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SN74HC132N

Part # SN74HC132N
Description QUAD 2-INPUT SCM/TRIG NAND
Category IC
Availability Out of Stock
Qty 0
Qty Price
1 + $0.10861

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Technical Document


DISCLAIMER: The information provided herein is solely for informational purposes. Customers must be aware of the suitability of this product for their application, and consider that variable factors such as Manufacturer, Product Category, Date Codes, Pictures and Descriptions may differ from available inventory.

 
  
  
SCLS034F − DECEMBER 1982 − REVISED NOVEMBER 2004
4
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
PARAMETER MEASUREMENT INFORMATION
VOLTAGE WAVEFORM
INPUT RISE AND FALL TIMES
50%50%
10%10%
90% 90%
V
CC
0 V
t
r
t
f
Input
VOLTAGE WAVEFORMS
PROPAGATION DELAY AND OUTPUT TRANSITION TIMES
50%
50%50%
10%10%
90% 90%
V
CC
V
OH
V
OL
0 V
t
r
t
f
Input
In-Phase
Output
50%
t
PLH
t
PHL
50% 50%
10% 10%
90%90%
V
OH
V
OL
t
r
t
f
t
PHL
t
PLH
Out-of-Phase
Output
Test
Point
From Output
Under Test
C
L
= 50 pF
(see Note A)
LOAD CIRCUIT
NOTES: A. C
L
includes probe and test-fixture capacitance.
B. Phase relationships between waveforms were chosen arbitrarily. All input pulses are supplied by generators having the following
characteristics: PRR ≤ 1 MHz, Z
O
= 50 Ω, t
r
= 6 ns, t
f
= 6 ns.
C. The outputs are measured one at a time, with one input transition per measurement.
D. t
PLH
and t
PHL
are the same as t
pd
.
Figure 1. Load Circuit and Voltage Waveforms
PACKAGING INFORMATION
Orderable Device Status
(1)
Package
Type
Package
Drawing
Pins Package
Qty
Eco Plan
(2)
Lead/Ball Finish MSL Peak Temp
(3)
5962-89845022A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type
5962-8984502CA ACTIVE CDIP J 14 1 TBD A42 SNPB N / A for Pkg Type
5962-8984502DA ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type
5962-8984502VCA ACTIVE CDIP J 14 1 TBD A42 SNPB N / A for Pkg Type
5962-8984502VDA ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type
SN54HC132J ACTIVE CDIP J 14 1 TBD A42 SNPB N / A for Pkg Type
SN74HC132D ACTIVE SOIC D 14 50 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN74HC132DBLE OBSOLETE SSOP DB 14 TBD Call TI Call TI
SN74HC132DBR ACTIVE SSOP DB 14 2000 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN74HC132DBRE4 ACTIVE SSOP DB 14 2000 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN74HC132DE4 ACTIVE SOIC D 14 50 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN74HC132DG4 ACTIVE SOIC D 14 50 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN74HC132DR ACTIVE SOIC D 14 2500 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN74HC132DRE4 ACTIVE SOIC D 14 2500 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN74HC132DRG4 ACTIVE SOIC D 14 2500 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN74HC132DT ACTIVE SOIC D 14 250 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN74HC132DTE4 ACTIVE SOIC D 14 250 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN74HC132N ACTIVE PDIP N 14 25 Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
SN74HC132NE4 ACTIVE PDIP N 14 25 Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
SN74HC132NSR ACTIVE SO NS 14 2000 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN74HC132NSRE4 ACTIVE SO NS 14 2000 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN74HC132PW ACTIVE TSSOP PW 14 90 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN74HC132PWE4 ACTIVE TSSOP PW 14 90 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN74HC132PWLE OBSOLETE TSSOP PW 14 TBD Call TI Call TI
SN74HC132PWR ACTIVE TSSOP PW 14 2000 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN74HC132PWRE4 ACTIVE TSSOP PW 14 2000 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN74HC132PWT ACTIVE TSSOP PW 14 250 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN74HC132PWTE4 ACTIVE TSSOP PW 14 250 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
PACKAGE OPTION ADDENDUM
www.ti.com
18-Jul-2006
Addendum-Page 1
Orderable Device Status
(1)
Package
Type
Package
Drawing
Pins Package
Qty
Eco Plan
(2)
Lead/Ball Finish MSL Peak Temp
(3)
SNJ54HC132FK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type
SNJ54HC132J ACTIVE CDIP J 14 1 TBD A42 SNPB N / A for Pkg Type
SNJ54HC132W ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type
SNV54HC132J ACTIVE CDIP J 14 TBD Call TI Call TI
SNV54HC132W ACTIVE CFP W 14 TBD Call TI Call TI
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
PACKAGE OPTION ADDENDUM
www.ti.com
18-Jul-2006
Addendum-Page 2
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