FEATURES
3
2
4
51
NC V
CC
Y
A
GND
DCK PACKAGE
(TOP VIEW)
3
2
4
5
DBV PACKAGE
(TOP VIEW)
1
NC
A
GND
V
CC
Y
DESCRIPTION/ORDERING INFORMATION
SN74LVC1G17-EP
SGLS336A – APRIL 2006 – REVISED JUNE 2007
SINGLE SCHMITT-TRIGGER BUFFER
• ESD Protection Exceeds JESD 22
• Controlled Baseline – 2000-V Human-Body Model (A114-A)
– One Assembly/Test Site, One Fabrication – 200-V Machine Model (A115-A)
Site
– 1000-V Charged-Device Model (C101)
• Extended Temperature Performance of –55 ° C
(1)
Component qualification in accordance with JEDEC and
to 125 ° C industry standards to ensure reliable operation over an
extended temperature range. This includes, but is not limited
• Enhanced Diminishing Manufacturing Sources
to, Highly Accelerated Stress Test (HAST) or biased 85/85,
(DMS) Support
temperature cycle, autoclave or unbiased HAST,
electromigration, bond intermetallic life, and mold compound
• Qualification Pedigree
(1)
life. Such qualification testing should not be viewed as
justifying use of this component beyond specified
• Supports 5-V V
CC
Operation
performance and environmental limits.
• Max tpd of 4.6 ns at 3.3 V
• Low Power Consumption, 10 μ A Max I
CC
• ± 24 mA Output Drive at 3.3 V
• I
off
Supports Partial Power Down Mode
Operation
• Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
This single Schmitt-trigger buffer is designed for 1.65-V to 5.5-V V
CC
operation.
The SN74LVC1G17 contains one buffer and performs the Boolean function Y = A. The device functions as an
independent buffer, but because of Schmitt action, it may have different input threshold levels for positive-going
(V
T+
) and negative-going (V
T–
) signals.
NanoStar™ and NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the
die as the package.
This device is fully specified for partial-power-down applications using I
off
. The I
off
circuitry disables the outputs,
preventing damaging current backflow through the device when it is powered down.
ORDERING INFORMATION
(1)
T
A
PACKAGE
(2)
ORDERABLE PART NUMBER TOP-SIDE MARKING
SOT (SC-70) - DCK Reel of 3000 SN74LVC1G17MDCKREP C70
–55 ° C to 125 ° C
SOP (SOT-23) - DBV Reel of 3000 SN74LVC1G17MDBVREP C170
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
website at www.ti.com .
(2) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
FUNCTION TABLE
INPUT A OUTPUT Y
H H
L L
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
NanoStar, NanoFree are trademarks of Texas Instruments.
PRODUCTION DATA information is current as of publication date.
Copyright © 2006–2007, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
