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TE28F800C3BA90

Part # TE28F800C3BA90
Description NOR, Flash 512K x 16 48PinTSSOP
Category IC
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Technical Document


DISCLAIMER: The information provided herein is solely for informational purposes. Customers must be aware of the suitability of this product for their application, and consider that variable factors such as Manufacturer, Product Category, Date Codes, Pictures and Descriptions may differ from available inventory.

Intel
£
Advanced+ Boot Block Flash
Memory (C3)
28F800C3, 28F160C3, 28F320C3, 28F640C3 (x16)
Datasheet
Product Features
The Intel
®
Advanced+ Book Block Flash Memory (C3) device, manufactured on Intel’s latest
0.13 µm and 0.18 µm technologies, represents a feature-rich solution for low-power applications.
The C3 device incorporates low-voltage capability (3 V read, program, and erase) with high-
speed, low-power operation. Flexible block locking allows any block to be independently locked
or unlocked. Add to this the Intel
®
Flash Data Integrator (FDI) software and you have a cost-
effective, flexible, monolithic code plus data storage solution. Intel
®
Advanced+ Boot Block Flash
Memory (C3) products will be available in 48-lead TSOP, 48-ball CSP, and 64-ball Easy BGA
packages. Additional information on this product family can be obtained by accessing the Intel
®
Flash website: http://www.intel.com/design/flash.
Flexible SmartVoltage Technology
2.7 V– 3.6 V Read/Program/Erase
12 V for Fast Production Programming
1.65 V–2.5 V or 2.7 V–3.6 V I/O Option
Reduces Overall System Power
High Performance
2.7 V– 3.6 V: 70 ns Max Access Time
Optimized Architecture for Code Plus
Data Storage
Eight 4 Kword Blocks, Top or Bottom
Parameter Boot
Up to One Hundred-Twenty-Seven 32
Kword Blocks
Fast Program Suspend Capability
Fast Erase Suspend Capability
Flexible Block Locking
Lock/Unlock Any Block
Full Protection on Power-Up
WP# Pin for Hardware Block Protection
Low Power Consumption
9 mA Typical Read
7 A Typical Standby with Automatic
Power Savings Feature (APS)
Extended Temperature Operation
—–40 °C to +85 °C
128-bit Protection Register
64 bit Unique Device Identifier
64 bit User Programmable OTP Cells
Extended Cycling Capability
Minimum 100,000 Block Erase Cycles
Software
—Intel
®
Flash Data Integrator (FDI)
Supports Top or Bottom Boot Storage,
Streaming Data (e.g., voice)
Intel Basic Command Set
Common Flash Interface (CFI)
Standard Surface Mount Packaging
48-Ball µBGA*/VFBGA
64-Ball Easy BGA Packages
48-Lead TSOP Package
ETOX™ VIII (0.13 µm) Flash
Technology
16, 32 Mbit
ETOX™ VII (0.18 µm) Flash Technology
16, 32, 64 Mbit
ETOX™ VI (0.25 µm) Flash Technology
8, 16 and 32 Mbit
Order Number: 290645-017
October 2003
Notice: This specification is subject to change without notice. Verify with your local Intel sales
office that you have the latest datasheet before finalizing a design.
2 Datasheet
INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY
ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN
INTEL'S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS
ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES
RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER
INTELLECTUAL PROPERTY RIGHT. Intel products are not intended for use in medical, life saving, or life sustaining applications.
Intel may make changes to specifications and product descriptions at any time, without notice.
Designers must not rely on the absence or characteristics of any features or instructions marked "reserved" or "undefined." Intel reserves these for
future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them.
The 28F800C3, 28F160C3, 28F320C3, 28F640C3 may contain design defects or errors known as errata which may cause the product to deviate from
published specifications. Current characterized errata are available on request.
Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order.
Copies of documents which have an ordering number and are referenced in this document, or other Intel literature may be obtained by calling 1-800-
548-4725 or by visiting Intel's website at http://www.intel.com.
Copyright © Intel Corporation, 2003
*Third-party brands and names are the property of their respective owners.
Datasheet 3
Contents
Contents
1.0 Introduction....................................................................................................................................7
1.1 Document Purpose ...............................................................................................................7
1.2 Nomenclature .......................................................................................................................7
1.3 Conventions..........................................................................................................................7
2.0 Device Description ........................................................................................................................8
2.1 Product Overview .................................................................................................................8
2.2 Ballout Diagram ....................................................................................................................8
2.3 Signal Descriptions .............................................................................................................13
2.4 Block Diagram ....................................................................................................................14
2.5 Memory Map.......................................................................................................................15
3.0 Device Operations .......................................................................................................................17
3.1 Bus Operations ...................................................................................................................17
3.1.1 Read ......................................................................................................................17
3.1.2 Write ......................................................................................................................17
3.1.3 Output Disable .......................................................................................................17
3.1.4 Standby..................................................................................................................18
3.1.5 Reset .....................................................................................................................18
4.0 Modes of Operation.....................................................................................................................19
4.1 Read Mode .........................................................................................................................19
4.1.1 Read Array.............................................................................................................19
4.1.2 Read Identifier .......................................................................................................19
4.1.3 CFI Query ..............................................................................................................20
4.1.4 Read Status Register.............................................................................................20
4.1.4.1 Clear Status Register.............................................................................21
4.2 Program Mode ....................................................................................................................21
4.2.1 12-Volt Production Programming...........................................................................21
4.2.2 Suspending and Resuming Program .....................................................................22
4.3 Erase Mode ........................................................................................................................22
4.3.1 Suspending and Resuming Erase .........................................................................23
5.0 Security Modes ............................................................................................................................27
5.1 Flexible Block Locking ........................................................................................................27
5.1.1 Locking Operation..................................................................................................28
5.1.1.1 Locked State ..........................................................................................28
5.1.1.2 Unlocked State.......................................................................................28
5.1.1.3 Lock-Down State....................................................................................28
5.2 Reading Block-Lock Status.................................................................................................28
5.3 Locking Operations during Erase Suspend ........................................................................29
5.4 Status Register Error Checking ..........................................................................................29
5.5 128-Bit Protection Register.................................................................................................29
5.5.1 Reading the Protection Register............................................................................30
5.5.2 Programming the Protection Register....................................................................30
5.5.3 Locking the Protection Register.............................................................................30
5.6 V
PP
Program and Erase Voltages ......................................................................................30
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