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SPC5200CBV400B

Part # SPC5200CBV400B
Description MPU MPC52xx RISC 32-Bit 400MHz 2.5V/3.3V 272-Pin BGA Tray
Category IC
Availability Out of Stock
Qty 0
Qty Price
1 + $29.63318

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Technical Document


DISCLAIMER: The information provided herein is solely for informational purposes. Customers must be aware of the suitability of this product for their application, and consider that variable factors such as Manufacturer, Product Category, Date Codes, Pictures and Descriptions may differ from available inventory.

Package Description
MPC5200B Data Sheet, Rev. 1
Freescale Semiconductor 61
4 Package Description
4.1 Package Parameters
The MPC5200B uses a 27 mm x 27 mm TE-PBGA package. The package parameters are as provided in
the following list:
• Package outline: 27 mm x 27 mm
• Interconnects: 272
• Pitch: 1.27 mm
4.2 Mechanical Dimensions
Figure 50 provides the mechanical dimensions, top surface, side profile, and pinout for the MPC5200B,
272 TE-PBGA package.
MPC5200B Data Sheet, Rev. 1
Package Description
Freescale Semiconductor62
Figure 50. Mechanical Dimensions and Pinout Assignments for the MPC5200B, 272 TE-PBGA
CASE 1135A–01
ISSUE B
DATE 10/15/1997
CB
DIM MIN MAX
MILLIMETERS
A 2.05 2.65
A1 0.50 0.70
A2 0.50 0.70
A3 1.05 1.25
b 0.60 0.90
D 27.00 BSC
D1 24.13 REF
D2 23.30 24.70
E 27.00 BSC
E1 24.13 REF
E2 23.30 24.70
e 1.27 BSC
NOTES:
1. DIMENSIONS AND TOLERANCING PER ASME
Y14.5M, 1994.
2. DIMENSIONS IN MILLIMETERS.
3. DIMENSION IS MEASURED AT THE MAXIMUM
SOLDER BALL DIAMETER PARALLEL TO
PRIMARY DATUM A.
4. PRIMARY DATUM A AND THE SEATING PLANE
ARE DEFINED BY THE SPHERICAL CROWNS OF
THE SOLDER BALLS.
PIN A1
E2
D2
D
E
B
M
0.2
INDEX
C
0.2
4X
TOP VIEW
(D1)
A
(E1)
4X
e
19X
e
/2
19X
e
123 54 678910111213141516171819
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
20
V
W
Y
272X
b
3
CB
M
0.3
A
M
0.15
A
SIDE VIEW
0.35
A
A
0.2
A
272X
A
BOTTOM VIEW
A2
A1
A3
Package Description
MPC5200B Data Sheet, Rev. 1
Freescale Semiconductor 63
4.3 Pinout Listings
See details in the MPC5200B User Manual [1].
Table 52. MPC5200B Pinout Listing
Name Alias Type Power Supply
Output Driver
Type
Input
Type
Pull-up/
down
SDRAM
MEM_CAS
CAS I/O VDD_MEM_IO DRV16_MEM TTL
MEM_CLK_EN CLK_EN I/O VDD_MEM_IO DRV16_MEM TTL
MEM_CS I/O VDD_MEM_IO DRV16_MEM TTL
MEM_DQM[3:0] DQM I/O VDD_MEM_IO DRV16_MEM TTL
MEM_MA[12:0] MA I/O VDD_MEM_IO DRV16_MEM TTL
MEM_MBA[1:0] MBA I/O VDD_MEM_IO DRV16_MEM TTL
MEM_MDQS[3:0] MDQS I/O VDD_MEM_IO DRV16_MEM TTL
MEM_MDQ[31:0] MDQ I/O VDD_MEM_IO DRV16_MEM TTL
MEM_CLK I/O VDD_MEM_IO DRV16_MEM TTL
MEM_CLK
I/O VDD_MEM_IO DRV16_MEM TTL
MEM_RAS
RAS I/O VDD_MEM_IO DRV16_MEM TTL
MEM_WE
I/O VDD_MEM_IO DRV16_MEM TTL
PCI
EXT_AD[31:0] I/O VDD_IO PCI PCI
PCI_CBE_0
I/O VDD_IO PCI PCI
PCI_CBE_1
I/O VDD_IO PCI PCI
PCI_CBE_2
I/O VDD_IO PCI PCI
PCI_CBE_3
I/O VDD_IO PCI PCI
PCI_CLOCK I/O VDD_IO PCI PCI
PCI_DEVSEL
I/O VDD_IO PCI PCI
PCI_FRAME
I/O VDD_IO PCI PCI
PCI_GNT
I/O VDD_IO DRV8 TTL
PCI_IDSEL I/O VDD_IO DRV8 TTL
PCI_IRDY I/O VDD_IO PCI PCI
PCI_PAR I/O VDD_IO PCI PCI
PCI_PERR
I/O VDD_IO PCI PCI
PCI_REQ
I/O VDD_IO DRV8 TTL
PCI_RESET
I/O VDD_IO PCI PCI
PCI_SERR
I/O VDD_IO PCI PCI
PCI_STOP
I/O VDD_IO PCI PCI
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