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TE28F800C3BA90

Part # TE28F800C3BA90
Description NOR, Flash 512K x 16 48PinTSSOP
Category IC
Availability In Stock
Qty 375
Qty Price
1 - 78 $0.87249
79 - 157 $0.69403
158 - 236 $0.65437
237 - 315 $0.60810
316 + $0.54200
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Technical Document


DISCLAIMER: The information provided herein is solely for informational purposes. Customers must be aware of the suitability of this product for their application, and consider that variable factors such as Manufacturer, Product Category, Date Codes, Pictures and Descriptions may differ from available inventory.

Intel
£
Advanced+ Boot Block Flash Memory (C3)
64 Datasheet
Appendix D Mechanical Specifications
Figure 19. µBGA* and VF BGA Package Drawing & Dimensions
Bottom View -Bump side up
e
b
S1
Ball A1
Corner
Top View - Bump Side down
Ball A1
Corner
E
D
Side View
A
A2
A
1
Seating
Y
A
B
C
D
E
F
S2
Plan
123
4
5678
A
B
C
D
E
F
123
4
5678
Note: Drawing not to scale
Millimeters Inches
Dimens ions Symbol Min Nom Max Min Nom Max
Package Height A 1.000 0.0394
Ball Height A1 0.150 0.0059
Package Body Thicknes s A2 0.665 0.0262
Ball (Lead) Width b 0.325 0.375 0.425 0.0128 0.0148 0.0167
Package Body Length 8M (.25) D 7.810 7.910 8.010
Package Body Length 16M (.25/.18/.13) 32M (.25/.18/.13) D 7.186 7.286 7.386 0.2829 0.2868 0.2908
Package Body Length 64M (.18) D 7.600 7.700 7.800 0.2992 0.3031 0.3071
Package Body Width 8M (.25) E 6.400 6.500 6.600 0.2520 0.2559 0.2598
Package Body Width 16M (.25/.18/.13) 32M (.18/.13) E 6.864 6.964 7.064 0.2702 0.2742 0.2781
Package Body Width 32M (.25) E 10.750 10.850 10.860 0.4232 0.4272 0.4276
Package Body Width 64M (.18) E 8.900 9.000 9.100 0.3504 0.3543 0.3583
Pitch e 0.750 0.0295
Ball (Lead) Count 8M, 16M N 46 46
Ball (Lead) Count 32M N 47 47
Ball (Lead) Count 64M N 48 48
Seating Plane Coplanarity Y 0.100 0.0039
Corner to Ball A 1 Dis tance Along D 8M (.25) S1 1.230 1.330 1.430 0.0484 0.0524 0.0563
Corner to Ball A 1 Dis tance Along D 16M (.25/.18/.13) 32M (.18/.13) S1 0.918 1.018 1.118 0.0361 0.0401 0.0440
Corner to Ball A 1 Dis tance Along D 64M (.18) S1 1.125 1.225 1.325 0.0443 0.0482 0.0522
Corner to Ball A 1 Dis tance Along E 8M (.25) S2 1.275 1.375 1.475 0.0502 0.0541 0.0581
Corner to Ball A 1 Dis tance Along E 16M (.25/.18/.13) 32M (.18/.13) S2 1.507 1.607 1.707 0.0593 0.0633 0.0672
Corner to Ball A 1 Dis tance Along E 32M (.25) S2 3.450 3.550 3.650 0.1358 0.1398 0.1437
Corner to Ball A 1 Dis tance Along E 64M (.18) S2 2.525 2.625 2.725 0.0994 0.1033 0.1073
R0
Intel
£
Advanced+ Boot Block Flash Memory (C3)
Datasheet 65
1. One dimple on package denotes Pin 1.
2. If two dimples, then the larger dimple denotes Pin 1.
3. Pin 1 will always be in the upper left corner of the package, in reference to the product mark.
4. Pin 1 will always supersede above pin one notes.
Figure 20. TSOP Package Drawing & Dimensions
Dimensions
A5568-02
A
0
L
Detail A
Y
D
C
Z
Pin 1
E
D
1
b
Detail B
See Det ail A
e
See DetailB
A
1
A
2
Seating
Plane
See Not es 1, 2, 3 and 4
Family: Thin Small Out-Line Package
Symbol
Millimeters Inches
Min
Nom Max Notes Min Nom Max Notes
Package Height A 1.200 0.047
Standoff A1 0.050 0.002
Package Body Thickness A2 0.950 1.000 1.050 0.037 0.039 0.041
Lead Width b 0.150 0.200 0.300 0.006 0.008 0.012
Lead Thickness c 0.100 0.150 0.200 0.004 0.006 0.008
Plastic Body Length D1 18.200 18.400 18.600 0.717 0.724 0.732
Package Body Width E 11.800 12.000 12.200 0.465 0.472 0.480
Lead Pitch e 0.500 0.0197
Terminal Dimension D 19.800 20.000 20.200 0.780 0.787 0.795
Lead Tip Length L 0.500 0.600 0.700 0.020 0.024 0.028
Lead Count N 48 48
Lead Tip Angle Ø 0° 5°
Seating Plane Coplanarity Y 0.100 0.004
Lead to Package Offset Z 0.150 0.250 0.350 0.006 0.010 0.014
Intel
£
Advanced+ Boot Block Flash Memory (C3)
66 Datasheet
Figure 21. Easy BGA Package Drawing & Dimension
Millimet ers Inches
Symbol Min Nom Max Notes Min Nom Max
Package Height A 1.200 0.0472
Ball Height A
1
0.250 0.0098
Package Body Thickness A
2
0.780 0.0307
Ball (Lead) Width b 0.330 0.430 0.530 0.0130 0.0169 0.0209
Package Body Wid th D 9.900 10.000 10.100 1 0.3898 0.3937 0.3976
Package Body Length E 12.900 13.000 13.100 1 0.5079 0.5118 0.5157
Pitch [e] 1.000 0.0394
Ball (Lead) Count N 64 64
Seating Plane Coplanarity Y 0.100 0.0039
Corner to Ball A1 Distance Along D S
1
1.400 1.500 1.600 1 0.0551 0.0591 0.0630
Corner to Ball A1 Distance Along E S
2
2.900 3.000 3.100 1 0.1142 0.1181 0.1220
Dimensions Table
Note: (1) Package dimensions are for reference only. These dimensions are estimates based
on die size, and are sub
j
ect to chan
g
e.
E
Seating
Plane
S1
S2
e
Top View - Ball side down Bottom View - Ball Side Up
Y
A
A1
D
Ball A1
Corner
A2
Note: Drawing not to scale
A
B
C
D
E
F
G
H
8765432187654321
A
B
C
D
E
F
G
H
b
Ball A1
Corner
Side View
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