLV226x(A) 2.7−8 300 200 1 0.71 0.55 12 3
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications o
f
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
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'+('!4 #" &.. ,&$&%+'+$(0
Copyright 1998−2004, Texas Instruments Incorporated
3
2
4
6
(TOP VIEW)
1
OUT
GND
IN+
V
DD+
IN
TLV2460
DBV PACKAGE
5
SHDN
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    
   
SLOS220J − JULY 1998 − REVISED FEBRUARY 2004
2
WWW.TI.COM
TLV2460C/I/AI and TLV2461C/I/AI AVAILABLE OPTIONS
V
IO
max
PACKAGED DEVICES
T
A
V
IO
max
AT 25°C
SMALL OUTLINE
(D)
SOT-23
(DBV)
SYMBOL
PLASTIC DIP
(P)
0°C to 70°C 2000 µV
TLV2460CD
TLV2461CD
TLV2460CDBV
TLV2461CDBV
VAOC
VAPC
TLV2460CP
TLV2461CP
−40°C to 125°C
2000 µV
TLV2460ID
TLV2461ID
TLV2460IDBV
TLV2461IDBV
VAOI
VAPI
TLV2460IP
TLV2461IP
−40
°
C to 125
°
C
1500 µV
TLV2460AID
TLV2461AID
TLV2460AIP
TLV2461AIP
This package is available taped and reeled. To order this packaging option, add an R suffix to the part number (e.g., TLV2460CDR).
Chip forms are tested at T
A
= 25°C only.
TLV2460M/AM/Q/AQ and TLV2461M/AM/Q/AQ AVAILABLE OPTIONS
PACKAGED DEVICES
T
A
V
IO
max
AT 25°C
SMALL
OUTLINE
(D)
SMALL
OUTLINE
(PW)
CERAMIC DIP
(JG)
CERAMIC
FLATPACK
(U)
CHIP CARRIER
(FK)
−40°C to 125°C
2000 µV
TLV2460QD
TLV2461QD
TLV2460QPW
TLV2461QPW
−40
°
C to 125
°
C
1500 µV
TLV2460AQD
TLV2461AQD
TLV2460AQPW
TLV2461AQPW
−55°C to 125°C
2000 µV
TLV2460MJG
TLV2461MJG
TLV2460MU
TLV2461MU
TLV2460MFK
TLV2461MFK
−55°C to 125°C
1500 µV
TLV2460AMJG
TLV2461AMJG
TLV2460AMU
TLV2461AMU
TLV2460AMFK
TLV2461AMFK
This package is available taped and reeled. To order this packaging option, add an R suffix to the part number (e.g., TLV2460QDR).
TLV2462C/I/AI and TLV2463C/I/AI AVAILABLE OPTIONS
PACKAGED DEVICES
T
A
V
IO
max
AT 25°C
SMALL
OUTLINE
(D)
MSOP
(DGK)
SYMBOL
MSOP
(DGS)
SYMBOL
PLASTIC DIP
(N)
PLASTIC DIP
(P)
0°C to 70°C 2000 µV
TLV2462CD
TLV2463CD
TLV2462CDGK
xxTIAAI
TLV2463CDGS
xxTIAAK
TLV2463CN
TLV2462CP
−40°C to
2000 µV
TLV2462ID
TLV2463ID
TLV2462IDGK
xxTIAAJ
TLV2463IDGS
xxTIAAL
TLV2463IN
TLV2462IP
−40 C to
125°C
1500 µV
TLV2462AID
TLV2463AID
TLV2463AIN
TLV2462AIP
This package is available taped and reeled. To order this packaging option, add an R suffix to the part number (e.g., TLV2462CDR).
Chip forms are tested at T
A
= 25°C only.
      
    
   
SLOS220J − JULY 1998 − REVISED FEBRUARY 2004
3
WWW.TI.COM
TLV2462M/AM/Q/AQ and TLV2463M/AM/Q/AQ AVAILABLE OPTIONS
PACKAGED DEVICES
T
A
V
IO
max
AT 25°C
SMALL
OUTLINE
(D)
SMALL
OUTLINE
(PW)
CERAMIC DIP
(JG)
CERAMIC
DIP
(J)
CERAMIC
FLATPACK
(U)
CHIP CAR-
RIER
(FK)
−40°C to 125°C
2000 µV
TLV2462QD
TLV2463QD
TLV2462QPW
TLV2463QPW
−40
°
C to 125
°
C
1500 µV
TLV2462AQD
TLV2463AQD
TLV2462AQPW
TLV2463AQPW
−55°C to 125°C
2000 µV
TLV2462MJG
TLV2463MJ
TLV2462MU TLV2462MFK
TLV2463MFK
−55°C to 125°C
1500 µV
TLV2462AMJG
TLV2463AMJ
TLV2462AMU TLV2462AMFK
TLV2463AMFK
This package is available taped and reeled. To order this packaging option, add an R suffix to the part number (e.g., TLV2462QDR).
TLV2464C/I/AI and TLV2465C/I/AI AVAILABLE OPTIONS
V
IO
max
PACKAGED DEVICES
T
A
V
IO
max
AT 25°C
SMALL OUTLINE
(D)
PLASTIC DIP
(N)
TSSOP
(PW)
0°C to 70°C 2000 µV
TLV2464CD
TLV2465CD
TLV2464CN
TLV2465CN
TLV2464CPW
TLV2465CPW
2000 µV
TLV2464ID
TLV2465ID
TLV2464IN
TLV2465IN
TLV2464IPW
TLV2465IPW
°
°
1500 µV
TLV2464AID
TLV2465AID
TLV2464AIN
TLV2465AIN
TLV2464AIPW
TLV2465AIPW
This package is available taped and reeled. To order this packaging option, add an R suffix to the part
number(e.g., TLV2464CDR).
Chip forms are tested at T
A
= 25°C only.
TLV2464M/AM/Q/AQ and TLV2465M/AM/Q/AQ AVAILABLE OPTIONS
PACKAGED DEVICES
T
A
V
IO
max
AT 25°C
SMALL
OUTLINE
(D)
SMALL
OUTLINE
(PW)
CERAMIC DIP
(J)
CHIP CARRIER
(FK)
-40°C to 125°C
2000 µV
TLV2464QD
TLV2465QD
TLV2464QPW
TLV2465QPW
-40
°
C to 125
°
C
1500 µV
TLV2464AQD
TLV2465AQD
TLV2464AQPW
TLV2465AQPW
−55°C to 125°C
2000 µV
TLV2464MJ
TLV2465MJ
TLV2464MFK
TLV2465MFK
−55°C to 125°C
1500 µV
TLV2464AMJ
TLV2465AMJ
TLV2464AMFK
TLV2465AMFK
This package is available taped and reeled. To order this packaging option, add an R suffix to the part number
(e.g., TLV2464QDR).
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