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TIBPAL16R4-30MJB

Part # TIBPAL16R4-30MJB
Description High Performance Impact PAL Circuits 20-Pin CDIP Tube - Ra
Category IC
Availability In Stock
Qty 5
Qty Price
1 + $5.79804
Manufacturer Available Qty
Texas Instruments
Date Code: 9108
  • Shipping Freelance Stock: 2
    Ships Immediately
Texas Instruments
Date Code: 9000
  • Shipping Freelance Stock: 3
    Ships Immediately



Technical Document


DISCLAIMER: The information provided herein is solely for informational purposes. Customers must be aware of the suitability of this product for their application, and consider that variable factors such as Manufacturer, Product Category, Date Codes, Pictures and Descriptions may differ from available inventory.

TIBPAL16L8-25C, TIBPAL16R4-25C, TIBPAL16R6-25C, TIBPAL16R8-25C
TIBPAL16L8-30M, TIBPAL16R4-30M, TIBPAL16R6-30M, TIBPAL16R8-30M
LOW-POWER HIGH-PERFORMANCE IMPACTPAL
®
CIRCUITS
SRPS059A FEBRUARY 1984 REVISED DECEMBER 2010
1
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
D High-Performance Operation:
Propagation Delay
C Suffix . . . 25 ns Max
M Suffix...30 ns Max
D Functionally Equivalent, but Faster Than
PAL16L8A, PAL16R4A, PAL16R6A, and
PAL16R8A
D Power-Up Clear on Registered Devices (All
Register Outputs Are Set High, but Voltage
Levels at the Output Pins Go Low)
D Package Options Include Both Plastic and
Ceramic Chip Carriers in Addition to Plastic
and Ceramic DIPs
D Dependable Texas Instruments Quality and
Reliability
DEVICE
I
INPUTS
3-STATE
O
OUTPUTS
REGISTERED
Q
OUTPUTS
I/O
PORTS
PAL16L8 10 2 0 6
PAL16R4 8 0
4 (3-state
buffers)
4
PAL16R6 8 0
6 (3-state
buffers)
2
PAL16R8 8 0
8 (3-state
buffers)
0
description
These programmable array logic devices feature
high speed and functional equivalency when
compared with currently available devices. These
IMPACT circuits combine the latest Advanced
Low-Power Schottky technology with proven
titanium-tungsten fuses to provide reliable,
high-performance substitutes for conventional
TTL logic. Their easy programmability allows for
quick design of custom functions and typically
results in a more compact circuit board. In
addition, chip carriers are available for further
reduction in board space.
The TIBPAL16’ C series is characterized from 0°C
to 75°C. The TIBPAL16’ M series is characterized
for operation over the full military temperature
range of 55°C to 125°C.
Copyright © 2010, Texas Instruments Incorporated
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
IMPACT is a trademark of Texas Instruments.
PAL is a registered trademark of Advanced Micro Devices Inc.
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I
I
I
I
I
I
I
I
I
GND
V
CC
O
I/O
I/O
I/O
I/O
I/O
I/O
O
I
TIBPAL16L8’
C SUFFIX ...J OR N PACKAGE
M SUFFIX ...J OR W PACKAGE
(TOP VIEW)
4
5
6
7
8
18
17
16
15
14
I/O
I/O
I/O
I/O
I/O
I
I
I
I
I
TIBPAL16L8’
C SUFFIX . . . FN PACKAGE
M SUFFIX . . . FK PACKAGE
(TOP VIEW)
I
I
I
O
I/O
O
I
GND
I
V
CC
3212019
910111213
TIBPAL16R4-25C, TIBPAL16R6-25C, TIBPAL16R8-25C
TIBPAL16R4-30M, TIBPAL16R6-30M, TIBPAL16R8-30M
LOW-POWER HIGH-PERFORMANCE IMPACTPAL
®
CIRCUITS
SRPS059A FEBRUARY 1984 REVISED DECEMBER 2010
2
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
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10
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11
CLK
I
I
I
I
I
I
I
I
GND
V
CC
I/O
I/O
Q
Q
Q
Q
I/O
I/O
OE
TIBPAL16R4’
C SUFFIX ...J OR N PACKAGE
M SUFFIX ...J OR W PACKAGE
(TOP VIEW)
CLK
I
I
I
I
I
I
I
I
GND
V
CC
I/O
Q
Q
Q
Q
Q
Q
I/O
OE
TIBPAL16R6’
C SUFFIX ...J OR N PACKAGE
M SUFFIX ...J OR W PACKAGE
(TOP VIEW)
CLK
I
I
I
I
I
I
I
I
GND
V
CC
Q
Q
Q
Q
Q
Q
Q
Q
OE
TIBPAL16R8’
C SUFFIX ...J OR N PACKAGE
M SUFFIX ...J OR W PACKAGE
(TOP VIEW)
I
I
CLK
I/O
I/O
I/O
I
GND
V
CC
OE
I/O
Q
Q
Q
Q
I
I
I
I
I
TIBPAL16R4’
C SUFFIX . . . FN PACKAGE
M SUFFIX . . . FK PACKAGE
(TOP VIEW)
I
I
CLK
I/O
Q
I/O
I
GND
V
CC
Q
Q
Q
Q
Q
I
I
I
I
I
OE
TIBPAL16R6’
C SUFFIX . . . FN PACKAGE
M SUFFIX . . . FK PACKAGE
(TOP VIEW)
I
I
CLK
Q
Q
Q
I
GND
V
CC
OE
Q
Q
Q
Q
Q
I
I
I
I
I
TIBPAL16R8’
C SUFFIX . . . FN PACKAGE
M SUFFIX . . . FK PACKAGE
(TOP VIEW)
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11
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3
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5
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5
6
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8
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17
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15
14
3212019
910111213
4
5
6
7
8
18
17
16
15
14
3212019
910111213
4
5
6
7
8
18
17
16
15
14
3212019
910111213
TIBPAL16R4-25C, TIBPAL16R6-25C, TIBPAL16R8-25C
TIBPAL16R4-30M, TIBPAL16R6-30M, TIBPAL16R8-30M
LOW-POWER HIGH-PERFORMANCE IMPACTPAL
®
CIRCUITS
SRPS059A FEBRUARY 1984 REVISED DECEMBER 2010
3
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
functional block diagrams (positive logic)
denotes fused inputs
TIBPAL16L8
TIBPAL16R4
O
O
I/O
I/O
I/O
I/O
I/O
I/O
I
EN
1
&
32 × 64
10 16
166
7
7
7
7
7
7
7
7
6
Q
I/O
I/O
I/O
I/O
I
EN
816
164
7
7
7
8
8
8
7
4
1
1
8
Q
Q
Q
4
1D
I = 1
2
CLK
C1
EN 2
OE
4
16 ×
16 ×
&
32 × 64
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