PACKAGE OPTION ADDENDUM
www.ti.com
31-Oct-2013
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status
(1)
Package Type Package
Drawing
Pins Package
Qty
Eco Plan
(2)
Lead/Ball Finish
(6)
MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
5962-9750901Q2A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 5962-
9750901Q2A
TLC7733
MFKB
5962-9750901QPA ACTIVE CDIP JG 8 1 TBD A42 N / A for Pkg Type -55 to 125 9750901QPA
TLC7733M
5962-9751301Q2A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 5962-
9751301Q2A
TLC7705
MFKB
5962-9751301QHA ACTIVE CFP U 10 1 TBD A42 N / A for Pkg Type -55 to 125 9751301QHA
TLC7705M
5962-9751301QPA ACTIVE CDIP JG 8 1 TBD A42 N / A for Pkg Type -55 to 125 9751301QPA
TLC7705M
TLC7701ID ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -40 to 85 C7701I
TLC7701IDG4 ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -40 to 85 C7701I
TLC7701IDR ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -40 to 85 C7701I
TLC7701IDRBT-NM ACTIVE SON DRB 8 250 Green (RoHS
& no Sb/Br)
CU SN Level-2-260C-1 YEAR -40 to 125 7701N
TLC7701IDRG4 ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -40 to 85 C7701I
TLC7701IP ACTIVE PDIP P 8 50 Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type -40 to 85 TLC7701IP
TLC7701IPE4 ACTIVE PDIP P 8 50 Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type -40 to 85 TLC7701IP
TLC7701IPW ACTIVE TSSOP PW 8 150 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -40 to 85 Y7701
TLC7701IPWG4 ACTIVE TSSOP PW 8 150 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -40 to 85 Y7701
TLC7701IPWLE OBSOLETE TSSOP PW 8 TBD Call TI Call TI -40 to 85
TLC7701IPWR ACTIVE TSSOP PW 8 2000 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -40 to 85 Y7701
