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LP38693SD-5.0

Part # LP38693SD-5.0
Description LDO Regulator Pos 5V 0.5A 6-Pin LLP EP T/R (Alt: LP38693SD
Category IC
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Technical Document


DISCLAIMER: The information provided herein is solely for informational purposes. Customers must be aware of the suitability of this product for their application, and consider that variable factors such as Manufacturer, Product Category, Date Codes, Pictures and Descriptions may differ from available inventory.

LP38693
V
IN
V
OUT
SNS
**
GND
1 PF *
1 PF *
V
OUT
V
IN
V
EN
V
EN
LP38691
V
IN
V
OUT
SNS
**
GND
1 PF *
1 PF *
V
OUT
V
IN
LP38691, LP38693
www.ti.com
SNVS321K –JANUARY 2005–REVISED APRIL 2013
LP38691
LP38693 500mA Low Dropout CMOS Linear Regulators
Stable with Ceramic Output Capacitors
Check for Samples: LP38691, LP38693
1
FEATURES
DESCRIPTION
The LP38691/3 low dropout CMOS linear regulators
2
• All WSON Options are Available as AEC-Q100
provide tight output tolerance (2.0% typical),
Grade 1
extremely low dropout voltage (250 mV @ 500mA
• 2.0% Output Accuracy (25°C)
load current, V
OUT
= 5V), and excellent AC
• Low Dropout Voltage: 250 mV @ 500mA (typ,
performance utilizing ultra low ESR ceramic output
capacitors.
5V out)
• Wide Input Voltage Range (2.7V to 10V)
The low thermal resistance of the WSON, SOT-223
and PFM packages allow the full operating current to
• Precision (Trimmed) Bandgap Reference
be used even in high ambient temperature
• Ensured Specs for -40°C to +125°C
environments.
• 1µA Off-State Quiescent Current
The use of a PMOS power transistor means that no
• Thermal Overload Protection
DC base drive current is required to bias it allowing
• Foldback Current Limiting
ground pin current to remain below 100 µA
regardless of load current, input voltage, or operating
• PFM, SOT-223 and 6-Lead WSON Packages
temperature.
• Enable Pin (LP38693)
Dropout Voltage: 250 mV (typ) @ 500mA (typ. 5V
out).
APPLICATIONS
• Hard Disk Drives Ground Pin Current: 55 µA (typ) at full load.
• Notebook Computers
Precision Output Voltage: 2.0% (25°C) accuracy.
• Battery Powered Devices
• Portable Instrumentation
Typical Application Circuits
* Minimum value required for stability.
**WSON package devices only.
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
2All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date.
Copyright © 2005–2013, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
V
IN
2
3
4
5
6
1
GND
N/C
V
OUT
SNS
V
IN
Exposed Pad
on Bottom
(DAP)
V
IN
2
3
4
5
6
1
GND
V
EN
V
OUT
SNS
V
IN
Exposed Pad
on Bottom
(DAP)
N/C
V
OUT
GND
V
EN
V
IN
1
2
4
3
5
LP38691, LP38693
SNVS321K –JANUARY 2005–REVISED APRIL 2013
www.ti.com
Connection Diagrams
Figure 1. PFM (LP38691DT-X.X) – Top View Figure 2. SOT-223 (LP38693MP-X.X) – Top View
See Package Number NDP0003B See Package Number NDC0005A
Figure 3. 6-Lead WSON (LP38691SD-X.X) – Top Figure 4. 6-Lead WSON (LP38693SD-X.X) – Top
View View
See Package Number NGG0006A See Package Number NGG
PIN DESCRIPTIONS
Pin Description
This is the input supply voltage to the regulator. For WSON devices, both V
IN
pins must be tied together for
V
IN
full current operation (250mA maximum per pin).
Circuit ground for the regulator. For the PFM and SOT-223 packages this is thermally connected to the die
GND
and functions as a heat sink when the soldered down to a large copper plane.
Output sense pin allows remote sensing at the load which will eliminate the error in output voltage due to
SNS voltage drops caused by the resistance in the traces between the regulator and the load. This pin must be
tied to V
OUT
.
V
EN
The enable pin allows the part to be turned ON and OFF by pulling this pin high or low.
V
OUT
Regulated output voltage
WSON Only - The DAP (Exposed Pad) functions as a thermal connection when soldered to a copper plane.
DAP
See WSON MOUNTING section in APPLICATION HINTS for more information.
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
2 Submit Documentation Feedback Copyright © 2005–2013, Texas Instruments Incorporated
Product Folder Links: LP38691 LP38693
LP38691, LP38693
www.ti.com
SNVS321K –JANUARY 2005–REVISED APRIL 2013
ABSOLUTE MAXIMUM RATINGS
(1)(2)
Storage Temperature Range −65°C to +150°C
Lead Temp. (Soldering, 5 seconds) 260°C
ESD Rating
(3)
2 kV
Power Dissipation
(4)
Internally Limited
V(max) All pins (with respect to GND) -0.3V to 12V
I
OUT
(5)
Internally Limited
Junction Temperature −40°C to +150°C
(1) Absolute maximum ratings indicate limits beyond which damage to the component may occur. Operating ratings indicate conditions for
which the device is intended to be functional, but do not ensure specific performance limits. For ensured specifications, see Electrical
Characteristics. Specifications do not apply when operating the device outside of its rated operating conditions.
(2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and
specifications.
(3) ESD is tested using the human body model which is a 100pF capacitor discharged through a 1.5k resistor into each pin.
(4) At elevated temperatures, device power dissipation must be derated based on package thermal resistance and heatsink values (if a
heatsink is used). The junction-to-ambient thermal resistance ( θ
J-A
) for the PFM is approximately 90°C/W for a PC board mounting with
the device soldered down to minimum copper area (less than 0.1 square inch). If one square inch of copper is used as a heat dissipator
for the PFM, the θ
J-A
drops to approximately 50°C/W. The SOT-223 package has a θ
J-A
of approximately 125°C/W when soldered down
to a minimum sized pattern (less than 0.1 square inch) and approximately 70°C/W when soldered to a copper area of one square inch.
The θ
J-A
values for the WSON package are also dependent on trace area, copper thickness, and the number of thermal vias used (refer
to the TI (AN-1187 Application Report) and the WSON MOUNTING section in this datasheet). If power dissipation causes the junction
temperature to exceed specified limits, the device will go into thermal shutdown.
(5) If used in a dual-supply system where the regulator load is returned to a negative supply, the output pin must be diode clamped to
ground.
OPERATING RATINGS
V
IN
Supply Voltage 2.7V to 10V
Operating Junction Temperature Range −40°C to +125°C
Copyright © 2005–2013, Texas Instruments Incorporated Submit Documentation Feedback 3
Product Folder Links: LP38691 LP38693
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