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TLC2274MFKB

Part # TLC2274MFKB
Description OP Amp Quad GP R-R O/P ±8V/16V 20-Pin LCCC Tube - Rail/Tub
Category IC
Availability In Stock
Qty 12
Qty Price
1 - 2 $35.93993
3 - 5 $28.58858
6 - 7 $26.95495
8 - 10 $25.04904
11 + $22.32632
Manufacturer Available Qty
Texas Instruments
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Technical Document


DISCLAIMER: The information provided herein is solely for informational purposes. Customers must be aware of the suitability of this product for their application, and consider that variable factors such as Manufacturer, Product Category, Date Codes, Pictures and Descriptions may differ from available inventory.

 
  
 
SLOS190G − FEBRUARY 1997 − REVISED MAY 2004
1
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
D Output Swing Includes Both Supply Rails
D Low Noise ...9 nV/Hz Typ at f = 1 kHz
D Low Input Bias Current ...1 pA Typ
D Fully Specified for Both Single-Supply and
Split-Supply Operation
D Common-Mode Input Voltage Range
Includes Negative Rail
D High-Gain Bandwidth . . . 2.2 MHz Typ
D High Slew Rate . . . 3.6 V/µs Typ
D Low Input Offset Voltage
950 µV Max at T
A
= 25°C
D Macromodel Included
D Performance Upgrades for the TS272,
TS274, TLC272, and TLC274
D Available in Q-Temp Automotive
HighRel Automotive Applications
Configuration Control / Print Support
Qualification to Automotive Standards
description
The TLC2272 and TLC2274 are dual and
quadruple operational amplifiers from Texas
Instruments. Both devices exhibit rail-to-rail
output performance for increased dynamic range
in single- or split-supply applications. The
TLC227x family offers 2 MHz of bandwidth and
3 V/µs of slew rate for higher speed applications.
These devices offer comparable ac performance
while having better noise, input offset voltage, and
power dissipation than existing CMOS
operational amplifiers. The TLC227x has a noise
voltage of 9 nV/Hz
, two times lower than
competitive solutions.
The TLC227x, exhibiting high input impedance
and low noise, is excellent for small-signal
conditioning for high-impedance sources, such as
piezoelectric transducers. Because of the micro-
power dissipation levels, these devices work well
in hand-held monitoring and remote-sensing
applications. In addition, the rail-to-rail output
feature, with single- or split-supplies, makes this
family a great choice when interfacing with analog-to-digital converters (ADCs). For precision applications, the
TLC227xA family is available with a maximum input offset voltage of 950 µV. This family is fully characterized
at 5 V and ±5 V.
The TLC2272/4 also makes great upgrades to the TLC272/4 or TS272/4 in standard designs. They offer
increased output dynamic range, lower noise voltage, and lower input offset voltage. This enhanced feature set
allows them to be used in a wider range of applications. For applications that require higher output drive and
wider input voltage range, see the TLV2432 and TLV2442 devices.
If the design requires single amplifiers, see the TLV2211/21/31 family. These devices are single rail-to-rail
operational amplifiers in the SOT-23 package. Their small size and low power consumption, make them ideal
for high density, battery-powered equipment.
Copyright 2004, Texas Instruments Incorporated
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Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Advanced LinCMOS is a trademark of Texas Instruments.
|V
DD±
| − Supply Voltage − V
10
8
6
4
46 8
12
14
16
10 12 14
16
MAXIMUM PEAK-TO-PEAK OUTPUT VOLTAGE
vs
SUPPLY VOLTAGE
T
A
= 25°C
I
O
= ±50 µA
I
O
= ±500 µA
V(OPP) − Maximum Peak-to-Peak Output Voltage − VV
O(PP)
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 
  
