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TE28F800C3BA90

Part # TE28F800C3BA90
Description NOR, Flash 512K x 16 48PinTSSOP
Category IC
Availability In Stock
Qty 375
Qty Price
1 - 78 $0.87249
79 - 157 $0.69403
158 - 236 $0.65437
237 - 315 $0.60810
316 + $0.54200
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Date Code: 0015
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Technical Document


DISCLAIMER: The information provided herein is solely for informational purposes. Customers must be aware of the suitability of this product for their application, and consider that variable factors such as Manufacturer, Product Category, Date Codes, Pictures and Descriptions may differ from available inventory.

Contents
4 Datasheet
5.6.1 Program Protection................................................................................................ 31
6.0 Power Consumption.................................................................................................................... 32
6.1 Active Power (Program/Erase/Read).................................................................................. 32
6.2 Automatic Power Savings (APS) ........................................................................................32
6.3 Standby Power ................................................................................................................... 32
6.4 Deep Power-Down Mode.................................................................................................... 32
6.5 Power and Reset Considerations .......................................................................................33
6.5.1 Power-Up/Down Characteristics............................................................................ 33
6.5.2 RP# Connected to System Reset.......................................................................... 33
6.5.3 VCC, VPP and RP# Transitions ............................................................................33
6.6 Power Supply Decoupling................................................................................................... 34
7.0 Thermal and DC Characteristics................................................................................................ 34
7.1 Absolute Maximum Ratings ................................................................................................ 34
7.2 Operating Conditions..........................................................................................................35
7.3 DC Current Characteristics................................................................................................. 35
7.4 DC Voltage Characteristics................................................................................................. 38
8.0 AC Characteristics ...................................................................................................................... 39
8.1 AC Read Characteristics .................................................................................................... 39
8.2 AC Write Characteristics..................................................................................................... 43
8.3 Erase and Program Timings ............................................................................................... 47
8.4 Reset Specifications ........................................................................................................... 48
8.5 AC I/O Test Conditions....................................................................................................... 49
8.6 Device Capacitance............................................................................................................49
Appendix A Write State Machine States.............................................................................................50
Appendix B Flow Charts ......................................................................................................................52
Appendix C Common Flash Interface.................................................................................................58
Appendix D Mechanical Specifications..............................................................................................64
Appendix E Additional Information ....................................................................................................67
Appendix F Ordering Information .......................................................................................................68
Datasheet 5
Contents
Revision History
Date of
Revision
Version Description
05/12/98 -001 Original version
07/21/98 -002
48-Lead TSOP package diagram change
µBGA package diagrams change
32-Mbit ordering information change (Section 6)
CFI Query Structure Output Table Change (Table C2)
CFI Primary-Vendor Specific Extended Query Table Change for Optional
Features and Command Support change (Table C8)
Protection Register Address Change
I
PPD
test conditions clarification (Section 4.3)
µBGA package top side mark information clarification (Section 6)
10/03/98 -003
Byte-Wide Protection Register Address change
V
IH
Specification change (Section 4.3)
V
IL
Maximum Specification change (Section 4.3)
I
CCS
test conditions clarification (Section 4.3)
Added Command Sequence Error Note (Table 7)
Datasheet renamed from 3 Volt Advanced Boot Block, 8-, 16-, 32-Mbit Flash
Memory Family.
12/04/98 -004
Added t
BHWH
/t
BHEH
and t
QVBL
(Section 4.6)
Programming the Protection Register clarification (Section 3.4.2)
12/31/98 -005 Removed all references to x8 configurations
02/24/99 -006 Removed reference to 40-Lead TSOP from front page
06/10/99 -007
Added Easy BGA package (Section 1.2)
Removed 1.8 V I/O references
Locking Operations Flowchart changed (Appendix B)
Added t
WHGL
(Section 4.6)
CFI Primary Vendor-Specific Extended Query changed (Appendix C)
03/20/00 -008
Max I
CCD
changedto2A
Table 10, added note indicating V
CC
Max = 3.3 V for 32-Mbit device
04/24/00 -009
Added specifications for 0.18 micron product offerings throughout document
Added 64-Mbit density
10/12/00 -010
Changed references of 32Mbit 80ns devices to 70ns devices to reflect the
faster product offering.
Changed VccMax=3.3V reference to indicate that the affected product is the
0.25µm 32Mbit device.
Minor text edits throughout document.
7/20/01 -011
Added 1.8v I/O operation documentation where applicable
Added TSOP PCN ‘Pin-1’ indicator information
Changed references in 8 x 8 BGA pinout diagrams from ‘GND’ to ‘Vssq’
Added ‘Vssq’ to Pin Descriptions Information
Removed 0.4 µm references in DC characteristics table
Corrected 64Mb package Ordering Information from 48-uBGA to 48-VFBGA
Corrected‘bottom’parameterblocksizestoon8Mbdeviceto8x4KWords
Minor text edits throughout document
10/02/01 -012 Added specifications for 0.13 micron product offerings throughout document
2/05/02 -013
Corrected Iccw / Ippw / Icces /Ippes values.
Added mechanicals for 16Mb and 64Mb
Minor text edits throughout document.
Contents
6 Datasheet
4/05/02 -014
Updated 64Mb product offerings.
Updated 16Mb product offerings.
Revised and corrected DC Characteristics Table.
Added mechanicals for Easy BGA.
Minor text edits throughout document.
3/06/03 -016 Complete technical update.
10/03 -017 Corrected information in the Device Geometry Details table, address 0x34.
Date of
Revision
Version Description
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