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TLC277IP

Part # TLC277IP
Description LINCMOS DUAL OP AMPS/LINEAR -Rail/Tube
Category IC
Availability In Stock
Qty 39
Qty Price
1 - 8 $2.78450
9 - 16 $2.21494
17 - 24 $2.08838
25 - 32 $1.94071
33 + $1.72977
Manufacturer Available Qty
Texas Instruments
Date Code: 8918
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Technical Document


DISCLAIMER: The information provided herein is solely for informational purposes. Customers must be aware of the suitability of this product for their application, and consider that variable factors such as Manufacturer, Product Category, Date Codes, Pictures and Descriptions may differ from available inventory.

TLC272, TLC272A, TLC272B, TLC272Y, TLC277
LinCMOS PRECISION DUAL OPERATIONAL AMPLIFIERS
SLOS091B – OCTOBER 1987 – REVISED AUGUST 1994
1
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
Trimmed Offset Voltage:
TLC277 . . . 500 µV Max at 25°C,
V
DD
= 5 V
Input Offset Voltage Drift...Typically
0.1 µV/Month, Including the First 30 Days
Wide Range of Supply Voltages Over
Specified Temperature Range:
0°C to 70°C...3 V to 16 V
–40°C to 85°C...4 V to 16 V
–55°C to 125°C...4 V to 16 V
Single-Supply Operation
Common-Mode Input Voltage Range
Extends Below the Negative Rail (C-Suffix,
I-Suffix types)
Low Noise...Typically 25 nV/Hz at
f = 1 kHz
Output Voltage Range Includes Negative
Rail
High Input impedance...10
12
Typ
ESD-Protection Circuitry
Small-Outline Package Option Also
Available in Tape and Reel
Designed-in Latch-Up Immunity
description
The TLC272 and TLC277 precision dual
operational amplifiers combine a wide range of
input offset voltage grades with low offset voltage
drift, high input impedance, low noise, and speeds
approaching that of general-purpose BiFET
devices.
These devices use Texas instruments silicon-gate
LinCMOS technology, which provides offset
voltage stability far exceeding the stability
available with conventional metal-gate pro-
cesses.
The extremely high input impedance, low bias
currents, and high slew rates make these cost-
effective devices ideal for applications which have
previously been reserved for BiFET and NFET
products. Four offset voltage grades are available
(C-suffix and I-suffix types), ranging from the
low-cost TLC272 (10 mV) to the high-precision TLC277 (500 µV). These advantages, in combination with good
common-mode rejection and supply voltage rejection, make these devices a good choice for new
state-of-the-art designs as well as for upgrading existing designs.
Copyright 1994, Texas Instruments Incorporated
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
1
2
3
4
8
7
6
5
1OUT
1IN
1IN+
GND
V
DD
2OUT
2IN
2IN+
D, JG, P, OR PW PACKAGE
3 2 1 20 19
910111213
4
5
6
7
8
18
17
16
15
14
NC
2OUT
NC
2IN
NC
NC
1IN
NC
1IN+
NC
FK PACKAGE
(TOP VIEW)
NC
1OUT
NC
2IN +
NC
NC
NC
GND
NC
NC – No internal connection
P Package
T
A
= 25°C
25
20
15
10
5
4000400
0
800
30
V
IO
– Input Offset Voltage – µV
Percentage of Units – %
800
DISTRIBUTION OF TLC277
INPUT OFFSET VOLTAGE
V
DD
473 Units Tested From 2 Wafer Lots
V
DD
= 5 V
(TOP VIEW)
LinCMOS is a trademark of Texas Instruments Incorporated.
TLC272, TLC272A, TLC272B, TLC272Y, TLC277
LinCMOS PRECISION DUAL OPERATIONAL AMPLIFIERS
SLOS091B – OCTOBER 1987 – REVISED AUGUST 1994
2
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
AVAILABLE OPTIONS
PACKAGED DEVICES
CHIP
T
A
V
IO
max
AT 25°C
SMALL
OUTLINE
(D)
CHIP
CARRIER
(FK)
CERAMIC
DIP
(JG)
PLASTIC
DIP
(P)
TSSOP
(PW)
CHIP
FORM
(Y)
500
µ
V TLC277CD TLC277CP
0
°
Cto70
°
c
500
µV
2 mV
TLC277CD
TLC272BCD
TLC277CP
TLC272BCP
0°C
to
70°c
5 mV TLC272ACD TLC272ACP
10mV TLC272CD TLC272CP TLC272CPW TLC272Y
500
µ
V TLC277ID TLC277IP
40
°
Cto85
°
C
500
µV
2 mV
TLC277ID
TLC272BID
TLC277IP
TLC272BIP
40°C
to
85°C
5 mV TLC272AID TLC272AIP
10 mV TLC272ID TLC272IP
55
°
Cto125
°
C
500 µV TLC277MD TLC277MFK TLC277MJG TLC277MP
55°C
to
125°C
µ
10 mV TLC272MD TLC272MFK TLC272MJG TLC272MP
The D package is available taped and reeled. Add R suffix to the device type (e.g., TLC277CDR).
description (continued)
In general, many features associated with bipolar technology are available on LinCMOS operational amplifiers
without the power penalties of bipolar technology. General applications such as transducer interfacing, analog
calculations, amplifier blocks, active filters, and signal buffering are easily designed with the TLC272 and
TLC277. The devices also exhibit low voltage single-supply operation, making them ideally suited for remote
and inaccessible battery-powered applications. The common-mode input voltage range includes the negative
rail.
A wide range of packaging options is available, including small-outline and chip carrier versions for high-density
system applications.
The device inputs and outputs are designed to withstand –100-mA surge currents without sustaining latch-up.
The TLC272 and TLC277 incorporate internal ESD-protection circuits that prevent functional failures at voltages
up to 2000 V as tested under MIL-STD-883C, Method 3015.2; however, care should be exercised in handling
these devices as exposure to ESD may result in the degradation of the device parametric performance.
The C-suffix devices are characterized for operation from 0°C to 70°C. The I-suffix devices are characterized
for operation from –40°C to 85°C. The M-suffix devices are characterized for operation over the full military
temperature range of –55°C to 125°C.
TLC272, TLC272A, TLC272B, TLC272Y, TLC277
LinCMOS PRECISION DUAL OPERATIONAL AMPLIFIERS
SLOS091B – OCTOBER 1987 – REVISED AUGUST 1994
3
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
equivalent schematic (each amplifier)
P5 P6
OUT
N7N6
R7
N4
C1
R5
N3
GND
N2
D2R4D1R3
N1
IN+
IN
P1
R1
P2
R2
N5
R6
P3 P4
V
DD
TLC272Y chip information
This chip, when properly assembled, displays characteristics similar to the TLC272C. Thermal compression or
ultrasonic bonding may be used on the doped-aluminum bonding pads. Chips may be mounted with conductive
epoxy or a gold-silicon preform.
BONDING PAD ASSIGNMENTS
CHIP THICKNESS: 15 TYPICAL
BONDING PADS: 4 × 4 MINIMUM
T
J
max = 150°C
TOLERANCES ARE ±10%.
ALL DIMENSIONS ARE IN MILS.
PIN (4) IS INTERNALLY CONNECTED
TO
BACKSIDE
OF
CHIP.
+
1OUT
1IN+
1IN
V
DD
(8)
(6)
(3)
(2)
(5)
(1)
+
(7)
2IN+
2IN
2OUT
(4)
GND
60
73
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