 
SLOS190G − FEBRUARY 1997 − REVISED MAY 2004
2
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
TLC2272 AVAILABLE OPTIONS
PACKAGED DEVICES
T
A
V
IO
max
At 25°C
SMALL
OUTLINE
(D)
CERAMIC
LCC
(FK)
CERAMIC
DIP
(JG)
PLASTIC DIP
(P)
TSSOP
(PW)
CERAMIC
FLAT PACK
(U)
0°C to 70°C
950 µV
TLC2272ACD
TLC2272ACP
TLC2272ACPW
0°C to 70°C
950 µV
2.5 mV
TLC2272ACD
TLC2272CD
TLC2272ACP
TLC2272CP
TLC2272CPW
950 µV
TLC2272AID
TLC2272AIP
−40°C to 125°C
950 µV
2.5 mV
TLC2272AID
TLC2272ID
TLC2272AIP
TLC2272IP
TLC2272IPW
−40
°
C to 125
°
C
950 µV
TLC2272AQD
TLC2272AQPW
950 µV
2.5 mV
TLC2272AQD
TLC2272QD
TLC2272AQPW
TLC2272QPW
−55°C to 125°C
950 µV
TLC2272AMD
TLC2272AMFK
TLC2272AMJG
TLC2272AMP
TLC2272AMU
−55
°
C to 125
°
C
950 µV
2.5 mV
TLC2272AMD
TLC2272MD
TLC2272AMFK
TLC2272MFK
TLC2272AMJG
TLC2272MJG
TLC2272AMP
TLC2272MP
TLC2272AMU
TLC2272MU
The D packages are available taped and reeled. Add R suffix to the device type (e.g., TLC2272CDR).
The PW package is available taped and reeled. Add R suffix to the device type (e.g., TLC2272PWR).
§
Chips are tested at 25°C.
TLC2274 AVAILABLE OPTIONS
PACKAGED DEVICES
T
A
V
IO
max
AT 25°C
SMALL
OUTLINE
(D)
CERAMIC
LCC
(FK)
CERAMIC
DIP
(J)
PLASTIC
DIP
(N)
TSSOP
(PW)
CERAMIC
FLAT PACK
(W)
0°C to 70°C
950 µV
TLC2274ACD
TLC2274ACN
TLC2274ACPW
0°C to 70°C
950 µV
2.5 mV
TLC2274ACD
TLC2274CD
TLC2274ACN
TLC2274CN
TLC2274ACPW
TLC2274CPW
950 µV
TLC2274AID
TLC2274AIN
TLC2274AIPW
−40°C to 125°C
950 µV
2.5 mV
TLC2274AID
TLC2274ID
TLC2274AIN
TLC2274IN
TLC2274AIPW
TLC2274IPW
−40°C to 125°C
950 µV
TLC2274AQD
950 µV
2.5 mV
TLC2274AQD
TLC2274QD
−55°C to 125°C
950 µV
TLC2274AMD
TLC2274AMFK
TLC2274AMJ
TLC2274AMN
TLC2274AMW
−55
°
C to 125
°
C
950 µV
2.5 mV
TLC2274AMD
TLC2274MD
TLC2274AMFK
TLC2274MFK
TLC2274AMJ
TLC2274MJ
TLC2274AMN
TLC2274MN
TLC2274AMW
TLC2274MW
The D packages are available taped and reeled. Add R suffix to device type (e.g., TLC2274CDR).
The PW package is available taped and reeled.
§
Chips are tested at 25°C.
 
  
 
SLOS190G − FEBRUARY 1997 − REVISED MAY 2004
3
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
1
2
3
4
8
7
6
5
1OUT
1IN
1IN+
V
DD
/GND
V
DD+
2OUT
2IN
2IN+
TLC2272
D, JG, P, OR PW PACKAGE
(TOP VIEW)
1
2
3
4
5
6
7
14
13
12
11
10
9
8
1OUT
1IN
1IN+
V
DD+
2IN+
2IN
2OUT
4OUT
4IN
4IN+
V
DD
3IN+
3IN
3OUT
3212019
910111213
4
5
6
7
8
18
17
16
15
14
4IN+
NC
V
DD
NC
3IN+
1IN+
NC
V
DD+
NC
2IN+
1IN −
1OUT
NC
3IN −
4IN −
2IN −
2OUT
NC
NC − No internal connection
3OUT
4OUT
TLC2274
D, J, N, PW, OR W PACKAGE
(TOP VIEW)
TLC2274
FK PACKAGE
(TOP VIEW)
3212019
910111213
4
5
6
7
8
18
17
16
15
14
NC
2 OUT
NC
2 IN−
NC
NC
1 IN−
NC
1 IN+
NC
NC
1OUT
NC
NC
NC
NC
V /GND
NC
2 IN+
V
TLC2272
FK PACKAGE
(TOP VIEW)
DD−
DD+
1
2
3
4
5
10
9
8
7
6
NC
1 OUT
1 IN−
1 IN+
V
DD−
/GND
NC
V
DD+
2 OUT
2 IN−
2 IN+
TLC2272
U PACKAGE
(TOP VIEW)
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